Netsu Bussei
Online ISSN : 1881-414X
Print ISSN : 0913-946X
ISSN-L : 0913-946X
Volume 20, Issue 4
Displaying 1-3 of 3 articles from this issue
paper
  • Junich Fujino, Tomohiro Honda
    2006 Volume 20 Issue 4 Pages 166-172
    Published: November 30, 2006
    Released on J-STAGE: July 28, 2008
    JOURNAL FREE ACCESS
    The present paper deals with the measurement of the specific heat capacity of plastic waste / fly ash recycled composite and its components using both a differential scanning calorimeter and sapphire discs as the reference material. The measurement is carried out at the temperature below the melting point of plastic component. The constant heating rates are set at 2.5 and 10 K·min-1. The specific heat capacity of the recycled composite for the heating rates 2 and 5 K·min-1 increases from 1.3 to 1.6 kJ·kg-1·K-1 with increasing the temperature from 305 to 360 K. And the deviation of the data is within±3%. But the data for 10 K·min-1 are about 2% lower than those for 2 K·min-1. The specific heat capacity is independent of the shape and mass of the recycled composite sample. The specific heat capacity of the fire retardant is equivalent to that of the fly ash. And the specific heat capacity of the recycled composite depends heavily on the content of the plastic waste.
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  • Daisuke Tomida, Satoshi Kenmochi, Takao Tsukada, Chiaki Yokoyama
    2006 Volume 20 Issue 4 Pages 173-178
    Published: November 30, 2006
    Released on J-STAGE: July 28, 2008
    JOURNAL FREE ACCESS
    Ionic liquids are salts that are liquid at room temperature. They draw much attention as new materials. In this study, a transient short-hot-wire apparatus was made and the thermal conductivity of 1-butyl-3 methylimidazolium tetrafluoroborate ([bmim][BF4]) was measured. The experimental temperatures were from 294 to 334 K and pressures were from 0.1 to 20 MPa. It was found that the thermal conductivity of ionic liquid has very small temperature and pressure dependence.
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  • Masakazu Komatsu, Seiji Yamada, Takayoshi Takano
    2006 Volume 20 Issue 4 Pages 179-185
    Published: November 30, 2006
    Released on J-STAGE: July 28, 2008
    JOURNAL FREE ACCESS
    In the present study, an integrated thin film and thin wire thermocouple was designed in order to gain an understanding of heat transfer mechanism under the baking process. The thin film thermocouple was made by depositing Cu-Ni on a base of polyimide sheet, and five hot junctions were arranged at the regular interval. Thermal electromotive force was proportional to the temperature difference between reference and hot junction. Moreover, heat transfer properties under the baking process that are equivalent to effective thermal conductivity which include latent heat transport accompanied by water vapor diffusion in addition to heat conduction are investigated using the integrated thin wire thermocouple. The effective thermal conductivity of crumb increased according to the latent heat transportation effect by water vapor diffusion, and that of crust was in agreement with the value of the effective thermal conductivity of the crust which was measured by steady state parallel plate method.
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