A transient calorimetric technique for measuring total hemispherical emissivities ε
TH of metals at low temperatures has been improved to be more accurate and to make time-interval of measurement shorter.
The accuracy of this technique mainly depends upon the heat loss through thermocouple leads Qt. To reduce Qt, an iron-constantan thermocouple of diameter about 20μm which suspends a specimen and measures its temperature, is used, and temperature distributions of the thermocouple leads are controlled by a guard heater attached to the other sides of the thermocouple leads.
Qt evaluated by heat conduction analysis taking account of radiative heat transfer from the leads is less than 8% of the total power loss of copper thin wire, and 2% for copper thin plate.
The total hemispherical emissivity ε
TH of an annealed copper thin wire which was mechanically polished was in good agreement with the extrapolated lines from the data reported by us [22-24] at high temperatures. The annealing process reduces the ε
TH of copper. This result may be explained from conditions of surface layer: damaged surface by mechanical polishing, recrystallization and growth of crystal grain due to annealing. Reduction of the ε
TH of annealed copper may improve the performance of vacuum insulation.
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