Author have been developed a novel polishing method using functional fluids which are dispersed abrasives with silicone oil. This fluid shows active reciprocate motion between electrodes under AC electric field at very low frequency. Then i have proposed new polishing method for glasses. And i have obtained easily method for polishing using the controlled water based slurry with abrasives under electric field.

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This study aims to clarify the interaction between Si wafer and individual abrasive grains in an atomic level. This paper reports on the proposal of the molecular dynamics simulation of Si wafer grinding with the control of the interatomic potential parameters to consider the mechano-chemical reaction between an abrasive and a Si wafer. Some comparisons between the diamond grinding and the mechano-chemical grinding were performed using the present model. As a result, reductions of surface damages, abrasive wears and scratching forces in the mechano-chemical grinding were confirmed as observed in the experiments.

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Recently, 3-D stack integration has been proposed, on which LSI is stacked Bump to Bump. In order to connect each LSI chip layer with mechanically and electrically, high accuracy planarization technologies which can make the flat surface on the metal bump and some kind of insulating polymer. In this study, the deformation process and temperature field on this cutting process are analytically studied and make its process visible by using the developed simulation system for the micro cutting process of alternatively arranged resin and metal with finite element method. In the metal-cutting section, the chip shape and machined surface generation were very similar to the formation of the exit burr, which led to the exit failure of the cutting tool.

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This report deals with a combination machining method of slicing with electro-chemical discharge machining. A wire saw was covered with tungsten carbide layer deposited by electrical discharge machining with a green compact electrode. A silica glass rod was used for a workpiece. The removal rate of the combination machining is larger than that of individual use of electro-chemical machining or slicing. Cracks were seldom observed on the bottom and side walls of the groove under a small cutting load.

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In order to correspond to cost reduction or the shortage of polycrystalline silicon, the demand of the ultra-thin slice is increasing to the silicon wafer for photovoltaic cells. At the slicing process of the silicon wafer, the wire saw is mainly used now. However, since a wire saw is the machining process which uses the abrasive grain, a damage layer arises on a surface of a silicon wafer, therefore, there is a limit in the ultra-thin slice of a silicon wafer. This study is investigating the possibility of slicing process of a silicon wafer with few damage layers by using the plasma etching which is non-contact processing. In this report, the effect which conditions, such as a plasma voltage, have on a slice speed etc. is described.

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To discuss the surface breaking strength of the white-coated paperboard during pushing cut, the variation of blade apex angle is analyzed by experiment and FEM simulation.

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It is well known that a sputtered metal film grows with inclined columns when the incident angle of sputtered particles to the substrate inclines. We have already shown that the novel structured film, such as zigzag and/or spiral columnar structure along with the growth direction, can be grown by changing the incident angle of sputtered particles during deposition. In this study, we will show that the periodic nano-pillars can be grown on the substrate having appropriate seeds.

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It is very important to evaluate mechanical properties of electrodeposition layers in technological interests. This report deals with an innovative method (:Compression Column Method) of measuring Young's modulus under large deformations of a flexible multi-layered specimen. Exact analytical solutions based on the nonlinear large deformation theory are derived in terms of elliptic integrals. By just measuring the applied load and a vertical displacement and/or a deflection angle, each Young's modulus can be easily obtained for thin and long multi-layered flexible materials. Measurements were carried out on a two-layered material (Cu: a copper electrodeposition layer and SWPA: a piano wire). The results confirm that the new method is suitable for flexible multi-layered thin rods.

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Minimally invasive surgery in orthopedic field is considered to be a challenging problem with a milling robot. One objective of this study is to minimize collision of the cutting tool with soft tissue. A redundant axis is implemented to avoid collision with the robot. Some important components are modeled based on physical requirements, and a geometric optimization approach based on the model is proposed to improve performance. A protective mechanism to cover the non-working part of the cutting edge is also proposed to avoid soft tissue damage. Hardware and software have been developed for this application and the effectiveness of this technique was evaluated with urethane bone.

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The grinding performance of the cBN wheels are affected by dressing conditions. Although the SF dressing method (The same speed function) with the ordinary grinding wheel usually is known as the good method on efficiency of truing performance, it might not become good occasionally on grinding performance on cBN wheel. Then new soft dressing wheels are produced as a dressing wheel used by the SF method, and are compared with the performance with ordinary dressing wheels. It became clear that the sharpness of a cBN wheel becomes excellent even since before as a result.

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To investigate the formation mechanism of finished surface in ultrahigh-speed grinding, micro cutting experiments using a model cBN grain cutting edge by means of a grinding machine tool equipped with an active magnetic bearing spindle have been conducted. Moreover, its FEM analysis have been carried out to clarify the effects of grinding speed on the finished surface. As a result, it is clarified that the depth of 0.2 % plastic strain at the finished surface decreases with increasing cutting speed. This leads to the improvement of the ground surface quality.

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In this study, to clarify the wheel wear characteristics in grinding process using vitrified cBN wheels, we have investigated the change in wheel wear behavior when the load that acts on the grain cutting edge is increased by increasing work speed. Especially, wear behavior of grain cutting edges in the grinding process is discussed on the basis of three-dimensional analysis using a multi-probe-SEM. These results show that wheel wear behavior in the grinding process may be classified into two main types whose wear characteristics of a grain cutting edge are difference.

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Pyrex glass is the widely used material for the optic element. Grinding is the general machining method for making pyrex glass optic element. Grinding method and grinding conditions are the main factors to affect the surface quality of the pyrex glass optic element. ELID grinding on the cylindrical surface and the plane of a pyrex glass lens was carried out. The experimental method and conditions was introduced in this paper.

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In this research, we trial to a ELID grinding for X-ray mirror. And I performed a trial to deal with High Spatial Frequency Roughness in VCAD data.

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In this study, the authors developed a free form surface grinding tool for the purpose of realizing the quality ground surfaces finish of die and mold by ELID grinding. The tool that had new mechanism was developed. The mechanism can create the rotational speed in the center of the rotational axis of the machine. The disk-shaped wheel with R-cross section can process the same path (form) by the boll-end mill. The rubber bond wheel was developed only to mirror surface finishing, and it applied to mold machining.

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Development of high quality MRF method of aspherical shape

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Carbon Fiber Reinforced Plastics (CFRP) are widely used for wing parts or tail structures of airplanes in the aviation industry because of their higher specific properties of strength-to-weight ratios. These structures contain many holes for various purposes such as bolt holes. In the near future, the CFRP parts of production cars are also applied in the automobile industry. The high quality drilling processes of CFRP are required for improved operational efficiency and industrial satisfaction. The drilling tools are remarkably worn by very short cutting length of CFRP drilling. In our research, the high efficiency drilling of CFRP plates by ball end mill are examined for the development of CFRP drilling technique. The high speed drilling by ball end mill is suitable for CFRP laminated plate. The high feed drilling, on the other hand, is inadequate for CFRP plates because of huge burrs and chippings on the drilled holes.

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