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Syunpei Takai, Shoichi Shimada, Masahiro Higuchi, Tomomi Yamaguchi, Na ...
Session ID: J64
Published: 2008
Released on J-STAGE: March 01, 2009
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Akinobu Koga, Mutsumi Touge, Yasushi Koito, Youki Toyofuku
Session ID: J66
Published: 2008
Released on J-STAGE: March 01, 2009
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Improvement of processing accuracy by applying pulse modulation plasma
Tetsuya Morikawa, Masaki Ueda, Kazuya Yamamura, Yuzo Mori, Masafumi Sh ...
Session ID: J67
Published: 2008
Released on J-STAGE: March 01, 2009
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Hiroyuki Takai, Kazuya Yamamura, Ryuji Maruyama, Dai Yamazaki, Kazuhik ...
Session ID: J68
Published: 2008
Released on J-STAGE: March 01, 2009
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Kazuaki Ueda, Kazuya Zettsu, Kazuya Yamamura, Shuji Maeo, Shoichi Shim ...
Session ID: J69
Published: 2008
Released on J-STAGE: March 01, 2009
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Yutaka Yamagata, Shin-ya Morita, Hirofumi Suzuki, Toshiro Higuchi, Tos ...
Session ID: J73
Published: 2008
Released on J-STAGE: March 01, 2009
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Hirofumi Suzuki, Daisuke Mukohata, Toshiroh Shibasaka, Toshimichi Mori ...
Session ID: J74
Published: 2008
Released on J-STAGE: March 01, 2009
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Hirofumi Suzuki, Shujiro Noguchi, Yoshio Hijikata, Yutaka Yamagata, To ...
Session ID: J75
Published: 2008
Released on J-STAGE: March 01, 2009
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Kiyomi Mori, Azimin Muhd, Kazuhiro Ookubo, Kensuke Kawarada
Session ID: J76
Published: 2008
Released on J-STAGE: March 01, 2009
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In this study, a silica-based inorganic polymer was combined with metal particulate to make new heat resistant composites. The ability of this composite was tested before it can be use for structural material in high temperature. In making this composite, an inorganic-based composite is filled with aluminum particles and/or the other metal particles. As we know, aluminum ability is light, good condition of electric and heat conduction. The aluminum particles fill the pores that appear after evaporation of the water in the matrix. The thermal expansion coefficient of the composite specimen was measured from room temperature to 600°C.
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Effect of tool rotation on cutting force
Yasutaka Matano, Suryadiwansa Harun, Toshiro Shibasaka
Session ID: J78
Published: 2008
Released on J-STAGE: March 01, 2009
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In this paper, in order to investigate the effect of tool rotation during the spinning machining process, experimental measurement of cutting force component was carried out. In this work, effects of tool rotation and direction on the cutting force component were examined. Experimental results showed that the resultant cutting force decreased with an increase in the tool rotational rate.
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Yukitatsu Kashimura, Hiroki Tomita
Session ID: J79
Published: 2008
Released on J-STAGE: March 01, 2009
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Dice are used to extract random numbers. However, unevenness in the extraction of random numbers is caused by the error of the shape and dimension of dice. In this study, dice without the aberration is made by milling. Geometrical method and statistical method are used to the evaluation of the produced dice and a plastic dice on the market. In a geometrical method, the probability is requested from spherical trigonometry. In a statistical method, the Chi square test based on the experiment result of produced dice is done and the probability of experiment result is good agreement with the theoretical value. By comparison of dice, it is found that the produced dice has better fairness than the plastic dice on the market at probability.
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Discussion on removal rate on the basis of numerical analysis of powder particle behavior
Masahiko Kanaoka, Hideo Takino, Kazushi Nomura, Hidekazu Mimura, Kazut ...
Session ID: J80
Published: 2008
Released on J-STAGE: March 01, 2009
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Extreme ultraviolet (EUV) lithography has being developed as a promising fabrication technology suitable for printing features with design scales of smaller than 40 nm. The optical elements used in this system require high surface accuracy of 0.1 nm rms. Moreover, substrates of the elements must be low-thermal-expansion materials because EUV light is easily absorbed in matter, accordingly converted to heat. In previous studies, we demonstrated elastic emission machining (EEM) which is well known as a non-contact machining using a fluid mixture of pure water and powder particles has sufficient figuring and smoothing capability for the fabrication of EUV optics. Following these examinations, optimum processing conditions of EEM were investigated. The relationship between the removal rate and the concentration of powder particles in the fluid mixture was tested. As a result, the removal rate was not found to be proportional to the concentration. In this study, this fact is analyzed and its cause is discussed from the viewpoint of the particle behavior. Particle behavior at the EEM processing point is evaluated using the state of the fluid flow calculated by elasthydrodynamic lubrication theory. Accordingly, the relationship between the removal rate and the particle behavior was indicated.
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Tianfeng Zhou, Jiwang Yan, Jun Masuda, Tsunemoto Kuriyagawa
Session ID: J81
Published: 2008
Released on J-STAGE: March 01, 2009
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Glass molding press (GMP) process has emerged as a promising technology to fabricate aspherical glass lens in mass production. The quality of the molded glass lens mainly depends on the transferability of GMP process. In this paper, temperature rise during heating and material flow during the deformation of the glass ball in GMP process were simulated by the finite element method (FEM), and the stress and strain distributions were illustrated. With that, the deformation of the molds was calculated and the countermeasures to prolong the service life of the molds are proposed.
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Zhiyu Zhang, Jiwang Yan, Tsunemoto Kuriyagawa
Session ID: J82
Published: 2008
Released on J-STAGE: March 01, 2009
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Reaction-bonded silicon carbide (RB-SiC) is a recently developed ceramic material with many merits such as low manufacturing temperature, dense structure, high purity and low cost. In the present paper, the precision machinability of RB-SiC was studied by microindentation and single-point diamond turning (SPDT) tests. The influence of depth of cut and tool feed rate on surface roughness and cutting force was investigated. Results showed that there was no clear ductile-brittle transition in machining behavior. The material removal mechanism involves falling of the SiC grains and intergranular microfractures of the bonding silicon, which prevents from large-scale cleavage fractures. The minimum surface roughness depends on the initial material microstructure in terms of sizes of the SiC grains and micro pores. This work preliminarily indicates that SPDT can be used as a high-efficiency machining process for RB-SiC.
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Takashi Hyakushima, Mizuhisa Nihei, Yuji Awano
Session ID: K01
Published: 2008
Released on J-STAGE: March 01, 2009
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Hideyuki Tachika, Yasuhiro Takaya, Terutake Hayashi
Session ID: K03
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Hirotoshi Takagi, Yoshio Okimoto, Satoshi Mihara
Session ID: K04
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Ultraviolet Light Effect in Deionized Water
Panart Khajornrungruang, Keiichi Kimura, Nobutaka Sumomogi, Chikara Mo ...
Session ID: K05
Published: 2008
Released on J-STAGE: March 01, 2009
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Research of transformation mechanism of the surface shape for silicon polishing pad
KAZUNORI ITO, Naoko Kawai, Shin-ichi Haba, Hiroshi Makino, Koichi Emi
Session ID: K07
Published: 2008
Released on J-STAGE: March 01, 2009
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New technique has been reported to evaluate surface condition of CMP polishing pad circumstantially that calculate thickness distribution from roughness carve. On this first research, we applied the technique and tried to resolve mechanism of reduction of removal rate. It was found that the glazing phenomena on the pad surface mainly related with the transformation of surface shape, but its mechanism has not been cleared yet. On this research, the mechanism of pad shape variation was investigated to focus the relationship with pressure, friction and viscoelasticity between pad and wafer.
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Kazuki Ueno, Keiichi Kimura, Panart Khajornrungruang, Yuto Koi, Nagisa ...
Session ID: K08
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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-Comparision between Stacked Pad and Solo Pad-
Akira Fukuda, Tetsuo Fukuda, Hirokuni Hiyama, Manabu Tsujimura, Toshir ...
Session ID: K09
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Fabrication of Micro Pyramid Pattern Pad
Naoaki Takahashi, Keiichi Kimura, Panart Khajornrungruan, Keisuke Yasu ...
Session ID: K10
Published: 2008
Released on J-STAGE: March 01, 2009
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Unkai Sato, Atsushi Ito, Sumio Utsunomiya
Session ID: K11
Published: 2008
Released on J-STAGE: March 01, 2009
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It applies the LTPS (Low Temperature Polycrystal-Silicon) film to the semiconductor-layer of the LCD panel, and ridges occur to the film surface of grain boundary with the manufacturing process. Also, because the film is thin, in the general way of polishing, it isn't possible to polish. We could remove ridges with suppressing the polish rate, using the difference of the etching operation of electrolytically reduced water to the silicon and the oxide silicon. We got the suggestion that is possible to polish the LTPS film using electrolytically reduced water.
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Shoichiro Yasunami
Session ID: K14
Published: 2008
Released on J-STAGE: March 01, 2009
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Michio Uneda, Kenji Okabe, Norihiko Moriya, Takumi Kobayashi, Kazukata ...
Session ID: K16
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Yuuichi Hashiyama, Keiichi Kimura, Panart Khajornrungruang
Session ID: K17
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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This study is focused on the material removal mechanism in chemical mechanical polishing (CMP) process. The material removal phenomena in CMP process has not been clarified yet. In this study, the interaction among wafer surface, polishing pad surface and fine particles in slurry was observed with AFM and material removal mechanism was investigated. Especially in this paper, we researched about the interaction between the oxide wafer surface and fine particles. The property of SiO2 film in solution and adhesive removal phenomena with a fine particle were investigated with AFM indentation. We propose novel materials removal model based on these experiments.
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Construction of A Method for Dynamic Structural Analysis -
Yohei Hashimoto, Norikazu Suzuki, Eiji Shamoto
Session ID: K18
Published: 2008
Released on J-STAGE: March 01, 2009
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Yuya Suzuki, Junichi Ikeno, Masaki Nakayama, Hideaki Makino
Session ID: K20
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Yoshio Mitani, Takanori Teshima
Session ID: K21
Published: 2008
Released on J-STAGE: March 01, 2009
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Toru Yoshida, Mutsumi Touge, Junji Watanabe, Syouhei Hayashikawa
Session ID: K22
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Shigeyuki Sawayama, Takuya Oka, Tomonori Shimakita, Tomoaki Matsushima ...
Session ID: K23
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Junichi Nagase, Junichi Ikeno, Masaki Nakayama, Hideaki Makino
Session ID: K24
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Masaharu Takahashi
Session ID: K31
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Shin Kaguchi, Hayato Komatsu, Hiroyuki Abe, Yoichi Watanabe, Masafumi ...
Session ID: K33
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Most MEMS devices are ordinary produced with packaging case to avoid contamination. There is one of means to achieve the wafer level packaging that a glass wafer with several cavities is bonded to a wafer on which devices are fabricated. In this study, we examine imprinting of box type cavities to a glass wafer, using RS-SiC mold with grinded block pattern.
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Shin Kaguchi, Yoshifumi Saito, Hayato Komatsu, Hiroyuki Abe, Masafumi ...
Session ID: K34
Published: 2008
Released on J-STAGE: March 01, 2009
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Many commercialized electronics equipments like digital cameras and mobile phones, have been mounted plastic lenses yet, although glass lenses have superior optical specification to plastic ones, because glass lenses are more expensive than plastic ones. In this study, we examine imprinting of glass lens, using RS-SiC mold to achieve down the production cost of glass lens.
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Takahiro Ohashi, Masakazu Kobayashi
Session ID: K36
Published: 2008
Released on J-STAGE: March 01, 2009
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The authors report development of diaphragm type hot embossing equipment and evaluate the forming results of micro-imprint on the polycarbonate plate in this paper. Authors investigate and discuss influent of misalignment angle of die between 0 and 2.86 degree with experiments.
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Munehisa Inokuchi, Yasuyoshi Sakamoto, Takeyuki Abe, Noriyoshi Akase, ...
Session ID: K37
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Daisuke Chino, Eiji Higurashi, Tadatomo Suga, Renshi Sawada
Session ID: K38
Published: 2008
Released on J-STAGE: March 01, 2009
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The hybrid integration of multiple chips in three dimensions permits highly functional and compact optoelectronic microsystems. However, the chips tend to be thermally damaged during the several repeated high-temperature bonding steps in a conventional method using AuSn solder. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150 -C). The size of the fully integrated microsystem is only 2.6 mm ~ 2.6 mm ~ 1 mm thick. The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, it was applied to laser Doppler velocimeter sensor. The measured Doppler beat signal frequency was found to be very close to the theoretical prediction.
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Wataru Iwasaki, Ryo Seto, Yoshinori Kimura, Atsushi Onoe, Eiji Higuras ...
Session ID: K39
Published: 2008
Released on J-STAGE: March 01, 2009
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Minoru Kubo, Akihiro Hayashi, Shinya Haramaki, Toshifumi Satake
Session ID: K43
Published: 2008
Released on J-STAGE: March 01, 2009
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The dynamic behaviors of redundant manipulators are simulated by applying decentralized motion control schema to manipulation problems. The schema models a motion control system as a set of simple mass control sub-systems to take control of each joint. Sub-systems that are a sort of an agent exchange the information of joint motion each other to control joint corresponding to its-self. The motion of manipulator is tailored by the independent action of sub-systems to be done with information exchange. Phase plane analysis is conceived as a simple method for realizing the mass control of each joint and it is applied for decentralized manipulator position control system base on the modeling. Numerical simulations are executed for investigating the feasibilities and the influences of the decentralized mass control base on phase plane analysis. Various ways and views are obtained to reflect correlation among sub-systems to the control decision.
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Acquisition of the Underwater Behavior Control
Keita Nakamura, Ikuo Suzuki, Masahito Yamamoto, Masashi Furukawa
Session ID: K44
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Acquisition of the Flying Behavior
Makoto Morinaga, Ikuo Suzuki, Masahito Yamamoto, Masashi Furukawa
Session ID: K45
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Behavior control for flexible structure model
Keisuke Yoneda, Kenji Iwadate, Ikuo Suzuki, Masahito Yamamoto, Masashi ...
Session ID: K46
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Kenji Iwadate, Keisuke Yoneda, Ikuo Suzuki, Masahito Yamamoto, Masashi ...
Session ID: K47
Published: 2008
Released on J-STAGE: March 01, 2009
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Meeting due-dates and minimizing setup time with consideration to lot splitting
Ryousuke Umehara, Toru Eguchi
Session ID: L01
Published: 2008
Released on J-STAGE: March 01, 2009
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Toshiya Kaihara, Nobutada Fujii, Shohei Tsuji, Susumu Fujii, Masashi K ...
Session ID: L02
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Keiichi Houzumi, Shigeki Fujinaga
Session ID: L03
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Ryosuke Kataoka, Rei Hino
Session ID: L04
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Rei Hino, Takao Hosoi, Masayoshi Yoshida
Session ID: L06
Published: 2008
Released on J-STAGE: March 01, 2009
CONFERENCE PROCEEDINGS
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Keiji Ogawa, Toshiki Hirogaki, Eiichi Aoyama, Tetsurou Yoneda
Session ID: L07
Published: 2008
Released on J-STAGE: March 01, 2009
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We propose an autonomous, distributed and cooperative conveyance system for an Automated Guided Vehicle (AGV) applied with knowledge of a flexible taxi traveling in traffic engineering. In the present report, a flow path model of the AGV is investigated in order to verify the effect of the proposed system. We consider the position of other AGVs in order to efficiently control multiple AGVs. As a result, it is demonstrated that the mixture of crawler, radio type and waiting taxi traveling is effective for reducing the waiting time between manufacturing products and AGV arrival.
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