In recent years, machining center has been used widely in metal mold manufacturing process because high speed machining by using a small diameter end-mill has been put into practical use. However, in cutting process with an end mill that is a low rigidity, it is very important to estimate the machining error caused by deflection of tool. The purpose of this study is to establish a method of in real time estimating machining errors caused by deflection of end-mill at a cutting point. For this purpose, in this research, the growth mechanism of machining errors in ball end-milling was investigated by comparing measured deflection of tool and cutting forces with machining errors.

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Monitoring and measuring technique are important during cutting for high-quality manufacturing. The small diameter tool is used for precision and minute cutting on high speed milling. The tool breaking during cutting with a small-diameter end mill is still problematic in the field of production. This study presents a monitoring technique for the in-process measurement of cutting force and the prediction of tool breakage by use of high-speed CCD camera. The system to monitor the tool behavior from the X axial and Y axial is constructed with two CCD cameras. The tool behavior was measured with this monitoring system during cutting.

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Silicon on insulator (SOI) wafers are promising semiconductor material for high speed LSIs and low power consumption electric devices. However, thickness distribution of the SOI causes characteristic variation of the electronic device manufactured in the SOI wafer. We proposed numerically controlled local wet etching (NC-LWE) as a novel finishing method for improving thickness distribution of the SOI. In this paper, we report the result of NC machining.

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This study is on the influence of electrolytic water dilute NaCl on the surface of Fe-42mass%Ni alloy (it is abbreviated to alloy 42 hereafter). First, we clarified the etching characteristic of electrolytic water oxide and electrolytically-reduced water against alloy 42 by immersing experiment. Next, we clarified two things by analyzing the surface of test pieces. One is that both electrolytically-reduced water and electrolytic water oxide are able to improve the cleanliness of the surface alloy 42. The other is that film layer oxide can become thick by being immersed into electrolytic water oxide.

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We have developed high-efficiency sterilization process at lower-temperature by utilizing atmospheric pressure mist plasma. Our developed sterilization apparatus could be operated at atmospheric pressure without any toxic agent. In this report, for sterilizing Bacillius atrophaeus, we investigated the cause of which the D value of the survival curve varied depending on plasma exposure time. As a result, it was found that the cause of D value variance is due to the acquired characteristics difference among bacterias.

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Atmospheric-pressure plasma chemical vapor deposition (AP-PCVD) method is a low-temperature and high-rate film formation technology in which atmospheric-pressure plasma excited by a 150 MHz very high-frequency power is effectively used to generate high-density radicals. Using a rotary electrode, silicon nitride (SiN_x) films have been prepared from He/H₂/NH₃/SiH₄ mixtures on Si(001) wafers with very high rates (>100 nm/min) at substrate temperatures lower than 300 μ. By optimizing the NH₃/SiH₄ ratio and H2 concentration, good-quality SiNx films showing BHF (buffered hydrofluoric acid) etching rates smaller than 30 nm/min have been obtained.

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We have developed atmospheric-pressure plasma enhanced chemical transport (APECT) to form a thin film without source gases. In this report, we attempt to control of the poly-Si film structure by diluting the process atmosphere with noble gases for improving the property of the Si film. As a result, the grain size and its morphology could be changed remarkably and dangling bonds density could be reduced by diluting process atmosphere with He gas.

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We have developed a coating technology using electrical discharge pulses. This technology forms the layers in the following process. The electrode material melts by the electrical discharge energy, it moves to the workpiece, coagulates again on the surface of the workpiece. In this report, we have developed a Fe alloy layer, and report on the coating technology of Fe alloy material.

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We have investigated the effects of Cu composition on the shape memory behavior of sputtered Ti-Ni-Cu ternary alloy films. It was confirmed from DSC measurements that Ti-Ni-Cu thin films containing less than 10at.%Cu show two stage transformation of A->O->M, whereas films containing more than 10at.%Cu show one stage transformation of A->O. As Cu composition in the films increased, transformation temperature increased slightly. On the other hand, the temperature hysteresis for the films containing more than 6at%Cu drastically decreased to one-third of those of Ti-Ni binary alloy films. The critical stress against plastic deformation increased with increasing Cu composition in the films.

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The electrical characteristics and the crystallinity of aluminum nitride (AlN) films deposited by electron cyclotron resonance (ECR) sputtering for surface acoustic wave devices have been estimated. In ECR sputtering, a metal target (Al) was used. The optimization of the AlN films deposition process was carried out by the combination of process gases (Ar/Xe, N₂) for high resistivity, high dielectric constant and high crystallinity. We have been measured the electrical properties of deposited AlN thin films using metal-insulator-metal structure. The crystallinity of AlN thin films was measured by X-ray diffraction. In spite of low temperature deposition without external substrate heating, the AlN thin films with high quality have been obtained.

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The electrical characteristics of oxy-nitride films deposited by electron cyclotron resonance (ECR) sputtering for FETs have been estimated. The optimization of the deposition process by the combination of metal targets (Si, Al, Ta) and process gases (Ar/Xe, O₂, N₂) has been done for high resistivity and high dielectric constant of deposited thin films which were SiON, AlON and TaON. Measurement of electrical characteristics of deposited oxy-nitride thin films by ECR sputtering was carried out using metal-insulator-metal capacitor and metal-insulator-semiconductor capacitor. In spite of low temperature deposition without external substrate heating, dielectric films with high resistivity and high dielectric constant have been formed.

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We discussed about the effect of microorganisms on stability of recycle water-soluble coolant

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The purpose of this study is to finish the die with groove produced by wire cut electric discharge machining. Though effectiveness of magnetic polishing for the non-magnetic workpiece represented for stainless steel has been clarified, in the other it has been indicated to be difficult on plane magnetic polishing for the magnetic workpiece. In magnetic field assisted machining for the magnetic material, ferromagnetic particle in tip of the particle brush has adsorbed to the workpiece surface, and there is a problem that sufficient relative motion for the polishing is not obtained. It is necessary to solve this problem in order to apply magnetic filed assisted machining for the polishing of the magnetic material workpiece. In this study, the die finishing was tried using magnetic field assisted machining with the workpiece vibration system which gave only reciprocating motion in the groove direction. By using this method, the sufficient relative motion for the workpiece is obtained in the tip of particle brush, and the polishing of the magnetic material becomes possible. Then, finishing characteristics of the magnetic material workpiece with groove was examined experimentally.

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Semiconductor interconnection technology is improving ,so electronic device is downsizing . We study the present and future of semiconductor interconnection technology.

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The way of mechanical drawing has changed from hand-writing to CAD. Considering the skill tradition, I would like to suggest what skill will be required for the future from the educational point of view.

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Posture and a student of this university dealing with a 'Project' subject of production problem that a machine series student of the other university was given to as 'MONODUKURI' review posture to deal with 'MONODUKURI' in a 'Workshop' subject while comparing the difference from the viewpoint of creation power, intellectual power, acting power and executive ability.

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Human workers and robots cooperative cell production system, human workers should devote to high value-added works that only human workers can do, incidental works should be done by robots. Generally, assembly tasks can be done by only human workers and easily cause human mental strain. In this study, human workers were required to execute assembly tasks and their vital signs were detected to evaluate biomechanism.

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