Non-cleaning method is the most preferable among the CFCs alternative methods from the environmental and the cost performance points of view.
In performing non-cleaning method, non-cleaning flux are used because they are supposed to feature high insulation reliability without after soldering cleaning process.
However, even non-cleaning flux might effect on the insulation reliability, and it is thought that the metal ions released from electrode metal by the remaining flux activators (organic acids) are the main cause of the insulation error.
In this study, the effects of some chelating organic acids on the insulation reliability was examined, assuming that the insulation reliability was expected to be improved by utilizing organic acids as flux activators which can trap the released metal ions and form metal complexes with them.
In the evaluation of dicarboxyl acids, succinic acid-applied printed circuit board kept insulation reliability on Cu electrode, on which metal complex (succinic acid copper salt) was created by the reaction of succinic acid and CuO. On the other hand, succinic acid caused insulation error on soldering metal (Sn/Pb) electrode, on which metal complexes were not formed due to poor chelating ability of succinic acid against typical metals (Sn and Pb) compared with transition metal (Cu). It suggested that organic acids for highly reliable non-cleaning flux need to have high chelating ability against Sn and Pb as well as Cu.
In the case of aminocarboxyl acids, anthranilic acid was found to keep insulation reliability on Cu electrode as well as Sn/Pb electrode because anthranilic acid formed metal complexes on both Cu electrode and Sn/Pb electrode. Iminodiacetic acid, however, brought about insulation error on both electrodes despite metal complexes were formed on each electrode. From the fact that iminodiacetic acid salts are dissoluble in water while anthranilic acid ones are not, it was thought that iminodiacetic acid turned to ionic compounds by absorbing water and caused migration reaction.
Consequently, the organic acids which create water-insoluble metal complexes with Cu and soldering metals are found to keep insulation reliability.
Therefore it was cleared that high reliable non-cleaning flux can be developed by prescribed organic acids and their solvents.
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