In this study, the crack suppression mechanism in the thin-ply laminate was discussed by the mesoscopic finite element analysis. The intraply crack extension in the thin ply 90° layer, which has the thickness from 40 to 150 μm, was simulated with the cohesive element. In addition, the effect of initial defect on the crack extension behavior was also discussed. The crack extension behavior showed good agreement with the experimental results in any ply thickness for 6 J/m
2 was applied to the cohesive energy. The crack initiation strain was not influenced by the existence of the initial defect up to 10 μm length. However the crack initiation strain was not influenced by the ply thickness, the crack penetration strain tended to increase with decrease of ply thickness.
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