The pure and dense Ti
3SiC
2 material was tried to fabricate by two different approaches; HIP sintering of the SHS-derived Ti
3SiC
2 powders, and the reactive-HIP sintering of the mixed powders of Ti, SiC, and C. The product with the highest content of Ti
3SiC
2 consisted of 97.3vol% Ti
3SiC
2 and the remaining TiCx. This material was obtained by the reactive-HIP, carried out at 1500°C, 40MPa for 30min. The density was 99% of theoretical. The Ti
3SiC
2 grains had columnar and plate-like shapes, which included many stacking faults along the (001) plane. The Vickers hardness, Young's modulus, fracture toughness, and flexural strength were 4GPa, 283GPa, 11.2MPa √m, 410MPa, respectively. These mechanical properties are considered to be almost the intrinsic property of the bulk Ti
3SiC
2. The severe oxidation of the Ti
3SiC
2 started at about 1100°C. The electrical resistivity was 1.77×10
-6Ωm at room temperature. It increased with increasing temperature, but showed the discontinuous change at around 1030-1040K. The Seebeck coefficient was 4-20μV/K in the range from 300K to 1200K. This small positive value suggests that the Ti
3SiC
2 is a semimetal with hole carriers.
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