Journal of The Surface Finishing Society of Japan

Technological Importance of Surface Control Science from Manufacturing Viewpoint

Atsuyoshi KOIKE

1994 Volume 45 Issue 1 Pages 2-5
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.2

JOURNAL FREE ACCESS

Download PDF (876K)
Analysis of Metallic Contamination on a Wafer

Tsuneo AJIOKA

1994 Volume 45 Issue 1 Pages 6-11
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.6

JOURNAL FREE ACCESS

Download PDF (666K)
Silicon Native Oxide

Takeo HATTORI

1994 Volume 45 Issue 1 Pages 12-16
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.12

JOURNAL FREE ACCESS

Download PDF (561K)
Roughness Evaluation of Silicon Surfaces by Scanning Force Microscopy

Mineharu SUZUKI

1994 Volume 45 Issue 1 Pages 17-21
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.17

JOURNAL FREE ACCESS

Download PDF (2658K)
Clean Surface Structures of Si Crystal

Kunio TAKAYANAGI

1994 Volume 45 Issue 1 Pages 22-25
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.22

JOURNAL FREE ACCESS

Download PDF (1122K)
Cr₂O₃ and NiF₂ Passivation Technology of Metal Surface

Tadahiro OHMI

1994 Volume 45 Issue 1 Pages 26-31
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.26

JOURNAL FREE ACCESS

Download PDF (1133K)
High Purification of Chemicals

Tsutomu YONEZAWA

1994 Volume 45 Issue 1 Pages 32-37
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.32

JOURNAL FREE ACCESS

Download PDF (828K)
High Purification of Semiconductor Gas

Takuya Ikeda

1994 Volume 45 Issue 1 Pages 38-42
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.38

JOURNAL FREE ACCESS

Download PDF (1687K)
[title in Japanese]

[in Japanese]

1994 Volume 45 Issue 1 Pages 43
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.43

JOURNAL FREE ACCESS

Download PDF (83K)
In Situ Observation Method for Tunnel Etching of Aluminum

Eiji MAKINO, Takayuki SHIBATA, Masayuki IKEDA, Eiichi SUGANUMA

1994 Volume 45 Issue 1 Pages 44-48
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.44

JOURNAL FREE ACCESS

Download PDF (1854K)
An Increasing Function of the Pre-Coated-Metal Sheets

Hiroki KAWAI

1994 Volume 45 Issue 1 Pages 49-54
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.49

JOURNAL FREE ACCESS

Download PDF (1317K)
Formation of Colored Films on Titanium Plates by Laser Irradiation

Hideaki SOHMA, Toshiaki TANAKA, Kohsuke TAGASHIRA, Sakae YAMAGUCHI, To ...

1994 Volume 45 Issue 1 Pages 67-72
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.67

JOURNAL FREE ACCESS

Show abstractHide abstract

Titanium oxide films, which may be of various colors due to interference, can be formed on titanium plate surfaces by CO₂ laser irradiation under controlled oxygen content in the atmosphere.
The irradiated surface shows some irreguralities due to rapid melting and solidification, but it is harder than and thus superior to anodic oxide coatings on titanium in terms of wear resistance.
Just beneath the titanium oxide film is a hard fine-grained structure layer, which contains soluble oxygen.

View full abstract

Download PDF (2671K)
Electroless Ni Deposition on the Porous Structure of Anodic Alumina

Hideki MASUDA, Tooru NISHIZAWA, Nobuyoshi BABA

1994 Volume 45 Issue 1 Pages 73-77
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.73

JOURNAL FREE ACCESS

Show abstractHide abstract

Electroless deposition of Ni on the porous structure of anodic alumina formed in an oxalic acid solution was studied. Treatment by the application of Pd catalyst to the porous anodic alumina films, followed by a brief dipping in a Ni electroless plating solution, resulted in the deposition of Ni into the micropores of the anodic alumina films. The Ni deposit formed a fibrous structure which contained 5wt% P. The dependence of the depth of the deposition of Ni into tho micropores upon certain parameters, including the geometrical shape of the micropores, the concentration of the catalyzing solution and the duration of the treatment, was examined through SEM observation of the samples. Ni deposition into the inner part of the microporous structure took place at high concentrations of the catalyzing solution. It was confirmed that Ni could be deposited into micropores of 1000Å diameter to a depth of 5μm under optimum conditions. The mechanism of Ni electroless deposition into the micropores of anodic alumina was discussed based on the results obtained through SEM observation.

View full abstract

Download PDF (1912K)
Effect of Copper Strike Plating on Adhesion of Interface between Silver and Nickel Plating after Thermal Treatment

Akira CHINDA, Osamu YOSHIOKA

1994 Volume 45 Issue 1 Pages 78-81
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.78

JOURNAL FREE ACCESS

Show abstractHide abstract

The leadframes for power transistors are generally of copper alloy strip plated with nickel and silver, and copper strike plating is usually applied to the nickel surface to improve the adhesion of the silver on nickel after thermal treatment.
Accordingly, the mechanism by which copper strike plating increased interface adhesion was investigated by Auger electron spectroscopy.
The results can be summarized as follows:
(1) The poor adhesion of silver plating on nickel after thermal treatment in air was due to the penetration of oxygen into the silver layer and to the oxidation of the nickel surface.
(2) The copper in the strike plated layer diffused into the silver plating after thermal treatment above a certain temperature. The diffused copper fixed the permeated oxygen at a position close to the silver surface, thereby inhibiting the oxidation of the nickel surface and improving the adhesion of the silver.
(3) The copper in the strike plated layer also diffused into the nickel plating after thermal treatment, and the diffused copper is thought to act as an adhesive between the silver and nickel layers.

View full abstract

Download PDF (489K)
Effects of Boric Acid and Plating Bath pH on the Preferred Crystal Orientation and Internal Strain in Electrically Deposited Nickel Films

Yutaka TSURU, Hiroyuki IMOTO, Ryouta TAKAMATSU, Kunisuke HOSOKAWA

1994 Volume 45 Issue 1 Pages 82-87
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.82

JOURNAL FREE ACCESS

Show abstractHide abstract

The effects of boric acid and plating bath pH on the average internal strain in electrically deposited nickel films were investigated by an electric resistance wire type strain gauge setup on the reverse side of a copper substrate having a preferred crystal orientation of (200), and the relation between the average internal strain and the preferred crystal orientation of the nickel film was also discussed.
It was found that: (1) The internal strain in the nickel films rose rapidly with increasing bath pH near the electrode during hydrogen codeposition. (2) The addition of boric acid to the bath inhibited the hydrogen evolution reaction during nickel deposition, resulting in suppression of the rise in the internal strain in the nickel film. (3) The internal strain in nickel films deposited on the copper substrate rose in the order of (200)<(220)<(111)<disordered in terms of the preferred orientation relative to the ASTM standard for nickel powder. The brightness of the deposits also showed the same dependence on preferred orientation as did internal strain.

View full abstract

Download PDF (1083K)
Technique for Electroplating of Metallic Chromium on Partially Tin-Coated Steel Sheet

Jun-ichi MORITA, Mitsuo YOSHIDA

1994 Volume 45 Issue 1 Pages 88-92
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.88

JOURNAL FREE ACCESS

Show abstractHide abstract

In the commercial production of striped, partially Sn pre-coated TFS-CT (Tin Free Steel-Chromium Type), it is very important to control the amount of metallic Cr deposited on the tin and bare Fe. On the basis of the fundamentally electrochemical behavior of Sn and Fe in a Cr plating bath, a technique for controlling the amount of metallic Cr on a continuous plating line is disclosed.
The following results were obtained;
1) It was possible to achieve control of the coating amount of metallic Cr on Sn and Fe on an industrial scale using a method involving low current density at the front plating cells and high current density at the rear cells.
2) If the reductive removal of Sn-oxide film grown by aging after Sn preplating is incomplete, Cr coverage becomes insufficient and a brownish discoloration of Sn occurs. This may be avoided by applying a cathodic dichromate treatment after Sn plating, and by adjusting the Cr plating current density.

View full abstract

Download PDF (1164K)
Development of Low-Temperature Curable Paint for the Back Side of Polyvinylchloride Coated Steel Sheets

Yoshio HAYASHI, Tetsuo NAKAMOTO, Kazuyuki KOIKE, Katsumi KANDA

1994 Volume 45 Issue 1 Pages 93-97
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.93

JOURNAL FREE ACCESS

Show abstractHide abstract

A study was conducted on epoxy urethane paint which is used as the back-side coating of steel sheet coated with polyvinylchloride (PVC) by film lamination method. The addition of melamine to the paint was effective in lowering the curing temperature, but it reduced plasticizer migration resistance and adhesion to the epoxy adhesive. Using oxime as the blocking agent for the isocyanate group and increasing the molecular weight of the epoxy urethane made it possible to lower the curing temperature to 180°C, and resulted in superior properties as back-side coating for PVC coated steel sheet.

View full abstract

Download PDF (627K)
Corrosion of Au-Ag Alloys in NaHS and Na₂S Solutions

Masataka NAKATA, Masato OSAWA, Naotatsu SHIKAZONO, Hisahide HONMA, Nor ...

1994 Volume 45 Issue 1 Pages 98-102
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.98

JOURNAL FREE ACCESS

Show abstractHide abstract

Corrosion experiments on Au, Ag and Au-Ag alloys of various composition in 1mol/L solutions of NaHS and Na₂S have been carried out at 150°C over 120 days. Ag₂S was formed in NaHS solutions on Au₂₅Ag₇₅, Au₁₀Ag₉₀ and Ag₁₀₀ (pure silver) and in Na₂S solutions on Au₅₀Ag₅₀, Au₂₅Ag₇₅, Au₁₀Ag₉₀ and Ag₁₀₀, but its morphology differed: The Ag₂S formed in the NaHS solutions was platy, while that formed in the Na₂S solutions was mostly whisker-like. It is thought that Ag₂S morphology was controlled by HS^- and S^2- concentrations in the solutions and by the rate of sulfidation. The remarkably developed Ag₂S scale seen on Ag₁₀₀ was found to consist of an outer layer formed by the outward diffusion of Ag⁺ and an inner layer formed by the inward diffusion of S^2-.

View full abstract

Download PDF (1565K)
A Comparison of Fracture Toughness in Cemented Carbide Coated with TiN or TiC by PVD

Toru ITO, Akira HIDA

1994 Volume 45 Issue 1 Pages 103-105
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.103

JOURNAL FREE ACCESS

Show abstractHide abstract

The fracture toughness K_IC of cemented carbide (WC-Co) coated with TiN or TiC by PVD was measured by the Vickers hardness indentation method. It was found that the fracture toughness of the TiN-coated specimens showed a tendency to decrease with annealing at 1273K in a vacuum, whereas that of TiC-coated specimen increased.

View full abstract

Download PDF (290K)
Diamond Synthesis on Plasma Carbonitrided Titanium Substrate

Takayasu SATO, Manabu NEGISHI, Kazuo AKASHI

1994 Volume 45 Issue 1 Pages 106-107
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.106

JOURNAL FREE ACCESS

Download PDF (719K)
Electroless Solder Plating by Autocatalytic Reaction

Hideo HONMA, Teruyoshi SAITO, Takeshi KOBAYASHI

1994 Volume 45 Issue 1 Pages 108-109
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.108

JOURNAL FREE ACCESS

Download PDF (733K)
In-situ STM Observation of Polyaniline in Electrochemical Polymerization Process

Koji ENDO, Masaya TAKADA, Sachio YOSHIHARA, Eiichi SATO

1994 Volume 45 Issue 1 Pages 110-111
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.110

JOURNAL FREE ACCESS

Download PDF (758K)
Stacking Structure in Anodic Oxide Film on Aluminum Formed by A. C. Electrolysis

Kenji WADA, Takeshi SOTOMURA, Masayuki TSUTSUMI

1994 Volume 45 Issue 1 Pages 112-113
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.112

JOURNAL FREE ACCESS

Download PDF (624K)
Observation of Chemical Etching Morphology of Aluminum Foil

Hiroshi MATSUBARA, Hidenori UCHI, Akifumi YAMADA

1994 Volume 45 Issue 1 Pages 114-115
Published: January 01, 1994
Released on J-STAGE: October 30, 2009

DOIhttps://doi.org/10.4139/sfj.45.114

JOURNAL FREE ACCESS

Download PDF (1384K)

Register with J-STAGE for free!