Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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Volume 58, Issue 10
Displaying 1-8 of 8 articles from this issue
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Special Feature/Practical Application of DLC Films
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Technological Papers
  • Synthesis of Alkoxylsilane Including Adamantyl Group and Properties of Its Coating Film
    Hiroyasu TSUGE, Satomi ONO
    2007 Volume 58 Issue 10 Pages 607
    Published: 2007
    Released on J-STAGE: April 24, 2008
    DOIhttps://doi.org/10.4139/sfj.58.607
    JOURNAL FREE ACCESS
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    4-(1-Adamantyl)-3-butenyltriethoxysilane was synthesized from 1-adamantanecarboxylic acid and 3-chloropropyltriethoxysilane. The hydrolysis of this compound in 1-propanol with H2O in the presence of a catalytic amount of nitric acid was conducted by heating to obtain the precursor solution. A glass substrate was coated using this solution, followed by heat treatment at 200°C. The resulting coating film was dense and had no cracks from SEM observation. Thickness, pencil hardness and contact angle with water of the specimen were measured. It was confirmed from these experiments that the adamantyl group was very effective on the coating film in the increase in thickness and improvement of hardness. Its water repellent performance was similar to that of the methyl group. A suspension solution was prepared by adding silicon carbide particles to the precursor solution. Preparation of the coating film using this solution was performed to give a relatively hard, water repellent composite film including particles.
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  • Direct Electroless Copper Plating on Glass
    Mitsuhiro WATANABE, Hiroyuki SEIDA, Hideo HONMA
    2007 Volume 58 Issue 10 Pages 612
    Published: 2007
    Released on J-STAGE: April 24, 2008
    DOIhttps://doi.org/10.4139/sfj.58.612
    JOURNAL FREE ACCESS
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    Direct copper deposition on glass without etching is difficult to obtain by the conventional electroless copper treatment process. The formation of copper films on glass without exfoliation of copper from the glass substrate can be accomplished by introducing an alcohol treatment after the conventional sensitization and activation steps. This was followed by the electroless copper deposition.
    Adhesion strength was improved by heat treatment under an inert atmosphere. Furthermore, copper circuit patterns with widths of 4 to 6μm were formed by the semi-additive process.
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