Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Volume 67, Issue 11
Displaying 1-8 of 8 articles from this issue
Special Feature / Automatic Methods of Analysis for Plating Bath Composition Control
Reviews
Research Papers
  • Katsumi MABUCHI
    2016 Volume 67 Issue 11 Pages 595-606
    Published: November 01, 2016
    Released on J-STAGE: November 01, 2017
    JOURNAL FREE ACCESS

    This study investigated shortening of the treatment time to improve corrosion(pitting)resistance of a thin aluminum film using 1, 2-Bis(triethoxysilyl)ethane(BTSE)and Bis(triethoxysilyl)propyltetrasulfide(BTSPS). During silane coupling processing using BTSPS, the processing time can be shortened by adding hydrogen peroxide or by combining the processing with electrolysis, especially cathode polarization. Using both treatments decreased the processing time to approximately 1/20 of its usual length. The degree of time decrease depends on the shift of potential to the noble side and the decrease of pH by hydrogen peroxide addition. Both increase the formation rate of the BTSPS layer on Al. A weakly acidic Al metal surface is created by removing oxide and hydroxide, depending on the increased potential and the decreased pH. Because BTSPS is a soft base, the HSAB principle suggests that the Al metal surface and BTSPS become combined easily. Reduction of the dissolved O2 changes the Al surface to an alkali environment. Therefore, processing time reduction by cathodal electrolysis is explained by promotion of the hydrolytic reaction of BTSPS. Adding H2O2 to BTSE produces no time-shortening effect. Furthermore, no pitting resistance is observed even if Al is immersed for a long time.

    Download PDF (3189K)
  • Ryoma KOBAYASHI, Atsushi YUMOTO, Hidetaka ASOH, Ichiro TAKANO
    2016 Volume 67 Issue 11 Pages 607-613
    Published: November 01, 2016
    Released on J-STAGE: November 01, 2017
    JOURNAL FREE ACCESS

    Using pulse-reverse electrodeposition with a dual cell method, CoFeNi films were formed on ring-shaped copper substrates under galvanostatic pulse mode. The dual cell comprised a pair of anode and cathode cells that were mutually connected electrochemically through a salt bridge. The effects of solution pH in a cathode cell and the average current density on compositional, structural, and magnetic properties of the obtained films were investigated using SEM-EDS, XRD, and BH analyze(rmeasured at 5000 A m-1 and 50 Hz, 1.6 A m-1, and 1-1000 kHz). All regions of cross-sectional electrodeposited CoFeNi films consisting of nano-crystallites exhibited uniform composition. As a result of AC soft magnetic properties, Fe contents in the films increased and Ni contents in the films decreased with decreasing pH of the solution, thereby raising the maximum magnetic flux density(Bm). These results imply that a CoFeNi film with excellent magnetic properties can be formed by decreasing the solution pH. It has been suggested that CoFeNi films with excellent magnetic properties can be produced by decreasing the solution pH. The Co57Ni14Fe29 film formed by applying average current density of 16 mA cm-2 in a solution of pH 2.0 showed the most suitable soft-magnetic properties found in this study: low coercivity of 244 Am-1 and high Bm of 1.97 T.

    Download PDF (2111K)
feedback
Top