Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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Volume 70, Issue 11
Displaying 1-7 of 7 articles from this issue
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Special Feature / Latest Trends in Electromagnetic Shielding and Absorbing Technology
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  • Application of Fluid Simulation in High-Speed Copper Sulfate Plating Using a Jet Flow Device
    Yohei SUZUKI, Yasushi UMEDA, Toshinosuke AKUTSU, Christpher E. J. Cord ...
    2019 Volume 70 Issue 11 Pages 566-570
    Published: November 01, 2019
    Released on J-STAGE: October 31, 2019
    DOIhttps://doi.org/10.4139/sfj.70.566
    JOURNAL FREE ACCESS
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    Copper has excellent properties that include malleability and conductivity. Therefore, it is used widely in the electronics field. Copper sulfate plating is expanding further in applications that require thick deposits such as heat dissipation boards and bumps for stress relaxation during semiconductor packaging. To improve productivity and to reduce costs in this field, high-speed electroplating using high current density is desirable. For this study, a jet flow device was used for high-speed plating. Furthermore, the plating solution flow and metal ion diffusion were predicted by simulation using the computational fluid dynamics（CFD）. Correlation with actual plating behavior was investigated. Velocity distribution analysis of the chamber of a jet flow device confirmed that the plating solution was spread uniformly on the cathode surface. From results of the temperature distribution simulation in the chamber, the supplied amount of copper ions was predicted using the similarity relation of temperature diffusion and mass diffusion. The simulation results coincided with actual plating conditions and predicted the appropriate stirring speed for the copper ion concentration in the plating solution.

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