The kinetics of diffusion induced grain boundary migration (DIGM) in the Ni(Cu) system was experimentally studied by Liu
et al. using polycrystalline Cu/Ni/Cu diffusion couples annealed at 888 K for various times between 4.8×10
2 and 9.36×10
4s. The notation Ni(Cu) means that Cu atoms diffuse into a pure Ni or binary Ni-Cu phase. Their experimental results have been quantitatively analyzed using the energy balance model proposed by Kajihara and Gust. The face-centered-cubic (f.c.c.) solution phase in the binary Ni-Cu system is assumed to be elastically isotropic. The molar Gibbs energy of the f.c.c. phase is expressed by a subregular solution model. The migration rate
v of the moving grain boundary is described as a function of the reaction time
t by the equation
v=
k(
t/
t0)
m. Here,
t0 is unit time, 1 s. From these relationships, the effective driving force Δ
efGm for DIGM has been calculated as a function of the reaction time. Although Δ
efGm monotonically decreases with increasing reaction time from the maximum value of 184 J/mol to the minimum value of 8 J/mol, it is still large enough to drive the grain boundary migration against the curvature of the moving grain boundary even at late stages of the reaction. The mobility
M of the moving grain boundary also monotonically decreases with increasing reaction time from 2×10
-17 m
4/J s at 4.8×10
2s to 2×10
-18 m
4/J s at 9.36×10
4s. However, considering the grain boundary energy contribution due to the curvature of the moving grain boundary,
M is supposed to be almost constant during the reaction.
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