Dynamic viscoelastic behaviors of hydrogen silsesquioxane (HSQ) resin in the temperature range of 200 to 400°C were investigated in either nitrogen or air, focusing on G′ and G″ values. HSQ resin was melted and then cured with heat. As the curing proceeded, G′ increased as the temperature increased, while G″ was lost at certain temperatures,
i. e. HSQ is believed to be cured into a completely elastic material. Oxygen takes a role to promote the speed of curing and to increase the final modulus of the cured resin without changing the pattern of curing behaviors, compared to the curing in nitrogen. Effects of temperature/atmosphere on melting behavior and effects of preheating before cure in nitrogen were also investigated. The obtained data suggest a possibility to improve the planarizing/curing processes and film properties of HSQ resin that is practically available for semiconductor applications.
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