The Journal of Reliability Engineering Association of Japan

Online ISSN : 2424-2543
Print ISSN : 0919-2697
ISSN-L : 0919-2697

Search
Browse

All issues

Volume 34, Issue 4

Displaying 1-24 of 24 articles from this issue

Download citation

Show all abstracts

[title in Japanese]

Article type: Cover
2012Volume 34Issue 4 Pages Cover1-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_Cover1

JOURNAL FREE ACCESS

Download PDF (32353K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages i-viii
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_i

JOURNAL FREE ACCESS

Download PDF (774K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages xi-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_xi

JOURNAL FREE ACCESS

Download PDF (43K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages xii-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_xii

JOURNAL FREE ACCESS

Download PDF (38K)
Knowledge Communications for Social Reliability

Toru KAISE

Article type: Article
2012Volume 34Issue 4 Pages 217-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_217

JOURNAL FREE ACCESS

Download PDF (239K)
Reliability of Electronics Assembled JointsReliability in Bonding and Contact Technologies)

Tadashi TAKEMOTO

Article type: Article
2012Volume 34Issue 4 Pages 218-224
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_218

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (1203K)
Development of Improved Glued Railjoint for Insulation(Reliability in Bonding and Contact Technologies)

Hiroo KATAOKA

Article type: Article
2012Volume 34Issue 4 Pages 225-229
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_225

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (1221K)
Contact Reliability for the Relays Used for the Earthquake Disasters(Reliability in Bonding and Contact Technologies)

Yoshitada WATANABE

Article type: Article
2012Volume 34Issue 4 Pages 230-235
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_230

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (1116K)
Reliability of Contact(Reliability in Bonding and Contact Technologies)

Sadanori ITO

Article type: Article
2012Volume 34Issue 4 Pages 236-243
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_236

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (1119K)
Reliability of Fiber Optic Connector(Reliability in Bonding and Contact Technologies)

Shuichi YANAGI

Article type: Article
2012Volume 34Issue 4 Pages 244-249
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_244

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (1607K)
Reliability of Welded Structures(Reliability in Bonding and Contact Technologies)

Shuichi FUKUDA

Article type: Article
2012Volume 34Issue 4 Pages 250-258
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_250

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (1340K)
History of the Development A Society for the Study of Failure Physics

Hideharu TSUCHIYA, Yoshiyuki IHARA, Hiroyuki YOSHIDA

Article type: Article
2012Volume 34Issue 4 Pages 259-264
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_259

JOURNAL FREE ACCESS

Show abstractHide abstract

[in Japanese]

View full abstract

Download PDF (980K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 265-266
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_265

JOURNAL FREE ACCESS

Download PDF (132K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 267-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_267

JOURNAL FREE ACCESS

Download PDF (45K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 268-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_268

JOURNAL FREE ACCESS

Download PDF (11K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 269-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_269

JOURNAL FREE ACCESS

Download PDF (91K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 270-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_270_1

JOURNAL FREE ACCESS

Download PDF (72K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 270-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_270_2

JOURNAL FREE ACCESS

Download PDF (72K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 270-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_270_3

JOURNAL FREE ACCESS

Download PDF (72K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 271-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_271

JOURNAL FREE ACCESS

Download PDF (9K)
Evaluation of degradation at a solder connected point due to electromigration

Akihiro HIGUCHI, Kazunori HIRAOKA

Article type: Article
2012Volume 34Issue 4 Pages 273-279
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_273

JOURNAL FREE ACCESS

Show abstractHide abstract

Tensile strength at a soldered connected point was investigated after applying high current density. Two copper wires of 180 μm in diameter were connected with Sn-3Ag-0.5Cu(wt%) solder. Tensile strength of the soldered point was measured after applying electric current of 0〜19.7kA/cm^2 for 0, 30, 100 and 300 hours. Degradation of tensile strength was confirmed when the current density was higher than 11.8kA/cm^2 and the applying time of current was over 100 hours. The open failure was often observed at a cathode side. In addition, SEM picture of cathode side was different from that of anode side. These results indicate that degradation of tensile strength was caused by electromigration.

View full abstract

Download PDF (1125K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 280-281
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_280

JOURNAL FREE ACCESS

Download PDF (193K)
[title in Japanese]

Article type: Appendix
2012Volume 34Issue 4 Pages 282-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_282

JOURNAL FREE ACCESS

Download PDF (19K)
[title in Japanese]

Article type: Cover
2012Volume 34Issue 4 Pages Cover2-
Published: May 01, 2012
Released on J-STAGE: January 31, 2018

DOIhttps://doi.org/10.11348/reajshinrai.34.4_Cover2

JOURNAL FREE ACCESS

Download PDF (1829K)

feedback

Top

Register with J-STAGE for free!