The cure-adhesion of rubbers (NR and SBR) to electroless Ni-Cu-P alloy deposits and the adhesion mechanism have been investigated. In these cure-adhesion, the good adhesion strength and the good hot water resistance were obtained by using of Ni-Cu-P alloy deposit which the Cu contents were from 0 to 20mol%, and the adhesion behavior was the cohesive failure. But, at more than over 20mol% Cu, the more Cu contents increased, the lower rubber coverage on failure surface decreased. When the alloy contained more than 50mol% Cu, the adhesion behavior was the cohesive/interface failure or interface failure.
The analysis of adhesion interface by an electroprove microanalyzer and X-ray photoelectron spectroscopy suggested to be formed of thin sulfide film on adhesion interface.
From these results, it is found that the important factors of using metal and alloy were to have a thin and tightly sulfide film.
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