An Evaluation of LB resists for Excimer Laser (EX), and X-ray exposure was conducted to realize half micron lithography. The study included five LB reagents for EX exposure, i. e., wtricocynoic acid : TCA, octadecyl-acrylic acid : ODA, and three Diynoic acid derivatives (i. e., Tricosa-diynoic acid : TDA, pentacosa-diynoic acid : PDA, and heptacosa-diynoic acid : HDA), and three LB reagents for X-ray exposure, i. e., TCA, TSA, and ADA. Using PDA LB films, 0.3μm patterns could be fabricated by EX exposure, the size of which is the theoretical resolution limit of our lens. Using TCA LB films, 0.4 μm patterns can be fabricated by X-ray exposure. This size is at the small size limit of the X-ray mask. In order to actually utilize LB films as resits, further improvements in production efficiency are required.
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