Printing process is rarely used for electronic devices manufacturing. Photolithography process is mostly used as fine patterning method for that, because photolithography process has higher reliability for pattern reproduction. Nevertheless some trials to replace photolithography to printing have been gone forward in order to reduce the process cost. Potentiality of printing process for electronic devices depends on resolusion, thickness and property of ink. The resolusion in planography offset and intaglio printing is higher (L⁄S=10∼20μm for instance in micro-letter of securities printing) than in screen printing (L⁄S=20μm in a champion sample). However, we often try to use screen printing for some electronic devices, because of higher ink thickness (>5μm)at printed pattern. In this paper, LCD colorfilter by intaglio offset printing and reverse-offset printing is presented. And electronic parts (resistances, capacitors and inductors)embedded in circuit board by screen printing is presented as examples now in development. One of the most advanced theme in the future is production of organic transistors and organic TFT by printing process in all layers (electrode, dielectric, semiconductor etc.). There are many challenges in fine pattern printing technology, for instance, high reliability on accuracy of pattern figure, and high properties in any ink for each electronic layers. The key in conclusion is the development of ink materials and surface control.
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