Recently, the improvement in the defect performance is demanded more strongly due to the shrinking of the semiconductor device technical node. Generally, it is considered that there is a correlation between the defect performance of oxide polishing and the numbers of agglomerated particles (Large Particle Counts) in slurry. However, phenomenons in which the number of defects is low even if there are a lot of Large Particle Counts (LPC) and vice versa occur. This phenomenons cannot be explained only by LPC. In this study, the item which the defect performance correlates with other than LPC was investigated, and it was clarified that it was stabilization of silica particle.

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In LSI device manufacturing process, dielectric layer planarization process is important. To flat dielectric layer surface, CMP (Chemical Mechanical Polishing) machining with fumed silica slurry is used. During this CMP process, micro scratch defects caused by large particles in slurries are big problem. So we investigate the effect of slurry producing condition on large particle counts and micro scratch defects. And we try to reveal the generation mechanism of micro scratch. In this paper, we report method to evaluate micro scratches and relationship between CMP condition (polishing pressure, pad speed, etc.) and micro scratch defects.

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[in Japanese]

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Organic EL display (OLED) is one of the products that use organic material for the illuminant device, and attracts attention in recent years. OLED can manufacture more thin than PDP and LCD, and have excellent display performance. Additionally, it is gentle also to the environment as power consumption doesn′t use mercury low. The organic material is also cheap, so it is expected as next generation′s display. As for OLED, enlargement and the cost reduction of the panel become problems now. And the improvement of the manufacturing technique about organic film is requested. To solve this problem, a new organic film manufacturing process in which forming an organic film by the spray method and making the surface of the film smooth by CMP (Chemical Mechanical Polishing) is proposed and examined in the present study. This process can manufacture an organic film in the atmosphere. In this report, the possibility to the process establishment was examined by observing and evaluating the membrane surface after it had processed it with the spray method and CMP.

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[in Japanese]

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The accurate analytical model for the dynamic structure analysis of Chemical Mechanical Polishing (CMP) process has been proposed by the authors. By extending to the three dimensional (3D) analysis and applying to the coupled fluid-structure analysis of the CMP process, the accurate CMP process model, which can consider the nonlinear dynamic motion, the damping effects and the stress concentration simultaneously, was developed in the present research. It was applied to the 3D CMP process analysis, and the effect of the damping property of the polishing pad on the process was investigated. It was confirmed that the stress concentration beneath the leading edge of the wafer changes significantly depending on the consideration of the damping property. Thus, there is a possibility that the developed model can estimate the polishing stress and fluid pressure distributions of the CMP process accurately.

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[in Japanese]

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In this study, we aim to present the effective parameters that can be used to evaluate pad surface conditions. Therefore, we proposed the contact image analysis method using image rotation prism. Our previously reports showed the fundamental results obtained by both the laboratory apparatus and the commercially available apparatus. This paper presented the detail of selection methodology of threshold level for image analysis, and the evaluated results about the effect of dressing time on pad surface characteristics. As the results, we found that (1) the contact ratio, (2) number of contact points and (3) contact point interval were found to be effective for evaluating pad surface conditions.

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[in Japanese]

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Surface finishing of die consumes several days by skilled workers. The aim of this study is to improve productivity of die by automatization of finishing process by ultrasonic vibration assisted machining. Mirror surface processing of the difficult-to-machine material was tried using small diameter tools to make electrodeposited diamond. The effect of ultrasonic vibration is confirmed. Because shorter machining time is better. In this paper, optimal machining parameter is established.

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When ferrous material is cut by diamond tool, it is well known that a diamond tool is worn severely. The purpose of this research work is to machine a diamond by utilizing this wear. As a method for machining, a diamond cuts the side of rotating thin ferrous disk. However, the thin ferrous disk is deflected by cutting resistance. The diamond cuts the thin ferrous disk contacted with aluminum disks to prevent this deflection. On the diamond cutting edge, only the part which cut ferrous disk is worn not the part which cut aluminum disk. It is expected that small width of groove is formed on the surface of the diamond by the wear.

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It is difficult to machine a sapphire because of the hardness. By the way, the sapphire reacts with silica at high temperature. And a tool composed of pure aluminum oxide is worn severely by cutting of stainless steel or other ductile ferrous materials. The sapphire is machined by tool wear during cutting of glass or ferrous material in this paper. In the processing by ferrous material, the removal rate of the sapphire is large, but the roughness of finish surface is large value. On the other hand, in the processing with the glass, removal rate is small, but the roughness of finish surface is small value. Therefore, the sapphire is machined by ferrous material at first. Next, the sapphire is machined by glass to obtain small roughness value of finished surface.

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In order to meet the requirement of high-mix low-volume production, in this study, a full mold casting method of molding ceramic products is proposed. In the proposed method, the plaster mold is made using the foamed styrene model of the target shape, then the slurry contained ceramic powder and limonene is poured in the plaster mold without removing the foamed styrene model from it. As a result, it is possible that molding along the plaster mold with dissolving foamed styrene by the slurry if the ceramics in the slurry is prevented being precipitated and the slurry comes to mix uniformly.

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[in Japanese]

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We have developed the technique to produce carbon nanotubes (CNTs) on the microscopically localized areas of a substrate by thermal CVD. The areas for the CNT growth are specified by the high-density adsorption patterns of ferritin molecules. We have realized the patterning of the ferritn by the lift-off process. The surface density of the ferritin molecules can be controlled by tuning the soaking time of the substrate in the photoresist remover for the liftoff after the ferritin coating. We discuss the dependence of the ferritin density on the CNT growth.

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We have previously shown that microparts can be fed along sawtooth surfaces using simple planar symmetric vibration. The microparts move in one direction because they adhere to the sawtooth surface more in the backward direction than in the forward direction. We assessed the movement of micropart on a sawtoothed surface using a newly developed partsfeeder driven by an accumulated piezoelectric actuator with a displacement magnifying mechanism. Using experimental results, we evaluated the relationship between drivng frequency and feeding velocity on each sawtoothed surface in various sawtooth pitch. We also evaluated the characteristics of feeding direction according to driving frequency, because micropart moved in the opposite direction when the driving frequency was smaller than 390 Hz.

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In this paper, a new way of applying polyimide (PI) film as a membrane of a MEMS micropump is reported, this is because the PI films have especial characteristics such as chemical stability, mechanical strength and large expandability. A simple structured air-actuated valveless micropump with a polyimide membrane was designed. The micropump was fabricated processes including metal deposition spin-coating of PI, optical lithography and the ICP etching of silicon. The operation of the micropump is based on alternating air pressure to deflect the membrane. The tapered diffuser and nozzle work as valves. When the membrane is deflected, the fluid flows thought the diffuser is larger than the flow thought the nozzle. More details of this device will be reported at the conference.

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[in Japanese]

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A silicon condenser microphone on an SOI (silicon on insulator) substrate using only one photo mask was fabricated. This microphone consists of a diaphragm with the thickness of 10-20 μm and the diameter of 2 mm, a SiO2 insulative spacer (4 μm thick buried oxide), and a 450 μm-thick silicon back plate with the meshed structures having extremely small (60 μm) hexagonal shaped acoustic holes. The gap between the silicon diaphragm and the back plate is 4 μm, which is determined by the thickness of the buried oxide in the SOI wafer. It was found that the microphone with the diaphragm of 10μm thickness exhibited much better sensitivity. This is because the displacement of the diaphragm increases as the thickness of the diaphragm decreases.

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Recently, in various fields, the necessity for small and highly sensitive micro fluidic analysis system has increased. In this report, we have considered creating a micro fluidic device with a blood extraction mechanics. A substrate with a 3mmx8mm reservoir of 5mm in depth was covered with a laminate heat-hardening resin film and adhered laminate at vacuum atmosphere. After that, we attached a 25G hypodermic needle on center of covered resin film. When we tap the hypodermic needle to the skin, resin film is broken by moving hypodermic needle. At the same time, blood is drawn into the reservoir. Using this device, we could draw ink into the reservoir. In this experiment, we used ink instead of human blood.

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Localized surface Plasmon resonance (LSPR) is an optical absorbance phenomenon which is excited at sub-micro meter sized noble metal structure. In this study, we aimed at the fabrication of the nanostructure for excitation of LSPR by using electron beam lithography (EBL). For excitation of LSPR, a Line and space resist pattern which has a pitch of 400 nm was obtained by EBL. And then, Au layer (thickness:30 nm) was deposited onto the resist pattern. As a result, we could observe the LSPR absorbance peak at 510 nm. further more, the LSPR peak shift depending upon the Au thickness was observed.

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