Proceedings of JSPE Semestrial Meeting
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2006 JSPE Spring Meeting
Displaying 201-250 of 647 articles from this issue
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  • Surface Characterization of Cemented Carbide Ground by Cr–Resin Bonded Wheel
    Tomoyuki Saito, Kazutosi Katahira, Hitosi Ohmori, Aiko Nakao, Akihiko ...
    Session ID: F04
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.401.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    Cr–resin bonded wheel for ELID method was developed to increase cemented carbide alloy″s adhesion to DLC. Cr–resin bonded wheel differed from conventional Cu–resin bonded wheel in the electrolytic properties. Surfaces of wheels were analyzed by using a Scanning Electron Microscope (SEM) equipped with an Energy Dispersive X–ray analyzer (EDX). These analyses showed that Cr–resin bonded wheel hardly created insulator layer. Three types of specimens (cemented carbide alloy) were prepared. 1) ground by ELID method with Cr–resin bonded wheel (Cr series) 2) ground by ELID method with conventional Cu–resin bonded wheel (Cu series) 3) polished by diamond spray (P series) The roughness of ground surfaces were measured by a contact type roughness meter. Cr series attained mirror accuracy on an equality with Cu series. Surfaces of specimens were analyzed by using a SEM and EDX. This experiment showed that ELID grinding used Cr–resin bonded wheel had new ELID cycle which was suitable for precision machining.
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  • Influence of pH Value of ELID Grinding Fluid on Cytotoxicity of Co–Cr Alloy
    Yukako Akinou, Masayoshi Mizutani, Jun Komotori, Kazutoshi Katahira, H ...
    Session ID: F05
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.403.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    The ELID grinding was given to the Co–Cr alloy with three kinds of grinding fluids, and the cytotoxicity was examined. As a result, the biocompatibility has improved when the grinding fluid that lowers the pH value is used. A detailed examination of the processing characteristic is necessary in the future.
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  • Study on Oscillated Control Lapping
    Michio Uneda, Hiromasa Tsukada, Ken–ichi Ishikawa, Hitoshi Suwab ...
    Session ID: G02
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.467.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    [in Japanese]
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  • Lapping Simulation Calculated with the Gap Theory
    Kenji Gotoh, Atsunobu Une, Kenichiro Yoshitomi, Masaaki Mochida
    Session ID: G03
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.469.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    The lapping simulation has been studied to obtain the fixed shape before polishing. But the simulation could not apply to workpieces and tools having various profiles. On the other hand, the polishing simulation on the surface generation process was developed using the gap theory and it was clarified that the simulated results agreed well with experimental results. This paper describes the application of the gap theory to lapping. The experimental results during a transitional period of lapping from the only corner part to the whole surface were compared with the simulated results using the gap theory. It was shown that the relative elastic coefficient reduces with the decrease of the gap between the tool and the workpiece, or the tool contacts softly with the workpiece, and the experimental profile coincides well with the simulated one if the suitable coefficient is used.
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  • High–precision Mirror Finishing of Tungsten Mold
    Koei Fujiki, Jun'chi Kaneko, Kenichiro Horio
    Session ID: G04
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.471.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    [in Japanese]
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  • Development of a Structure–Controlled Fixed–Abrasive Polishing Pad
    Toshiyuki Enomoto, Tutomu Fujita, Yoshimi Takeuchi, Shigeru Tominaga, ...
    Session ID: G05
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.473.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    Loose–abrasive machining is traditionally employed for finishing optical glass. The machining process, however, has problems involving a detrimental impact on environment and a high total machining cost. Therefore, it is strongly recommended that the process be replaced with fixed–abrasive machining, but conventional fixed–abrasive tools have a problem relating to low finishing efficiency. In this study, a structure–controlled, that is, spiral–structured fixed–ceria pad which consists of a fixed–ceria layer and the adhesion layer is introduced for finishing optical glass to overcome the above problem. The finishing experiments revealed that the finishing efficiency was comparable to that obtained by conventional polishing with ceria slurry and the efficiency was stable with time.
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  • Development of solid–type rotary diamond dresser utilizing a CVD diamond disc
    Akihiko Kubo, Junichi Tamaki
    Session ID: G18
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.487.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    A solid–type rotary diamond dresser, which consists of a CVD diamond disc so as to keep a continuous contact with a grinding wheel, is developed. The dressing performance is compared with that of a prism–type rotary diamond dresser, a popular dresser of discontinuous–contact–type. It is found that the solid–type rotary diamond dresser demonstrates the same performance as that of prism–type rotary diamond dresser when it is applied to a vitrified CBN140 grinding quill.
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  • Grinding performances of CVD diamond coated bar
    Manabu Iwai, Yukinori Tanaka, Haruki Shimokawa, Shinichi Ninomiya, Yos ...
    Session ID: G19
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.489.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In order to obtain a precise and fine surface roughness of a micro mold, a cylindrical tungsten carbide bar was coated with CVD diamond and the grinding performance of this bar tool was investigated. Since no bond material is used in the case of the CVD diamond coated bar, it is thought that the problem of drop–off of the abrasive powder will not occur. The trial manufactured CVD coated bar surface has diamond cutting edges in the form of surface irregularities 1.9µm in height. This CVD diamond coated bar was installed on an air motor and surface grinding of optical glass and high speed steel were performed and the results indicate that it has the potential to be used as a precision grinding tool.
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  • Study of electro–discharge grinding with an electrically conductive diamond–cutting–edge wheel
    Yukinori Tanaka, Shinichi Ninomiya, Manabu Iwai, Tetsutaro Uematsu, Mu ...
    Session ID: G20
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.491.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    The authors have proposed a new electrical discharge integrated grinding method using an electrically conductive cutting edges diamond wheel (EC–cutting edges D wheel) which simultaneously applies the effects of electrical discharge machining and grinding. It was shown that for the grinding of tungsten carbide workpiece using this method, a stable grinding along with a reduction in the grinding resistance could be achieved. In this research, the electrical discharge integrated grinding of difficult–to–grind PCD material, which induces a high abrasion wear of the grinding wheel, was performed and properties such as grinding resistance and ground workpiece surface roughness were investigated. The results indicate that when the EC–cutting edges D wheel was kept at positive polarity and for set peak discharge current value 16A, the removal rate of the PCD material increased. Moreover, compared to the normal diamond grits wheel a stable grinding could be sustained in the case of the EC–cutting edges D wheel.
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  • Ultra–Precision Grinding with fine diamond grains wheel
    Yukio Okanishi, Toshio Fukunishi, Masanori Foshika, Tomohiro Ishizu
    Session ID: G21
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.493.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    The super–fine diamond wheel with vitrified bond was developed for the high precision and low damage grinding of a silicone wafer. A possibility that this grinding processing method would be transposed to the conventional slurry processing was investigated. Consequently, φ300mm silicon wafer was possible into 5μm thickness by only grinding processing.
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  • Micro Behavior of Grain Cutting Edges in cBN Grinding
    Masakazu Fujimoto, Yoshio Ichida, Ryunosuke Sato, Yoshitaka Morimoto
    Session ID: G22
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.495.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In this study, micro wear behavior of grain cutting edges in the grinding process with vitrified cBN wheels is investigated on the basis of 3–dimensional analysis using a multi–probe–SEM. Especially, 3–dimensional shape of micro–cutting edges generated by micro self– sharpening is evaluated by fractal analysis. These results show that fractal dimension is closely concerned to the changes in grinding characteristic values.
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