Proceedings of JSPE Semestrial Meeting
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2006 JSPE Spring Meeting
Displaying 251-300 of 647 articles from this issue
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  • Grinding characteristics of boron doped diamond grits grinding wheel
    Manabu Iwai, Shinichi Ninomiya, kiyotaka Nakagawa, Tetsutaro Uematsu, ...
    Session ID: G26
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.501.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    Metal bonded diamond wheel and resin bonded diamond wheel with boron doped diamond grits, which possess electrical conductivity and high oxidation temperature, were trial manufactured. From the results of the investigation on the electro–discharge trueing performance, a high trueing efficiency along with the possibility of cutting edge tip formation was confirmed. From the results of the grinding experiment performed using this grinding wheel with flattened abrasive tips, a remarkable improvement in the work surface roughness could be achieved. Furthermore, from the results of grinding test on cemented carbide and optical glass using the boron doped diamond grits wheel, it was found that the grinding ratio increased significantly and the surface roughness improved compared to a conventional diamond grits (similar friability) wheel.
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  • Manufacturing of diamond tool formed of 3D bone structure with EDM
    Kiyoshi Suzuki, Yoichi Shiraishi, Zhang Danyang, Ten Saitou, Manabu Iw ...
    Session ID: G27
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.503.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In recent years, demand for the processing of new materials, which cannot be processed using conventional diamond grinding wheels, and demand for high precision parts is increasing. Especially in the case of high precision grinding there is the problem of drop–off of abrasive grains and limit to the concentration of the abrasive in the grinding wheel. In this research, PCD material that has a high concentration of diamond particles is used. It is proposed that the binder of the PCD material can be removed by electrical discharge machining and the remaining skeletal 3D structure can be used to manufacture a new grinding wheel. From the results of the experiments, it is confirmed that EDM of PCD using special conditions can create a porous grinding wheel. Furthermore, in the grinding of tungsten carbide using this porous cylindrical PCD material, appreciable removal efficiency could be achieved.
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  • The polishing mechanism with Ceria slurry
    Shunsuke Ueda, Naoyuki Koyama
    Session ID: G43
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.515.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    We have investigated effect of mechanical contribution on removal rate of SiO2 film by using ceria slurry. We polished 8″ wafers with SiO2 film by two types of ceria slurry at various polishing conditions. Friction force between SiO2 film and polishing pad was estimated by monitoring table current of polisher. We found linear dependency of removal rate on pressure and velocity, as known the Preston′s equation. However correlation coefficient was improved from 0.88–0.95 to 0.95–0.99 by using the product of torque and velocity instead of pressure and velocity. These results show removal rate of SiO2 film with ceria slurry depends on total mechanical energy input. In addition, effect of ceria particle size was discussed.
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  • Glass polishing mechanism with CeO2
    Okuda Kazuhiro, Makoto Satou
    Session ID: G44
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.517.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    Glass is polished using polishing pad with ceria slurry, and sometimes defects are found on the surface of work. But as it is difficult to observe polishing process directly, the mechanism and reason of occurring defects are unknown. In this study the mechanism of defects is investigated by changing polishing pressure and pH.
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  • Soft polymer abrasive slurries for Cu–CMP
    Setsuko Nakamura, Kiyotaka Shindo, Shigeharu Fujii, Akinori Eto, Tomok ...
    Session ID: G45
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.519.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    We are developing novel Cu–CMP slurries based on pure organic particles acting as abrasives to improve polishing defects using functional polymer resin technology. This study investigates the effect of pH of Cu–CMP slurries containing polymer abrasives on the removal rate of Cu, dishing and erosion after CMP. We achieved a dishing of less than 40 nm at pH 8 while maintaining practical removal rates. High removal rate of Cu over Ta and silicon dioxide results in absence of erosion in a dense fabricated structure. We herein explain that the high resistance to defectivity is due to the soft polymer abrasives and a weak alkaline region to form undissolved film of Cu.
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  • Precise Polishing of Silicon Wafer Using Electrolyzed Reduced Water
    Unkai Sato, Koichiro Ichikawa
    Session ID: G46
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.521.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    This paper describes precise polishing of silicon wafer using dilute electrolyzed reduced water of the electrolyte salt like NaCl, instead of conventional polishing with slurry which is not environmentally consciousness. First, the polishing ability of electrolyzed reduced water clarified similar to the polishing slurry, and ten times or more greatly than the NaOH solution as results by doing the polishing experiment of silicon wafer. Next, it has been understood that the surface quality on the polishing side with electrolyzed reduced water is excellent from the results of surface analysis and roughness measurement. The electrolyzed reduced water can be applied to polishing the silicon wafer instead the polishing slurry as the conclusion of this research.
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  • Study on UV irradiation CMP process
    Hayato Kuzuma, Jyunya Fukuda, Keiiti Kimura, Panart Khajornrungruang
    Session ID: G47
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.523.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    [in Japanese]
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  • Study of polishing pad surface treatment effects on Si polishing
    Toda Tomoyuki, Park Jae Hong, Haba Shinichi, Yoshida Koichi, Shigeta Y ...
    Session ID: G61
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.525.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    [in Japanese]
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  • Groove Pattern of a Polishing Pad for High Rotational Speed Polishing
    Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
    Session ID: G62
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.527.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In order to planarize a large–sized wafer, a single wafer type polishing machine with oscillation speed control have developed. To achieve high removal rate at high rotational speed, a groove pattern of a polisher must be optimized to prevent slurry flowing away and to supply slurry to the polishing area uniformly. This paper describes the possibility of high rotational speed polishing using a polisher with a spiral groove pattern. As a result, it was shown that the spiral groove polisher hold slurry around the center of the polisher. And the experiment with a new groove pattern which combined the spiral and the lattice showed that stock removal distribution is proportional to relative speed between a polisher and a wafer.
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  • Study on Polishing of Si wafer with Pyramidal Structured Polishing Pad
    Ryunosuke Sato, Yoshio Ichida, Yoshitaka Morimoto
    Session ID: G63
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.529.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In this study, the fundamental polishing characteristic in wet mechano–chemical polishing of Si wafer with KOH aqueous solution using a pyramidal structured polishing pad including 6 μm Al2O3 abrasives was investigated. A series of polishing tests has been carried out and reactants formed on finished surface have been analyzed by using an atomic force microscope. As a result, a formation mechanism of reactants in wet mechano–chemical polishing of Si wafer with KOH aqueous solution has been shown and an optimum concentration of KOH aqueous solution to create a smooth surface has been clarified.
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  • Study on Improvement of Accuracy and Efficiency for Slot Cutting of CMP Pad
    Ryuzo Kibe, Jyunichiro Takagi, Takashi Hanamoto, Yoshiaki Katao, Masah ...
    Session ID: G64
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.531.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In recent years, the new use of foam urethane is found out as a polishing pad for CMP (Chemical Mechanical Polishing). However, there are very few researches on cutting of visco–elastic material like foam urethane. For improving the polishing characteristics of CMP, the precision slot cutting of foam urethane was discussed in this research. To investigate the cutting mechanism of foam urethane, the force and temperature of the cutting area, the slot formation under various conditions, and the frictional property of the tool materials are investigated. Comparing the influences of the tool material, carbide tool and high–speed steel tool, both cutting force and friction factor can be reduced using the high–speed steel tool and the slot formation can be improved.
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  • Study on drilling process of CFRP (Carbon Fiber Reinforced Plastics)
    Shigehiko Sakamoto, Frank Krogmeier, André Walter, Ekkard Brink ...
    Session ID: H13
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.575.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In structures for aerospace application CFRP (Carbon Fiber Reinforced Plastics) are widely used for parts of wing or tail structures of airplanes. Machining characteristics of this difficult–to–cut material introduce thermal problems which affect to downgrade the qualities of CFRP. Tool wear also caused by the high abrasive loads during the drilling process of the CFRP are critical for application as aerospace materials. In order to develop the cutting technique for CFRP, in this study, thermal influences of drilling parameters are observed with a various kind of cutting conditions. It is summarized that thermal effect on the drilling of CFRP is related to the material removal rate of drilling process.
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  • An investigation on the CBN Wheel Surface Condition in Wheel Life
    Heiji Yasui, Kenji Maruo, Yusuke Tanaka
    Session ID: H14
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.577.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    To evaluate quantitatively the surface condition, in our previous researches, the automatic image processing system attached to a surface grinder is newly developed. In addition, the evaluating system based on the topography in wheel radial direction in which the profilometer is employed for the measurement of wheel surface is newly developed. Using the both evaluating systems, in the research, the CBN wheel surface conditions in life time is examined. Wheel life occurs at even the large depth of chip pocket when the height level of cutting edge in wheel radial direction equals to the bond.
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  • Grinding Characteristics of Ultra–smoothness Vertical Grinder Manufactured by New Concept
    Heiji Yasui, Yuki Yamamoto, Kensuke Miyamoto
    Session ID: H15
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.579.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In the previous research, the ultra–smoothness grinding method in which the surface roughness is near the ultra–smoothness surface formed by polishing, is developed and ascertained useful by applying to the horizontal grinding method. Then to improve the removal rate, the vertical ultra–smoothness grinding machine is developed. Using the vertical machine, in the research, the influence of the parallel step feed on the ultra–smoothness grinding of die steel is examined. The surface roughness increases with the increase of the parallel step feed. The best surface roughness obtained in the experiment is about 50nm(Rz) or 5nm(Ra) at the step feed of 20mm.
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  • Grinding Characteristics of Ultra–smoothness Vertical Grinder Manufactured by New Concept
    Heiji Yasui, Shogo Furuya, Yuki Yamamoto
    Session ID: H16
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.581.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    In the previous research, the ultra–smoothness grinding method in which the surface roughness is near the ultra–smoothness surface formed by polishing, is developed and ascertained useful by applying to the horizontal grinding method. Then to improve the removal rate, the ultra–smoothness vertical grinder is developed. Using the vertical machine, in the research, the influence of the dilution of grinding fluid on the ultra–smoothness grinding of cemented carbide is examined. The surface roughness becomes better as the degree of dilution increases.
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  • Influence of Grinding Fluid on Mirror Surface Traverse Grinding of Aluminum Alloy
    Toshimi Odaki, Heiji Yasui, Susumu Tomita, Shigehiko Sakamoto
    Session ID: H18
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.583.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    With the resent increase of the demand to high quality products, the high precision machining such as grinding and so on has been strongly important for realizing to manufacture easily the products. High removal rate grinding with high–smoothness grinding has been increasingly becoming important. The influence of synthetic emulsion type grinding fluid on the mirror traverse grinding characteristics of aluminum alloy under high depth of cut grinding, in the present research, is examined. From the results it is found that the characteristic obtained by using the synthetic emulsion type is much better than the emulsion type including the sulfur compound. Supplying the synthetic emulsion type grinding fluid, the surface roughness of aluminum becomes below 1μm(Rz).
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  • Control of grain boundary fracture in grinding of AlN
    Shinya Suzuki, Nobuhito Yoshihara, Jiwang Yan, Tsunemoto Kuriyagawa
    Session ID: H19
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.585.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    AlN has advantages in thermal and dielectric characteristics and there are great demands for use as a base plate or packaging parts material. AlN is a sintered material and the AlN grains easily fall off during grinding process. Therefore it is difficult to obtain fine surface roughness. In previous works, we did machining experiments by ulara–precision plane honing. In this report, we investigated the falling off of AlN grains and the methods to control the grain boundary fracture by using diamond indentation tests. As a result, it became clear that rough ground surface is cracked under surface, witch causes falling off of AlN grains.
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  • Influence of Polisher Type on Removal Rate in Polishing of Magnetic Disk Substrate by New Double Side Surface Polishing Machine
    Heiji Yasui, Kanta Yamaguchi, Takuya Niki, Akihisa Kubota
    Session ID: H20
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.587.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    High efficient and ultra–smoothness double side surface polishing machine based on the new concept, in the previous research, is developed. Using the machine, the change of removal rate with polishing process for the polisher double layer structure has been examined previously. Using the same machine, the life characteristics of the single layer structure polisher, in the research is examined. The remarkable difference between the polishers of single and double layer structure is found for the change of removal rate with polishing process.
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  • Development Study on New Polishing utilizing Magnetic Responsive Intelligent Fluid
    Kunio Shimada, Yoshio Matsuo, Keita Yamamoto, Rei Hanamura, Teruhisa N ...
    Session ID: H32
    Published: March 05, 2006
    Released on J-STAGE: January 31, 2007
    DOIhttps://doi.org/10.11522/pscjspe.2006S.0.599.0
    CONFERENCE PROCEEDINGS FREE ACCESS
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    This study is the development of new float polishing technique with large clearance utilizing magnetic compound fluid (MCF) that has been developed as one of magnetic responsive intelligent fluids by one of authors. The possibility and the technique of simultaneous float polishing all surfaces of three–dimensional complex shapes are shown. In this report, the present polishing is clarified to be superior to the cases of utilizing magnetic fluid and MR fluid, and the principle and mechanism of the present polishing is also clarified.
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