表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
検索
詳細検索
OR
閲覧
検索
58 巻, 10 号
選択された号の論文の8件中1～8を表示しています
すべての抄録を表示する
    • |<
    • <
    • 1
    • >
    • >|
小特集／DLC実用化技術
総説
解説
技術論文
  • アダマンチル基を有するアルコキシシランの合成とその皮膜特性
    柘植 弘安, 小野 さとみ
    2007 年 58 巻 10 号 p. 607
    発行日: 2007年
    公開日: 2008/04/24
    DOIhttps://doi.org/10.4139/sfj.58.607
    ジャーナル フリー
    抄録を表示する抄録を非表示にする
    4-(1-Adamantyl)-3-butenyltriethoxysilane was synthesized from 1-adamantanecarboxylic acid and 3-chloropropyltriethoxysilane. The hydrolysis of this compound in 1-propanol with H2O in the presence of a catalytic amount of nitric acid was conducted by heating to obtain the precursor solution. A glass substrate was coated using this solution, followed by heat treatment at 200°C. The resulting coating film was dense and had no cracks from SEM observation. Thickness, pencil hardness and contact angle with water of the specimen were measured. It was confirmed from these experiments that the adamantyl group was very effective on the coating film in the increase in thickness and improvement of hardness. Its water repellent performance was similar to that of the methyl group. A suspension solution was prepared by adding silicon carbide particles to the precursor solution. Preparation of the coating film using this solution was performed to give a relatively hard, water repellent composite film including particles.
    抄録全体を表示
    PDF形式でダウンロード (384K)
  • Direct Electroless Copper Plating on Glass
    Mitsuhiro WATANABE, Hiroyuki SEIDA, Hideo HONMA
    2007 年 58 巻 10 号 p. 612
    発行日: 2007年
    公開日: 2008/04/24
    DOIhttps://doi.org/10.4139/sfj.58.612
    ジャーナル フリー
    抄録を表示する抄録を非表示にする
    Direct copper deposition on glass without etching is difficult to obtain by the conventional electroless copper treatment process. The formation of copper films on glass without exfoliation of copper from the glass substrate can be accomplished by introducing an alcohol treatment after the conventional sensitization and activation steps. This was followed by the electroless copper deposition.
    Adhesion strength was improved by heat treatment under an inert atmosphere. Furthermore, copper circuit patterns with widths of 4 to 6μm were formed by the semi-additive process.
    抄録全体を表示
    PDF形式でダウンロード (329K)
    • |<
    • <
    • 1
    • >
    • >|
feedback
 Top