表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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72 巻, 2 号
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小特集／MIおよびIoTと表面処理
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研究論文
  • 無電解Ni/Pd/Auめっきプロセスにおける各種接合特性に及ぼすNi皮膜の薄膜化の影響に関する検討
    加藤 友人, 寺島 肇, 八木 薫, 渡邊 秀人
    2021 年 72 巻 2 号 p. 110-116
    発行日: 2021/02/01
    公開日: 2021/02/05
    DOIhttps://doi.org/10.4139/sfj.72.110
    ジャーナル フリー
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    Recently, microfabrication of Cu wiring on printed circuit boards（PCBs）has advanced because of demand for the miniaturization and advancement of electronic devices. In the case of plating Ni（over 5 μm）/Pd/Au on PCB using conventional electroless Ni/Pd/Au plating processes, Ni deposition tends to occur outside of the Cu pattern. To resolve this difficulty, a Ni（under 1 μm）/Pd/Au film is plated on a fine Cu pattern. However, few reports have described the study of various surface mounting characteristics on the Ni（0.1 μm）/Pd/Au plating process. Therefore, we specifically assess the relations among various surface mounting characteristics and Ni film thickness（0.01-5 μm）on electroless Ni/Pd/Au plating. We obtained the following conclusions as a result of various observations. Ni film thickness under 0.05 μm is necessary to suppress the Ni deposition on the outside of the Cu pattern. However, Ni film thickness of greater than 0.1 μm is necessary to obtain good solder ball mounting characteristics. Also, Ni film thickness over 0.3 μm is necessary to obtain stable wire bonding characteristics.

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