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Mitsugu Yamaguchi, Satoshi Sakamoto, Hiroshi Usuki, Yasuo Kondo, Kenji ...
Session ID: D40
Published: 2011
Released on J-STAGE: September 01, 2011
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Effect of surface area ratio of pellets platen on fixed abrasive lapping characteristics
Michio Uneda, Yuya Kanno, Ken-ichi Ishikawa
Session ID: D44
Published: 2011
Released on J-STAGE: September 01, 2011
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This study aims to investigate the fixed abrasive lapping characteristics of diamond pellets (DP) and to propose the optimization method of the DP layout both experimentally and computationally. Here, in the optimization processing, we have examined for decreasing the deviation of the lapping distance. In this paper, the effects of surface area ratio of pellets platen on fixed abrasive lapping characteristics are discussed. As the results, the surface waviness decreases and lapping efficiency increases with increasing the surface area ratio.
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Makoto Inoue, Takuma Nozawa, Ryota Nozawa
Session ID: D45
Published: 2011
Released on J-STAGE: September 01, 2011
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Polishing characteristics in coagulating temperature of freezing liquid
Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida, Yuji Ogawa
Session ID: D46
Published: 2011
Released on J-STAGE: September 01, 2011
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Yoshihiko Sekine, Kenichiro Horio, Junichi Kaneko
Session ID: D47
Published: 2011
Released on J-STAGE: September 01, 2011
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Increased recycled machining water flow quantity (research bulletin)
Naohiro Nishikawa, Yoshinori Sato, Tasuku Kato, Kiyotaka Karita, Yoshi ...
Session ID: D62
Published: 2011
Released on J-STAGE: September 01, 2011
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In the machining, machining fluid (cutting oil, grinding fluid) which is contained oil, extreme pressure additive, surface active agent, rust-preventive agent etc. is used. However, because of greenhouse gas outbreak and high cost in effluent treatment (incineration and reclamation etc.), reduction of machining fluid using is demanded. In this investigation, the electric rust preventive machining method system which uses only water (tap water, industrial water, ground water) as machining fluid is developed. In this research bulletin, it is reported that improvement of machining water recycle system is carried out, and over 5L/min purification water which is refined by using reverse osmosis membrane and high pressure pump is achieved.
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Shinichi Ninomiya, Jun Yoshino, Manabu Iwai, Kiyoshi Suzuki
Session ID: D63
Published: 2011
Released on J-STAGE: September 01, 2011
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Development of key technologies to automate the surfactant treatment process
Yasuo Kondo, Satoshi Sakamoto, Kenji Yamaguchi
Session ID: D64
Published: 2011
Released on J-STAGE: September 01, 2011
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We have been developing a recycling system for water-soluble coolant. The recycling system consists of two major steps; surfactant treatment process and activated carbon filtration process. To automate the recycling system, we tried to introduce two key technologies into the surfactant treatment process; a detection system for end of reaction and a fluid-type processing system. A reflection-type photoelectric sensor can detect the end point of reaction efficiently, because the reflection rate converges to a constant value once the reaction is terminated. The emulsified oil is separated smoothly from the coolant by adding a surfactant even in the fluid-type processing system as well as the case of mixing tank system.
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Sachiko Ogawa, Rie Okamoto, Toshiki Hirogaki, Eiichi Aoyama, Keiji Oga ...
Session ID: D66
Published: 2011
Released on J-STAGE: September 01, 2011
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Cell manufacturing system which enables flexible high-mix low-volume production is required. It is required to downsize the cell itself due to the limited installation area inside the factory in cases of manufacturing for small parts. In this study, heat treatment process for small parts is focused on. Laser hardening for thin carbon steel sheet with a low power diode laser was carried out, and its hardened result and energy efficiency were investigated. As a result, through-thickness hardening for 0.5 mm thin sheet was obtained. Moreover, good energy efficiency was obtained compared to the conventional furnace hardening.
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Naoki Hara, Takashi Nakamura, Fumihiro Itoigawa, Shinya Hayakawa
Session ID: D67
Published: 2011
Released on J-STAGE: September 01, 2011
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It is desirable that grinding debris which pollutes machining surroundings will be captured at the grinding point. In this study, a grinding wheel with suction holes is tested for the simultaneous removal of grinding debris. The grinding debris is observed by a high-speed video camera immediately after its generation, and the relation between wheel velocity and debris velocity is revealed. Based on those results, it is predicted that air flow rate, port diameter and the amount of holes affect debris capture rate primarily. More than 90 percent of debris around holes is captured in verification experiment, which suggests the fusibility of debris-less grinding.
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Toshiaki Wakabayashi, Toru Kakihara, Junji Kuhara, Toshifumi Atsuta, A ...
Session ID: D68
Published: 2011
Released on J-STAGE: September 01, 2011
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Ryouhei Fukushima, Yasuo Suzuki, Katuhiko Sakai
Session ID: D69
Published: 2011
Released on J-STAGE: September 01, 2011
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Masahiro Anzai
Session ID: D73
Published: 2011
Released on J-STAGE: September 01, 2011
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Analysis of Cutting Process using 3D-CAD and Cutting Tests
Hiroyasu Iwabe, Masanori Futakawa
Session ID: D74
Published: 2011
Released on J-STAGE: September 01, 2011
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This paper deals with an analysis of the chip area and cutting performance of radius end milling of an inclined surface using a contour path method. At first, the modeling of a cutter, an edge, a rake surface and a workpiece with an inclined surface are carried out using 3D-CAD. Secondly, the chip area is calculated by the interference of the rake surface and the chip volume. The influence of the cutting method and the direction of pick feed on the behavior of the chip area and the influence of the inclination angle of the machined surface on the maximum chip area are shown. Also, the cutting force and surface roughness are measured by cutting tests and considered the cutting process. Further, considered a cutting condition which would be expected a good cutting performance.
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Wataru Takahashi, Mitsuyoshi Nomura, Masami Masuda, Takayuki Shibata, ...
Session ID: D75
Published: 2011
Released on J-STAGE: September 01, 2011
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Chihiro Suzuki, Kazuo Kasahara, Akihiko Hirota
Session ID: D76
Published: 2011
Released on J-STAGE: September 01, 2011
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By using a CNC lathe having a tool (milling) spindle, machining of a shaft which has a flat surface or a straight groove on the peripheral surface can be performed with one machine tool. However, when milling a workpiece having a small flexural rigidity, deflections and vibrations of the workpiece caused by the cutting force deteriorate the machining accuracy and surface roughness at the grooved portion. In this report, in order to analyze the behavior of workpiece deflection and the mechanism of machined surface generation when slot milling is performed on a shaft using a ball end mill, cutting forces are predicted by applying a cutting model and an energy method proposed in previous papers. The results obtained for the milling process when the tool was fed perpendicular to the center line of a shaft are shown. The variation of geometrical quantities such as the tool-workpiece contact region, distribution of the undeformed chip thickness along the cutting edge, and the area of cutting cross-section and cutting forces relative to the tool location on the workpiece, are identified.
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Yui Sudo, Yasuhiro Kakinuma, Kohei Ohnishi, Tojiro Aoyama
Session ID: D77
Published: 2011
Released on J-STAGE: September 01, 2011
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This paper presents a sensor-less process monitoring method to detect chatter vibration in square end milling. The method of detecting chatter vibration using external sensors such as accelerometer and force sensor has been proposed. However, using external sensors increases the cost of manufacturing systems. Therefore, a novel method without using any external sensors is developed to detect chatter vibration. Disturbance torque acting on the spindle is estimated by using disturbance observer and used simultaneously for spectrum analysis. From the experimental results, it is confirmed that the proposed method enables to estimate high-frequency disturbance such as chatter vibration.
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Kousuke Kuroda, Hiroyuki Sasahara, Hiroshi Matsuda
Session ID: D78
Published: 2011
Released on J-STAGE: September 01, 2011
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Keiichi Kikuta, Takatoshi Nishikawa, Takahiro Tsutsumoto, Hiroyuki Yam ...
Session ID: D79
Published: 2011
Released on J-STAGE: September 01, 2011
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Ken Okutani
Session ID: E01
Published: 2011
Released on J-STAGE: September 01, 2011
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Takahisa Okuzono, Keiichi Kimura, Panart Khajornrungruang, Keisuke Suz ...
Session ID: E03
Published: 2011
Released on J-STAGE: September 01, 2011
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Effect of Serial Batch Polishing Tests on Polishing Pad Surface Texture and Polishing Characteristics
Kenji Okabe, Michio Uneda, Yuki Maeda, Norihiko Moriya, Kazutaka Shibu ...
Session ID: E04
Published: 2011
Released on J-STAGE: September 01, 2011
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In the polishing process, the removal rate is affected by changing the pad surface texture due to the deterioration, etc. Therefore, the measurement and quantitative evaluation methods for geometric characterization of polishing pad surface texture are being attempted actively in various research institutes. Here, we have proposed a measurement method for polishing pad surface texture based on contact image analysis using image rotation prism as the four evaluation parameters; (1) number of contact points, (2) contact ratio, (3) spacing of contact points and (4) spatial FFT result of a contact image. In this paper, we demonstrated the serial batch polishing tests and evaluated changing in the pad surface texture with increasing number of polishing test. As the results, it is clear that there are remarkably correlation between the evaluation parameters and the removal rate.
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Tatsunori Omote, Michio Uneda, Kenji Okabe, Ken-ichi Ishikawa
Session ID: E06
Published: 2011
Released on J-STAGE: September 01, 2011
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In the polishing process, the conditioning processing is widely used for regeneration of pad surface texture. Nowadays, the performance evaluation of conditioner is demanded on user's experience, and it is important to develop the new technique for quantitatively evaluation. With above backgrounds, we propose the non-contact measurement evaluation using digital image correlation (DIC) method from a viewpoint of the micro deformation of pad surface texture by the conditioning processing. In this paper, we discuss two experiments; (1) the accuracy evaluation for pad surface displacement, and (2) the micro deformation distribution characteristics of pad surface texture. As the result, we found the following two points. (1) The DIC can measure the micro deformation distribution characteristics of pad surface texture quantitatively. (2) There are remarkably relationships between the micro deformation characteristics of pad surface texture and conditioning conditions such as conditioning time, mesh size of conditioner grains.
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Akira Isobe, Shinichi Haba, Hideaki Nishizawa
Session ID: E07
Published: 2011
Released on J-STAGE: September 01, 2011
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Keisuke Yasuda, Keiichi Kimura, Keisuke Suzuki, Panart Khajornrungruan ...
Session ID: E08
Published: 2011
Released on J-STAGE: September 01, 2011
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- 2nd report : Study on de-noising by use of complex wavelet transform -
Libo Zhou, Masashi Ono, Kazutaka Nonomura, Hirotaka Ojima, Teppei Onuk ...
Session ID: E09
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Mamoru Nakamura
Session ID: E13
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Nobuki Ozawa, Muneyuki Ishikawa, Momoji Kubo
Session ID: E15
Published: 2011
Released on J-STAGE: September 01, 2011
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In this study, we investigated characteristics of chemical mechanical polishing based on its structure and charge calculated by molecular dynamics simulations and first principles calculations. In the structure of 40% La-doped CeO2 (Ce0.6La0.4O1.8) nano cluster, the oxygen atoms hop between oxygen atom defects and diffuse from its surface to its center. Moreover, since oxygen deficiency state occurs on the surface of the cluster due to the oxygen atom diffusion, the Ce atoms on the surface are barely formed. According to the calculated charge of the cluster, the valence values of the Ce atoms on the surface decrease from +IV to +III after the oxygen atoms′ diffusion. When this Ce atom approaches to the bare oxygen atom on the SiO2 surface, the valence value of the Ce atom changes from +III to +IV, and the Si-O bond weakens due to the chemical reaction between the Ce atom and SiO2 surface. Therefore, the oxygen defects created by doped La atoms in the CeO2 nano cluster prompts the chemical mechanical polishing process.
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Seiichi Suda, Takayuki Honma, Koichi Kawahara, Kumiko Kinoshita
Session ID: E16
Published: 2011
Released on J-STAGE: September 01, 2011
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Conventional ceria-based abrasive shows an excellent glass polishing performance. However, decreases of total amount of cerium and/or development of alternate abrasives are required from the viewpoint of the supply instability of cerium. Therefore, the mechanism of glass polishing using the conventional abrasive is necessary to be clarified for development of alternate abrasives. We have paid particular attention to the effect of rare-earth doping into ceria abrasives on the glass polishing performance, because La has been revealed to be resolved into ceria lattice. Glass polishing using rare-earth doped ceria abrasives revealed that the doping has a positive effect on the polishing performance. Moreover, the polishing performance of doped ceria was found to depend on the dopant element.
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Takayuki Honma, Seiichi Suda, Koichi Kawahara, Kumiko Kinoshita
Session ID: E18
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Ceria is an excellent abrasive for glass polishing. Ce3+/Ce4+ redox would play an important role during glass polishing using ceria-based abrasive. We have developed an alternative abrasive because of increasing cost and unstable supply of ceria abrasives. We currently focused on the glass polishing characteristics using Fe-based perovskite oxide (SrFeOx) as a candidate. Fe3+/Fe4+ redox would occur as a result of glass/abrasive interaction. In this study, we studied the effect of Co doping into SrFeOx on the glass polishing characteristics. It was found that the removal rate was improved by doping Co into SrFeOx.
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Hiroshi Ikeda, Takayuki Kusumi, Yoichi Akagami, Tomohiro Taniguchi, Sy ...
Session ID: E19
Published: 2011
Released on J-STAGE: September 01, 2011
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We have developed some novel fundamental polishing method of glass substrate for IT devices. We obtained the good polish rate under high rotational relative speed between glass specimen and polishing pad using AC electric field. And we clarified that the generated friction heat between pad and specimen under high rotational speed promoted the chemical reaction at polishing surface of specimen and mproved polishing rate. We have obtained double polishing rate to be compared with conventional polishing conditions.
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Basic processing characteristics and effect of polishing in radical environment.
Tsutomu Yamazaki, Toshiro Doi, Shuuhei Kurokawa, Osamu Ohnishi, Yoji U ...
Session ID: E20
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Yu Moriwaki, Toshiro Doi, Shuhei Kurokawa, Tsutomu Yamazaki
Session ID: E21
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Takahiro Maruyama, Yu Moriwaki, Satoshi Fukao, Tsutomu Sawano
Session ID: E23
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Kohei Tsujimoto, Junichi Ikeno, Hideo Shibutani, Yohei Nanbu, Kazuhiro ...
Session ID: E24
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Makoto Sato
Session ID: E25
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Yasuhisa Sano, Kenta Arima, Kazuto Yamauchi
Session ID: E31
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Tadashi Hasegawa, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Tao Yin ...
Session ID: E33
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Grinding efficiency of Si and SiC
Yoshito Sato, Masayuki Kobayashi, jyunichi Ikeno, Hideo Shibutani
Session ID: E34
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Takayuki KUSUMI, Yasuhiro SATO, Yoichi AKAGAMI, Noritsugu UMEHARA
Session ID: E36
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Authors have been developed a novel polishing method using functional fluids which are dispersed abrasives with silicone oil. This fluid shows active reciprocate motion between electrodes under AC electric field at very low frequency. In order to obtain the excellent silicon carbide substrate for next generation power semiconductor, we have tried polishing test under AC electric field using the slurry that dispersed the silicon carbide abrasives with the silicon oil. We have confirmed the increased polishing rate in proportion to electric field strength.
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Experimental production and evaluation of a porous chuck for grinding and polishing a 450-mm wafer
Shoko Yoshida, Seiichi Fukuoka, Kosuke Hirose, Atsunobu Une, Kenichiro ...
Session ID: E37
Published: 2011
Released on J-STAGE: September 01, 2011
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Atsunobu Une, Kenichiro Yoshitomi, Masaaki Mochida, Seiichi Fukuoka, S ...
Session ID: E38
Published: 2011
Released on J-STAGE: September 01, 2011
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Within a few years, a 450-mm large wafer will be used to develop next-generation semiconductor devices and to raise volume efficiency. When this occurs, the ″22 nm rule″ will require a site flatness of less than 22 nm across the entire top surface of all wafers. The flatness of less than 0.2 μm has been achieved for a 300-mm wafer using the optimum oscillation-speed control polishing. This paper describes the relation between a grinding profile and the inclination of a grinding wheel for a 450-mm wafer, a flatness degradation of the 450-mm wafer, and a comparison between the grinding profiles and the calculated results, where it was assumed that the moving path of the grinding wheel is accurately transferred to the ground wafer surface including its center portion. The grinding profiles due to the inclination of the grinding wheel were calculated. The flatness of the 450-mm wafer degrades beyond twice for that of the 300-mm wafer under the wheel conditions with the same diameter and inclination. The calculation results were roughly consistent with the experimental results. Good flatness of less than 1 μm over the entire surface was achieved with a precise inclination adjustment method.
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Estimation about fixture position of workpiece on machine table with consideration of motion on translational axes
Junichi Kaneko, Kenichiro Horio
Session ID: E43
Published: 2011
Released on J-STAGE: September 01, 2011
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Naohiko Miwa, Junichi Kaneko, Kenichirou Horio
Session ID: E44
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Tatsuya Hikichi, Keiichi Nakamoto, Tohru Ishida, Yoshimi Takeuchi
Session ID: E45
Published: 2011
Released on J-STAGE: September 01, 2011
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Koji Hasegawa, Keiichi Nakamoto, Tohru Ishida, Yoshimi Takeuchi
Session ID: E46
Published: 2011
Released on J-STAGE: September 01, 2011
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(6th report: Program Generation Utilized by the New Numerical Controller Function)
Yukitoshi Ihara, Yuki Hiramatsu, Tatsuya Matsuno
Session ID: E47
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Interpolation accuracy test methods for five-axis machining center by using ball bar will soon be adopted in ISO. One of the tests is by moving a cone frustum path that is equivalent to cutting test described in NAS979. However, the NC programs for the ball bar tests are sometimes difficult by conventional CAM software since ball bar test are without cutting operation. In this report, NC program generation methods for cone frustum ball bar test are introduced by taking new NC functions for 5-axis machining into account, such as Tool Center Point control, Tool Posture control.
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Yu Nagatsu, Masanori Kawamoto, Masuhiro Nitta, Kiyotaka Kato
Session ID: E61
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Keitaro Kuba, Natsuki Yamanobe, Tatsunori Hara, Hajime Asama, Tamio Ar ...
Session ID: E62
Published: 2011
Released on J-STAGE: September 01, 2011
CONFERENCE PROCEEDINGS
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Complementing DOFs by using virtual plane
Yuki Amauchi, Akihiro Hara, Hiroyuki Hiraoka
Session ID: E63
Published: 2011
Released on J-STAGE: September 01, 2011
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Authors propose a method to perform remote controlled assembly by operations with a small number of degrees of freedom (DOFs). A system is developed to perform remote controlled 6DOF assembly by 1DOF operations. A method is described that complements difference between DOFs of user operation and those of manipulator motion by using a virtual plane. The plane represents the DOF operated by user and the DOFs automatically generated by the control system. The concept of the method is reported in this paper with its preliminary experimental results.
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