表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
58 巻 , 6 号
選択された号の論文の9件中1~9を表示しています
小特集/バルブメタルの陽極酸化時の絶縁破壊とその応用
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研究論文
  • 半沢 啓子, 吉原 佐知雄, 白樫 高史
    2007 年 58 巻 6 号 p. 366
    発行日: 2007年
    公開日: 2007/12/23
    ジャーナル フリー
    The attention has been paid to the magnetic grinding method as a new technology that replaces the Chemical Mechanical Polishing (CMP), and this study was aimed to develop a novel magnetic abrasives. Conventionally used hard and heavy magnetic abrasives like iron produce a strong power in the process of magnetic grinding method and are therefore not suitable to be used for CMP that normally requires nano fabrication. Hence, a new magnetic abrasive has been made using electroless Ni-Co-diamond composite coatings on the light resin particle (specific gravity : 1.1). The newly-developed magnetic abrasive was practically applied in the process of magnetic grinding method, so that the copper layer of damascene sample was ground.
  • Yuji TANNO, Eiichi SUGANUMA
    2007 年 58 巻 6 号 p. 371
    発行日: 2007年
    公開日: 2007/12/23
    ジャーナル フリー
    The initiation behavior of etch pits on the microstructure of aluminum capacitor grade foil was investigated. The microstructure, which consists of a fine network of cells, approximately less than 1μm in diameter, was revealed by the chemical polishing process of high-purity aluminum. Two series of 99.99wt.% pure aluminum specimens in the form of 100μm thick foils were prepared. One series of foils contained copper in the range of 1 to 300wt.ppm, and the other contained lead from 0.2 to 1.5wt.ppm. Observation and analysis for the reaction morphology after treatments were employed using SEM, AFM and analytical TEM. The cellular size changed on the basis of the amount of copper and lead and the chemical polishing time. Concerning the pit initiation during electrolytic etching, the cellular structure of the aluminum foil was examined in order to clarify the role of the copper and lead. The etching was carried out in a hydrochloric acid solution using a square anodic pulse current. Several examples of the electrochemical attack on different amounts of the impurities and at various orientations are presented. The first step of the preferential sites for pit initiation during the electrochemical action predominately occurred on the wall leading to the interior of the cellular structure.
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