表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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66 巻, 6 号
選択された号の論文の9件中1～9を表示しています
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小特集／小特集：熱を制御する表面技術
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研究論文
  • シランカップリング処理によるアルミニウム薄膜の腐食抑制作用
    馬渕 勝美
    2015 年 66 巻 6 号 p. 266-276
    発行日: 2015/06/01
    公開日: 2016/06/01
    DOIhttps://doi.org/10.4139/sfj.66.266
    ジャーナル フリー
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    Improving the corrosion resistance of a thin aluminum film by surface treatment using 1, 2-Bis(triethoxysilyl)ethane(BTSE), Bis(triethoxysilyl)propyl)tetrasulfide(BTSPS), and Bis(trimethoxysilylpropyl)amine(BTSPA)was evaluated. A thin silane coupling layer of BTSE or BTSPS was formed on the film by immersion in a BTSE-ethanol or BTSPS-ethanol solution, thereby markedly improving both the general and pitting corrosion resistance of the film. The pitting potential shifts to the noble side. The quantity of the silane coupling molecule regarding BTSE or BTSPS increases markedly with the dipping time. These behaviors might be explained by the hard and soft acid-base(HSAB) principle. However, the corrosion resistance of the Al film immersed in BTSPA decreases because the formation of corrosion resistance deteriorates, producing a crude thick film. Clarifying the mechanism by which the corrosion-resistant improvement is affected by the silane coupling treatment requires elucidation of the chemical properties of the silane coupling layer: not only the silane coupling layer moldability based on the HSAB principle, but also the ion permeability.
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  • 硫酸銅めっき厚膜における残留応力の増加要因とその抑制
    小倉 圭輔, 阿部 陽介, 柴田 正実
    2015 年 66 巻 6 号 p. 277-281
    発行日: 2015/06/01
    公開日: 2016/06/01
    DOIhttps://doi.org/10.4139/sfj.66.277
    ジャーナル フリー
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    This study investigated the effect of current density and concentration of bis(3-sulfopropyl)disulfidedisodium(SPS)upon the residual stress of copper sulfate plating. The residual stress increased because of increasing lattice strain with current density. Moreover, the lattice strain increased with hydrogen entrapped in the grain boundary of Cu films. Results clarified that residual stress was suppressed concomitantly with increased SPS concentration. During self-annealing of small grains, the residual stress is reduced by electrodeposition of a high concentration of SPS.
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