[in Japanese]

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Deformation of solder joints was evaluated by electromotive force that was generated due to strain energy. The solder joints of SnPb and SnAgCu were tested. Strain energy of shear fracture was smaller than that of pull fracture.

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Electrodeposited SnCu coating on two different Cu leadframes showed drastically different tendencies of whisker initiation for long term storage at RT. Whisker initiation & suppression mechanism, which can explain the interrelation among minor elements in leadframe, IMC formation morphologies, compressive stresses, and whisker initiation tendencies, was established. Compressive stress distribution, Sn diffusion along GB, whisker root position, and whisker grain orientation were investigated to clarify the mechanism quantitatively by FEA/ED calculations and EBSP measurement.

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[in Japanese]

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The relation of the result of the insulation reliability test between"HHBT" and "HAST" was investigated with the printed circuit board with THinsulation pattern.We will introduce the case of finding "HAST" results accelerated from"HHBT" results.

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In the present report, we proposed a new method to monitor the temperature around the drilled hole by an infrared camera. Moreover, we also proposed a new method to observe the change of resin around the drilled hole after drilling in the case of ultra-micro drilling. From these results, we invesitigate to select the drilling conditions to achive the high quality drilling.

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In surface treatment to the package board, electroless Ni - P / Au plating is used widely. In addition, the P content in an electroless Ni - P plating film is about 5-9%. However, for high reliability, an electroless Ni - P / Pd / Au plating process is examined. A film of P content 5% was most suitable as a result that we examined optimization of P content in an electroless Ni - P plating film in the electroless Ni / Pd / Au process.

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A new core PWB has been developed by utilizing CFRP (Carbon Fiber Reinforced Plastics) to mount large-scale ceramic packages. We have confirmed that the CFRP core PWB developed show higher heat dissipation and lower thermal expansion than the conventional glass-epoxy and aluminum core PWB.

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The interface after wire bonding process and the change in the surface state of the wire were examined by using EPMA, AES, and XPS for Pd-plated Cu bonding wire. We found that the surface of first ball portion after bonding was coated with Pd, and was advantageous in respect of the oxidation prevention of Cu and stability to the prolonged storage was excellent.

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The Roll to Roll (R2R) method use for fine pitch patterning of screen printer system. (RTS)*We achieved fine pattern to the film roll by applying the screen print technology and the drum stage. It is the feature of this system synchronizing drum stage with roll film (relative displacement of squeegee speed). The drum stage and squeegee the stencil mask and print straight the contact doing on the film. It is possible to correspond to fine pattern wiring in a print and a substrate of an internal electrode of the Multi Layer Ceramic Capacitor (MLCC).

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A negative-type photosensitive poly(ether sulfone) (PSPES) based on PES, a novel cross-linker 4,4'-methylene-bis[2,6-bis(methoxymethyl)phenol] (MBMP) having good miscibility with PES, DIAS as a PAG has been developed.This resist consisting of PES/MBMP/DIAS=85/10/5wt% showed a high sensitivity of 21 mJ/cm2 and a contrast of 2.1 when it was exposed to i-line post-exposure baked (PEB) at 170oC for 3 min, and developed with DMAc at room temperature. A fine negative image featuring 4 um L&S pattern was obtained on the film exposed to 150 mJ/cm2 of i-line.

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C60 fullerene micro pillars have been successfully prepared on alumina membranes.The vertically aligned fullerene micropillars have a tubular structure with an inner diameter of a few tens of micrometers and a length of a few hundred micrometers. The will find wide application in electrodes, semiconductor devices and so forth.

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Swelling behavior for fine package photosensitive dry film resists during development was measured by using the Quartz Crystal Microbalance (QCM). As a consequence, hydrophobic dry film resists absorbed less water and showed less swelling. Moreover, hydrophobic resists showed fine line resolution. The resolution of resists was affected by swelling during development.

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We have studied the reliability for all layer plated laser via type PWB.This type of PWB consists of glass epoxy as insulation layer, cupper foil as conductor layer and plated cupper as via hole for interconnect layer to layer. We evaluated the reliability of this type of PWB, and found that the thermal stress is concentrated on the inner layer via (IVH) compared with conventional build up type of PWB. Therefore we studied the lower thermal stress structure of all layer plated build up type PWB.

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