IEEJ Transactions on Sensors and Micromachines
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
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Volume 136, Issue 2
Displaying 1-8 of 8 articles from this issue
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Paper
  • On-chip High-voltage Silicon Photovoltaic Cell Array Made by a CMOS Post-processed Device Isolation Method for Driving a MEMS Actuator in a Remote Manner
    Isao Mori, Masanori Kubota, Eric Lebrasseur, Yoshio Mita
    2016 Volume 136 Issue 2 Pages 24-30
    Published: February 01, 2016
    Released on J-STAGE: February 01, 2016
    DOIhttps://doi.org/10.1541/ieejsmas.136.24
    JOURNAL FREE ACCESS
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    A small autonomous device that integrates MEMS, CMOS and photovoltaic (PV) cells has various attractive applications. However, high voltage such as 100 V is often required to drive MEMS actuators, while a single silicon PV cell generates around 0.7 V at maximum. The authors propose a method to fabricate an on-chip high-voltage silicon PV cell device out of standard silicon PV cells for driving a MEMS actuator remotely. The device consists of many PV cells connected in series with suspended bridge wiring formed with a batch post-process. It is compatible with a standard CMOS process, and therefore monolithic CMOS-MEMS-PV integration can be easily achieved. In this paper, the fabrication method and the basic characteristics such as open circuit voltage (VOC) and short circuit current (ISC) are shown. The VOC and ISC are proportional to the number of cells in series and the area of a cell respectively. Then, a demonstration of remote power feed and control of a MEMS actuator with the proposed PV device is reported.
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  • Improve the Adhesive Strength of the Leadframe and Epoxy Resin by Forming of Organic Molecules-metal Composite Interface
    Ryota Furuno, Yoshiyuki Takatuji, Kimihiko Kubo, Tetsuya Haruyama
    2016 Volume 136 Issue 2 Pages 31-35
    Published: February 01, 2016
    Released on J-STAGE: February 01, 2016
    DOIhttps://doi.org/10.1541/ieejsmas.136.31
    JOURNAL FREE ACCESS
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    Delamination in semiconductor plastic package is a cause of reliability degradation. We have tried to improve the adhesion strength between leadframe and epoxy resin. In this study, organic molecules-metal (Cu) complex “EC tag (Cu)” were employed. It is immobilized on the leadframe surface as adhesion promoter to adhere with thermosetting epoxy resin. In the results, immobilized EC tag (Cu) act as adhesion promoter that shows greater adhesion between leadframe and epoxy resin. Also the leadframe with adhesion promoter doesn't affect semiconductor assembly characteristics.
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  • Proximity and Tactile Measurement Using a Layered Projected Capacitive 3D Touch Screen
    Satoshi Tsuji, Teruhiko Kohama
    2016 Volume 136 Issue 2 Pages 36-40
    Published: February 01, 2016
    Released on J-STAGE: February 01, 2016
    DOIhttps://doi.org/10.1541/ieejsmas.136.36
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    Touch screens have been more commonly used as interfaces. Most of these touch screens detect the point of contact between the touch screen and an object. In this paper, we proposed a layered projected capacitive 3D touch screen to detect the object both before and after contact (3D range) on the display. The proposed sensor layered two projected capacitive sensor. The top sensor detects the object and position at proximity range. In addition, the top sensor identifies the materials, and bottom sensor detects indentations and the precise position on contact. Through experiments, we confirmed that the proposed 3D touch screen can detect the object both before and after contact. The 3D touch screen may be used as functional and useful interface.
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Letter
  • High Aspect Ratio SiO2 Pillar Structures Capable of the Integration of an Image Sensor for Application of Optical Modulator
    Nguyen Van Toan, Suguru Sangu, Takahito Ono
    2016 Volume 136 Issue 2 Pages 41-42
    Published: February 01, 2016
    Released on J-STAGE: February 01, 2016
    DOIhttps://doi.org/10.1541/ieejsmas.136.41
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    This paper presents an optical window capable of the integration of an image sensor for the application of optical modulators. The optical window consists of high aspect ratio SiO2 pillars that can modulate the transmission light intensity by moving a liquid in and out of the spaces between pillars. The high aspect ratio SiO2 pillar structures are fabricated by reactive ion etching (RIE). SiO2 pillars together with smooth surfaces, vertical shapes (base angle ∼ 89.5°) and high aspect ratio of 12 with a depth of 12 µm, diameter of 1 µm, and the pitch of two pillars of 2 µm have been achieved. An optical window with and without liquid penetration area integrated with an image sensor for an optical modulator has been successfully demonstrated. A high transmission modulation together with a large contrast have been observed of approximately 65% and 0.86 for cases with and without matching oil penetration, respectively.
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