We demonstrated that the DNA metallization technique using reducing group-labeled intercalator molecules permits dsDNA (double-stranded DNA) molecules to be specifically metallized while not permitting metallization of ssDNA (single-stranded DNA) molecules. First, dsDNA and ssDNA molecules were stretched on a mica surface using spin-coating technique, and metallization process was conducted. AFM observation showed that only dsDNA molecules were metallized, resulting in formation of nanowires with a diameter of about 11 nm. Secondly, dsDNA and ssDNA molecules were stretched and immobilized between two microelectrodes. Impedance analysis showed that the electrical conductivity of only dsDNA was drastically increased after the metallization process.

In this paper, we fabricated periodic micro-bump array structure on Si substrate to evaluate their tactile sensations. Fine-edged Si micro-bump array structures can be easily fabricated by photolithography and dry etching processes. Sensory evaluation of tactile feeling of roughness and frictional resistance with human finger was conducted with paired comparison method. In addition, friction coefficient between the micro-bump array and an artificial finger model that mimics our fingertip was evaluated. The result of sensory evaluation showed that rough feeling was affected by edges of the micro-bump structures even though the grooves between the micro-bumps were narrow as 20 µm. In contrast, frictional resistance feeling did not depend on the effect of the edges. It was strongly affected by a contact area between the micro-bump structure and finger skin. When the width of the grooves between the bump were 100 µm, finger skin entered and touch the bottom of the grooves, and then, the rough feeling and frictional resistance feeling were increased due to the contact area increment. The rough feeling and frictional resistance feeling have little correlation with the frictional coefficient measured with artificial finger model. It was more easy for human skin to enter the narrow grooves, in particular when the groove width was 100 µm.

Yttria-stabilized zirconia (YSZ) for the initial buffer layer of lead zirconate titanate (PZT) was epitaxially deposited on a 4 inch Si wafer by radio-frequency magnetron sputtering, which was potentially applicable to mass-production. To avoid excessive oxidation of a Si surface, a seeding later was formed on Si by repeating the sputter-deposition and thermal oxidation of metallic Zr and Y. On the seed layer, YSZ was deposited up to 100 nm in thickness by reactive sputtering at 800℃. Cube-on-cube epitaxial growth and excellent crystallinity were confirmed by X-ray diffraction (XRD). On the buffer layer including YSZ at the bottom (YSZ/CeO₂/LSCO/SRO), monocrystalline doped-PZT (PMnN-PZT) was grown by sputter-deposition, demonstrating the usefulness of the developed YSZ buffer layer deposition technology.

This paper reports the sensitivity of various Eu(TTA)₃-based temperature sensitive paints (TSPs) which can be used in an infrared thermal imaging device. Two types of polymer binders (PSAMS and PVB) mixing with various concentration of Eu(TTA)₃ were prepared and examined. The TSP using PSAMS had a higher temperature sensitivity compared with that using PVB when the temperature was less than 38^oC. The maximum sensitivity as high as 9.0%/ ^oC was obtained by mixing 360 mg of Eu(TTA)₃ with 1 g of PSAMS. The theoretical model of a thermal imaging device reveals that the temperature sensitivity of TSP has a great impact on the performance of the thermal imaging device. A NETD as small as 0.16 K can be obtained by using the high sensitive TSP developed here.

We propose the design for three-dimensional (3-D) scanning micromirror with single pair of beams. A 3-D scanning micromirror is powerful solution for projection/detection of a 3-D image in tiny devices. We succeed in designing and fabricating the micromirror having three separated resonance modes (two torsion modes and one parallel mode) with high fill-factor. Our design of single pair of beams can contribute to simpleness and compactness of a 3-D scanner because of easy fabrication and high fill-factor.

A micro-gripper of reversible operation mechanism was designed and fabricated from a flash-evaporated SMA film of 30 µm in thickness. Thin film Pt heaters, strain gauges, and Pt-Au thermo-couple circuits were integrated on the SMA gripper. The gripper is closed at low temperature because both outer and inner arms of the gripper were similarly deflected due to intrinsic film stress. The gripper has a mechanism to be opened by the outer arm heating for flat shape recovery. The deflection propertied of the SMA gripper was evaluated. The outer arm of the gripper was reversibly deformed to 15 µm or larger when it was heated in water. The gripper was not opened enough for gripping thick bio-films because the temperature of the SMA outer arm was not reached to the peak deformation temperature of the SMA film (～60^oC). The inner arm was also deformed to several microns due to the thermal conduction from the heated outer arm. In air operation, the heated outer arm and non-heated inner arm were deformed to 45 µm and 15 µm, respectively. The outer arm was heated to 300^oC which was too high to use for bio-film handling. Spring constants of the inner arm were measured as 29.4 N/m which corresponds to a gripping force of 1.6 mN when a 50 µm thick sheet is held by the gripper.