電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
138 巻, 10 号
選択された号の論文の13件中1~13を表示しています
特集:社会インフラセキュリティのためのセンサシステム
巻頭言
特集論文
論文
  • 森田 翼, 佐野 晃司, 山口 富治, 原 和裕
    2018 年138 巻10 号 p. 471-476
    発行日: 2018/10/01
    公開日: 2018/10/01
    ジャーナル フリー

    NH3 gas is a poisonous substance that adversely affects the environment and humans. A low level NH3 is created by human bodies and emitted as a component of urine and exhaled breath. Therefore, the detection of NH3 gas is important to monitor human health conditions. A novel WO3 multiple-layered thin film NH3 sensor using Pt catalyst has been developed in this study. WO3 thin film coated with Pt nanoparticles successfully improves the sensitivity to NH3 gas. Furthermore, WO3 multiple-layered thin film with an interspace has the effect of enhancing the sensitivity and lowering the optimum operating temperature. The developed sensor can detect as low as 1 ppm NH3 gas.

  • 祐川 侑司, 中本 高道
    2018 年138 巻10 号 p. 477-484
    発行日: 2018/10/01
    公開日: 2018/10/01
    ジャーナル フリー

    There has been so far few odor sensors with an array of the biosensor elements. However, an odor sensor constructed in this fashion is expected to have high performance in terms of the ability to discriminate between odorants. In this study, a parallel lock-in measurement circuit was developed to acquire the fluorescent image of the cells even under an ambient light. Since that circuit can extract only the responses of the cells from the fluorescent image, its output represents a specific pattern corresponding to the odorant. Therefore, principal component analysis was applied to that output in order to confirm the availability of the odorant discrimination by using a fluorescent image. It was found that the output pattern from the developed circuit included information enough to discriminate between at least two types of odorants.

  • —厚いAu膜フィードスルーの気密性と高周波特性—
    森山 雅昭, 鈴木 裕輝夫, 戸津 健太郎, 平野 栄樹, 田中 秀治
    2018 年138 巻10 号 p. 485-494
    発行日: 2018/10/01
    公開日: 2018/10/01
    ジャーナル フリー

    Au-Au-bonding-based wafer-level vacuum packaging technology using in-plane feedthrough of thick Au signal lines was developed for RF MEMS. Compared with conventional technology based on glass frit bonding, the developed technology is advantageous in terms of smaller width of sealing frames, lower process temperature and smaller amount of degas. To guarantee the hermetic sealing, the adhesion between the thick Au lines and a SiOx dielectric frame is improved by an Al2O3 interlayer by ALD (Atomic Layer Deposition). The steps of the dielectric frame above the thick Au lines are absorbed by an electroplated Au seal ring planarized by fly cutting. The thermocompression bonding of the Au seal rings of 20∼100 µm width was done at 300ºC. A cavity pressure of about 500 Pa or lower was measured by “zero balance method” using Si diaphragms. Vacuum sealing was maintained for more than 19 months, and the leak rate is less than 8×10-16 Pa m3/s. The isolation of open signal lines was measured up to 10 GHz for different designs of the sealing ring and SiOx dielectric frame. The influence of the in-plane feed through to the isolation is as low as 2∼3 dB, if the width of the sealing ring is 20 µm and the thickness of SiOx dielectric frame is larger than 10 µm. The developed wafer-level packaging technology is ready for applications to an RF MEMS switch.

部門記事
 
feedback
Top