電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
138 巻, 12 号
選択された号の論文の11件中1~11を表示しています
特集:生体情報センシング技術
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特集論文
  • 伊藤 正彦, 小山 勇也, 西山 道子, 柳澤 恵美, 林 真理子, 渡辺 一弘
    2018 年 138 巻 12 号 p. 525-532
    発行日: 2018/12/01
    公開日: 2018/12/01
    ジャーナル フリー

    In this study, we developed a flexible motion sensor that is able to be pasted to the body skin by embedding a hetero-core optical fiber sensor in a medical tape. The proposed sensitive tape detects the small stretch and bend without temperature compensation by using a simple equipment incorporating a light emitting diode and a photodiode. Firstly, a sensitive tape was tested the sensor performance for stretch and bend. Body joint movements were measured by the sensitive tapes pasted on the body. In addition, nursing movements were monitored by the eight sensitive tapes placed on body joint segments including the arm, shoulder, waist, and thigh. The differences of nursing movements were obtained by the sensitive tapes tracking the small change on the skin. The results showed that the proposed sensitive tape can detect the deformation of the skin only by being pasted on the skin and can measure the body motion without constraint to the body.

  • Taiki Yasui, Shota Yamagiwa, Hiroshi Kubo, Shinnosuke Idogawa, Yoshihi ...
    2018 年 138 巻 12 号 p. 533-538
    発行日: 2018/12/01
    公開日: 2018/12/01
    ジャーナル フリー

    TSV (Through-Silicon Via) is a technology, which realizes an electrical connection from the surface to the backside of the silicon (Si) substrate, offering advantages of device minimization for bioprobe applications. To realize the TSV, copper (Cu) has widely been used as the via material. However, Cu cannot be used for a high temperature process (e.g., 700°C for Si growth process). To realize TSVs for high temperature processes, here we propose a poly-Si-based ‘two-step TSV', which consists of different hole sizes at the surface and bottom of the Si substrate. By utilizing deep reactive-ion etching (RIE), a 50-µm-diameter and 240-µm-depth hole was formed on the backside of the substrate, while a 12-µm-diameter and 10-µm-depth one was formed on the surface side of the substrate with the same alignment. The TSV is then filled with heavily-doped poly-Si, which is simultaneously deposited in the process of Si2H6 gas-based vapor-liquid-solid (VLS) growth of Si-microneedles. The current-voltage characteristics of the fabricated TSV show a linear behavior with a resistance of 6 kΩ, confirming the feasibility of the proposed TSV.

  • 藤田 亮介, 江籠 徳行, 神田 健介, 藤田 孝之, 前中 一介
    2018 年 138 巻 12 号 p. 539-544
    発行日: 2018/12/01
    公開日: 2018/12/01
    ジャーナル フリー

    Blood pressure changes every second and cannot be continuously monitored by conventional cuff method. In order to solve this problem, we proposed a blood pressure estimation system by pulse transit time (PTT) method. The system includes two devices; a master device which monitors ECG for starting time of the pulse wave, and a slave device for monitoring the propagated pulse wave at the wrist. Both devices have some sensors, such as an accelerometer and barometer, for monitoring the condition of the body and wrist. The detected condition will be used for compensation of the PTT data. As a result, estimation of the blood pressure by PTT is accurate enough comparing to sphygmomanometer for home use. In addition, the relation between barometric pressure and PTT by hand position was measured and used for establishing the correction equations.

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