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Yuichi Ishida, Masahiro Ueyanagi, Junichi Ikeno
Session ID: I66
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Yasuhito Mukai, Hisamichi Yoshigoe, Satoru Takahashi, Kiyoshi Takamasu
Session ID: I67
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Yoshikazu Hirokari, Rie Tanabe, Yoshiro Ito, Yoshiko Abe, Eiichi Matsu ...
Session ID: I68
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Masaki Kurihaba, Takaaki Mori, Junichi Ikeno
Session ID: I69
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Hidekazu Yamamoto
Session ID: J06
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Quantitative evaluation on adhesion phenomenon
Yuichi Takano, Keisuke Suzuki, Khajornrungruang Panart, Keiichi Kimura
Session ID: J08
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Material removal mechanism of SiO2-CMP has been studied using SiO2 coated AFM stylus as a model experiment instead of fine particle attached to the SiO2 thin film. This method has some issues because AFM stylus did not absorb CMP phenomena. We evaluate the size of SiO2 fine particles before and after polishing, as result the size increased during CMP process because of the adhesion from SiO2 reactive layer.
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Takeshi Sakamoto, Takumi Inaki, Kazuaki Oda, Mutsumi Touge
Session ID: J09
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Fabrication of Micro Patterned Pad using Ni plated mold
Shintaro Isono, Keisuke Suzuki, Takahiro Ito, Panart Khajornrungruang, ...
Session ID: J13
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Selection of the laser beam incidence angle
Takashi Kushida, Keiichi Kimura, Panart Khajornrungruang, Keisuke Suzu ...
Session ID: J14
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Michio Uneda, Yuki Maeda, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ich ...
Session ID: J15
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Quantitative evaluation method of pad surface asperity is one of the most important technologies for the prediction of polishing characteristics. We have proposed a contact image analysis method using an image rotation prism, and we have demonstrated relationship between the pad surface asperity and polishing characteristics. However, these demonstrations were only the effect of each proposed four evaluation parameters on the removal rate. Hence, a proposition of an integrated index is necessary for prediction of high accurate polishing characteristics. This paper discusses the relationship between each evaluation parameters and the removal rate, and evaluates the effect of each evaluation parameters through the multiple correlation analysis method. It is clear that each evaluation parameters correlate closely with the removal rate. Moreover the result of multiple correlation analysis for each evaluation parameters can predict the removal rate precisely.
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Improvement of circular efficiency using a new groove pattern
Yosuke Hirai, Kenichiro Yoshitomi, Masaaki Mochida
Session ID: J16
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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1st Report: Reusable Method and Its Characteristics
Daisuke Suzuki, Tatsutoshi Suzuki, Eisuke Suzuki
Session ID: J18
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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The most of polishing pads in the CMP (Chemical Mechanical Polishing) process are disposed of industrial waste without being reprocessed after use. In order to reuse these old polishing pads, we have developed the auxiliary plate. The purpose of this paper is to evaluate this auxiliary plate adaptability on the polisher, and to demonstrate the impact of regenerated pad on the polishing performances. As a result, there are no statistically significant differences between the polishing pad with/ without the auxiliary plate. In addition, the regenerated pad does not affect the removal rate and the uniformity.
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Effect of Platen Surface Texture on Slurry Flow
Michio Uneda, Yuya Fukuta, Yasuaki Itou, Kazutoshi Hotta, Hiroyasu Sug ...
Session ID: J19
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Sapphire is one of the important compound materials for the light emitting diode, and it is required to improve the high throughput planarization because of realizing the processing cost reduction. In mechanical polishing, the slurry mixed free abrasive grains is supplied to the contact surface between the workpiece and the platen. The mechanical polishing characteristics are affected by the slurry flow in the contact surface between the workpiece and the platen. Hence most of previous studies on the slurry flow were focused only qualitative evaluation based on the observed image, but none of them were demonstrated the quantitative evaluation. In this study, we discuss the effect of the surface roughness and wettability of Cu platen for the polishing characteristics on the slurry flow. As a result, the following points were observed. (I) The slurry flow is affected by the slurry wettability and the surface roughness of the platen. (II) The slurry flow velocity is high in case of the high slurry wettability for the platen. (III) The inflow ratio in the contact surface and its region increase with an increase in the slurry velocity.
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Michio Uneda, Tatsunori Omote, Yuya Fukuta, Yasuaki Itou, Kazutoshi Ho ...
Session ID: J20
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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In CMP, the polishing variables affect the removal rate as shown in Preston′s equation. Furthermore, the characteristics of consumables (slurry, pad and conditioner) also affect the removal rate. Additionally, there is a need for high removal rate in sapphire-CMP. The objective of this study is to investigate the effect of the polishing variables on the removal rate in sapphire-CMP. This paper discusses following three experiments; (I) relationship between the mechanical polishing variables (polishing pressure, rotation speed of platen/ wafer) and the removal rate, (II) relationship between the slurry concentration and the removal rate, and (III) the effect of slurry dropping point on the removal rate. In experiment (III), we also observe the quantitative evaluation results of the slurry flow. As a result, the following points were observed. (1) The removal rate increase with increase in the polishing pressure and the rotational speed of platen/ wafer. (2) The removal rate reaches saturation with the increase of the slurry concentration. (3) The slurry dropping point affects the slurry flow between the wafer and the pad and the removal rate.
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Seiya Kawakita, Tenshin Yamashiro, Keiichi Kimura, Panart Khajornrungr ...
Session ID: J21
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Toshiro Doi, Tsutomu Yamazaki, Kiyoshi Seshimo, Daizo Ichikawa
Session ID: J23
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Tsutomu Yamazaki, Toshiro Doi, Kiyoshi Seshimo, Masanori Ohtsubo, Keii ...
Session ID: J24
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Kiyoshi Seshimo, Toshiro Doi, Tsutomu Yamazaki, Thi Ngoc Le Lien, Masa ...
Session ID: J25
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Shinichi Shikata, Hideaki Yamada, Nobuteru Tsubouchi, Yoshiaki Mokuno, ...
Session ID: J31
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Toshiro Doi, Yasuhisa Sano, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi ...
Session ID: J33
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Yasuhisa Sano, Toshiro Doi, Shuhei Kurokawa, Hideo Aida, Osamu Ohnishi ...
Session ID: J34
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Michio Uneda, Yoshihiro Takahashi, Yuki Maeda, Kazutaka Shibuya, Yoshi ...
Session ID: J36
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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In CMP, its characteristics are affected by the various mechanical and chemical factors. It is well known that the removal rate decreases with the increase of the polishing time. Therefore, many papers have described the relationship between the removal rate and the pad surface asperity. On the other hand, the vibration phenomena in the polishing apparatus are important information for estimating the polishing characteristics. This paper aims to demonstrate the effect of the vibration phenomena on the removal rate in Si-CMP. As a result, the following points were observed. (1) The vibration acceleration increases with the increase of the polishing time. (2) The pad deteriorates by the progress in the polishing so that the number of contact points decreases and the spacing of contact points increases. (3) The removal rate decreases with increase of the vibration acceleration.
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Masakazu Asaba, Norikazu Suzuki, Eiji Shamoto, Hozumi Yasuda, Satoru Y ...
Session ID: J37
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Cooling characteristics and application to polishing of a freezing pin chuck
Kenichiro Yoshitomi, Katsunori Takehana, Atsunobu Une, Masaaki Mochida
Session ID: J38
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Investigation of the Variable Rotation Polishing Efficiency
Pipat Phaisalpanumas, Keiichi Kimura, Keisuke Suzuki, Panart Khajornru ...
Session ID: J39
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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In this study, a novel Variable Rotation Polishing method would be proposed in order to increase the unsteady slurry flow in CMP process for increasing the polishing efficiency and for flowing slurry into the center of wafer sufficiently when the wafer becomes larger and also in case of saving the slurry. We developed a control unit to control platen variable rotation speed and rotation direction and rotation angle. This paper investigates the efficiency of variable rotation in CMP process. Consequently, material removals of all conditions in case of Variable Rotation Polishing were higher than only forward rotation.
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Takayuki Honma, Koichi Kawahara, Seiichi Suda
Session ID: J43
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Hideyo Togashi, Takahiro Maruyama, Tsutomu Sawano
Session ID: J44
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Tsutomu Sawano, Takahiro Maruyama, Yuu Moriwaki
Session ID: J45
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Quantitative evaluation of chemical action has been studied using polishing pressure vs removal rate curves of glass polishing. In this paper, we introduce a new evaluation method and its application for several abrasives including our new cerium-free abrasive. By this method assuming that the deviation from Preston′s equation is due to chemical action, we obtained the proportion of various abrasive′s chemical action. These data reveal that chemical action mainly determines the removal rate, but mechanical action does not so much in glass polishing. And they also show our abrasive has almost the same characteristics as CeO2.
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Miyo Muto, Kiyoshi Seshimo, Syuhei Kurokawa, Toshiro Doi, Yoji Umezaki ...
Session ID: J46
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Yutaka Honda, Toshiyuki Yasuhara, Hiroki Akasaka, Naoto Ohtake
Session ID: K01
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Unkai Sato, Hideki Kawakubo
Session ID: K02
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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This paper describes the elucidation about the removal of surface oxidation layer of copper iron alloy for lead frame after heating processing using Na2SO4-electrolyzed oxidizing water (It abbreviates as Na2SO4 EO water). First, the etching characteristics of Na2SO4 EO water against the surface of copper iron alloy for lead frame was clarified using H2SO4 solution and NaCl EO water for comparative immersion experiments. The results showed that as for the etching efficiency on copper iron alloy, Na2SO4 EO water was superior to H2SO4 solution, while inferior to NaCl EO water. Next, as for test pieces after heating processing, it did the surface oxidation layer removal experiment by the immersion. The results show that Na2SO4 EO water doesn't pollute the test pieces surface compared with NaCl EO water and it is possible to apply to the surface oxidation layer removal process.
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Koji Yoshimura, Hiroki Akasaka, Naoto Ohtake
Session ID: K03
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Diamond-like Carbon (DLC) is a semiconductor with high hardness, low friction coefficient, corrosion resistance etc., so it is applied to a variety of mechanical components. On the other hand, electrical resistance of DLC is as high as 107˜1014Ω·cm. For this reason, there are many researches to attempt to supersede SiO2 for DLC. In this research, we deposited DLC on glass substrates by plasma-CVD and FCVA (Filtered Cathodic Vacuum Arc) method, measured the electro resistivity by 2 electrode method, and evaluated thermal resistance using electric furnace tests. Effect of deposition method and deposition conditions on electrical and thermal properties of DLC films has been clarified.
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Tatsuya Nishio, Yuko Aono, Atsushi Hirata
Session ID: K04
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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This study focuses on the surface modification of SiC films by heat treatment using induction heating and laser irradiation. As the result of structural analysis, D band and G band appeared in Raman spectra of heat-treated SiC films, which did not appear in that of untreated SiC films, thus carbon layers were formed by heat treatment. The result of the nanoindentation hardness test indicated that the hardness of carbon layers was about 1.5 times as high as that of untreated SiC films. As the result of the friction test, the friction coefficient of heat-treated SiC films was lower than that of untreated SiC films, which indicated that carbon layers had self-lubrication and decreased the friction.
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Proposal and Verification of evaluation method by friction with rotation and pressure
Akihiro Hirayama, Kazuya Hamaguchi, Masatoshi Aritoshi, Masao Noma
Session ID: K06
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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A hard thin film is coated in the surface by the mechanical components to give wear resistance, an oxidation resistant characteristics in the use environment of the high temperature and the high draft. However, the metal finishing mechanical components sometimes causes an agglutination by the shape and the conditions. These day, various hard thin films have become to be used and at the physical properties value of the hardness at room temperature, the friction coefficient, the delamination critical-load, these characteristics can not be estimated the agglutination characteristic of the film and the processed mechanical components. This paper reports on the agglutination characteristic of the film by the appraisal cost applying a friction welding method.
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Takashi Miyauchi, Nobuyuki Moronuki
Session ID: K07
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Contact area between a rolling element and a raceway increases with the decrease in the elasticity of the raceway, which increases micro-slip in this area during rolling motion. This slip increases the rolling friction and sometimes causes macro-slip between the element and raceway when the elastic deformation is particularly large. It is important to make clear the occurrence of micro-slip for the improvement of linear motion bearing from the standpoint of damping adoption. It is also useful for the safety of shoe sole design. This study aims to model this mechanism using finite element method and its verification through experiments.
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Yumi Yoshida, Mai Takashima, Yoshinao Iwamoto, Makoto Matsuo, Hiroki A ...
Session ID: K08
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Masaki Inoue, Hiroki Akasaka, Naoto Ohtake
Session ID: K09
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Kohei Okamura, Keiji Yokoyama, Takahiro Yamada, Hiromasa Ohmi, Hiroaki ...
Session ID: K13
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Kosuke Yamada, Takahiro Yamada, Hiromasa Ohmi, Hiroaki Kakiuchi, Kiyos ...
Session ID: K14
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Kei Saito, Hiroaki Okuyama, Hiroki Akasaka, Naoto Ohtake
Session ID: K15
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Yutaro Suzuki, Tsuneo Suzuki, Naoto Ohtake, Hiroki Akasaka
Session ID: K16
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Drive of liquid crystal actuators by use of polyimide film irradiated by ion beam
Hiroyuki Fukui, Kazuki Maeda, Hiroki Katou, Yasushi Hashimoto, Sadao M ...
Session ID: K18
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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A polyimide film, which is exposed to ion beam, can orient liquid crystal. This process can reduce a static electricity and debris compared with the usual rubbing method, and we have shown that this method can be applied to a liquid-crystal actuator. In this report, we will show an influence of a fluence and an incident angle of ion beam on the driving speed of the actuator.
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Yoshihiro Adachi, Yasutomo Uetsuji, Kazuyoshi Tsuchiya
Session ID: K19
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Ryohei Ichijo, Hirofumi Hidai, Souta Matsusaka, Noboru Morita
Session ID: K20
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Wataru Shinohara, Yuko Aono, Atsushi Hirata, Hitoshi Tokura
Session ID: K21
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Miki Shimizu, Masanobu Funakoshi, Keisuke Yoshiki, Takahiro Namazu, Sh ...
Session ID: K23
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Zr based metallic glass alloy has promising mechanical properties for MEMS applications although it has received little attention as a micro-material. We have tried to prepare the sample libraries of ZrNiAl alloy film using the combinatorial sputtering method for studying the compositional dependence on their crystallization temperature, hardness and Young′s modulus. Further investigations of their glass transition behavior including a micro formability are underway.
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Rikiya Takita, Kazuyoshi Tsuchiya, Yasutomo Uetsuji
Session ID: K24
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Yoshifumi Suzaki, Kazufumi Makino, Kenzo Yamaguchi, Koichi Maru, Hirom ...
Session ID: K25
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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The Li-Ion battery carried in electric vehicles (EV) needs to monitor electric charge and discharge accurately in each cell, in order to increase actual operating capacity of the battery without changing its physical capacity. However, conventional electrical sensors have disadvantages; for example, they are sensitive to electromagnetic noise. Because fiber Bragg grating (FBG) is an optical fiber element with a narrow-band sharp-reflection spectrum, it is well-suited for applications that deal with narrow-band optical signals in their spectra, such as various types of fiber sensors. In this study, we attempted to develop an FBG current sensor.
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Hiroki Akasaka, Atsuyuki Takarada
Session ID: K26
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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Soichi Ibaraki
Session ID: K30
Published: February 27, 2013
Released on J-STAGE: August 27, 2013
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