The pre-yield micro-plastic deformation in α Cu-Al and Cu-Ni solid solution single crystals was studied at room temperature by means of the etch pit technique. The motion and multiplication of dislocations are detectable from shape and size of etch pits. Some of the specimens were deformed in tension at a strain rate of 4×10
−4 sec
−1, and others were deformed with a four-points bending jig under a stress pulse of 1 sec. The frictional stress against dislocation motion of two alloy systems are calculated from an equation for dislocation pile-ups with the measurement of etch pits arrays. The “10
−6 yield stress” was studied with a strain indicator which had a strain sensitivity of 2×10
−6, and compared with the result of the etch pit observation.
The results obtained are as follows:
(1) Dislocation motion is observed at a much lower stress than the yield stress, and the ratio of the number of moved dislocations to that of total grown-in dislocations decreases as the solute concentration increases.
(2) Dislocation multiplication stresses detected by etch pit observation in the bending test is higher than those in the tension test. The multiplication stress corresponds to the “10
−6 yield stress” which is detected by the strain indicator having a sensitivity of 2×10
−6.
(3) From the observation of etch pits, it would be assumed that the multiplication stress corresponded to the stress at which the moved dislocations cut through the forest dislocations.
(4) Frictional stress deduced from the pile-up dislocation arrays increases with solute concentration. For Cu-2.5 at%Al 0.060±0.030 kg/mm
2, for Cu-5.0 at%Al 0.085±0.025 kg/mm
2, for Cu-10 at%Al 0.20±0.04 kg/mm
2, for Cu-15 at%Al 0.28±0.08 kg/mm
2, for Cu-2.5 at%Ni 0.065±0.035 kg/mm
2, and for Cu-5 at% Ni 0.075±0.015 kg/mm
2 are obtained.
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