A basic investigation on atmosphere soldering have been carried out to study the wettabilities of liquid tin and activated tin alloys, containing a small amount of Li, Na and P, on copper-based alloys coated with uniform oxide film Cu
2O. The results obtained are as follows:
(1) The wettabilities of liquid tin on copper are affected by the interfacial tension, depending on the amout of copper dissolved in liquid tin; the wettabilitiy increased with the decrease of the interfacial tension, which should be smallest at 0.6%Cu content.
(2) The spreading tests of liquid tin and the activated tin alloys on the oxidized copper can successfully be carried out using a reaction furnace which keeps the oxygen partial pressure in its atmosphere above the decomposition pressure of Cu
2O to prevent the oxide films from decomposing.
(3) The spreading areas of liquid tin decrease owing to the presence of the oxide films. The spreading area on the oxidized copper plate with 600 Å Cu
2O film was approximately 50% of that on the pure copper at 340°C.
(4) On the oxidized copper plates, the rate of spreading depends on the reducing oxide films and so the activated tin alloys containing Li, Na and P as an additional element show better wettabilities, and the effect of P addition is especially remarkable.
(5) At low temperatures the activated tin alloys are superior in the spreading limit, where the contact angle of liquid is 90°, to pure tin. On the contrary, at high temperatures these alloys are rather inferior except P containing tin alloys.
(6) There is a little difference between the surface tension of liquid tin and that of activated tin alloys, and the surface tension decreases with increasing temperature in the form of dγ⁄d
T=−0.2 dyne/cm·deg.
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