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Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
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Volume 27 (2024)
Issue 2 Pages 175-
Issue 1 Pages 1-
Volume 26 (2023)
Issue 7 Pages 633-
Issue 6 Pages 525-
Issue 5 Pages 411-
Issue 4 Pages 315-
Issue 3 Pages 235-
Issue 2 Pages 183-
Issue 1 Pages 1-
Volume 25 (2022)
Issue 7 Pages 677-
Issue 6 Pages 513-
Issue 5 Pages 369-
Issue 4 Pages 277-
Issue 3 Pages 185-
Issue 2 Pages 151-
Issue 1 Pages 1-
Volume 24 (2021)
Issue 7 Pages 643-
Issue 6 Pages 483-
Issue 5 Pages 331-
Issue 4 Pages 287-
Issue 3 Pages 209-
Issue 2 Pages 167-
Issue 1 Pages 1-
Volume 23 (2020)
Issue 7 Pages 561-
Issue 6 Pages 445-
Issue 5 Pages 297-
Issue 4 Pages 253-
Issue 3 Pages 203-
Issue 2 Pages 123-
Issue 1 Pages 1-
Volume 22 (2019)
Issue 7 Pages 591-
Issue 6 Pages 469-
Issue 5 Pages 359-
Issue 4 Pages 255-
Issue 3 Pages 183-
Issue 2 Pages 139-
Issue 1 Pages 1-
Volume 21 (2018)
Issue 7 Pages 625-
Issue 6 Pages 473-
Issue 5 Pages 353-
Issue 4 Pages 263-
Issue 3 Pages 189-
Issue 2 Pages 107-
Issue 1 Pages 1-
Volume 20 (2017)
Issue 7 Pages 431-
Issue 6 Pages 371-
Issue 5 Pages 269-
Issue 4 Pages 161-
Issue 3 Pages 119-
Issue 2 Pages 97-
Issue 1 Pages 1-
Volume 19 (2016)
Issue 7 Pages 469-
Issue 6 Pages 367-
Issue 5 Pages 287-
Issue 4 Pages 211-
Issue 3 Pages 145-
Issue 2 Pages 85-
Issue 1 Pages 1-
Volume 18 (2015)
Issue 7 Pages 457-
Issue 6 Pages 383-
Issue 5 Pages 309-
Issue 4 Pages 197-
Issue 3 Pages 129-
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Issue 1 Pages 1-
Volume 17 (2014)
Issue 7 Pages 495-
Issue 6 Pages 449-
Issue 5 Pages 335-
Issue 4 Pages 251-
Issue 3 Pages 155-
Issue 2 Pages 89-
Issue 1 Pages 1-
Volume 16 (2013)
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Issue 6 Pages 421-
Issue 5 Pages 327-
Issue 4 Pages 245-
Issue 3 Pages 175-
Issue 2 Pages 85-
Issue 1 Pages 1-
Volume 15 (2012)
Issue 7 Pages 507-
Issue 6 Pages 419-
Issue 5 Pages 321-
Issue 4 Pages 223-
Issue 3 Pages 163-
Issue 2 Pages 125-
Issue 1 Pages 1-
Volume 14 (2011)
Issue 7 Pages 531-
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Issue 4 Pages 241-
Issue 3 Pages 160-
Issue 2 Pages 79-
Issue 1 Pages 1-
Volume 13 (2010)
Issue 7 Pages 483-
Issue 6 Pages 421-
Issue 5 Pages 317-
Issue 4 Pages 245-
Issue 3 Pages 167-
Issue 2 Pages 87-
Issue 1 Pages 1-
Volume 12 (2009)
Issue 7 Pages 565-
Issue 6 Pages 479-
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Issue 4 Pages 265-
Issue 3 Pages 169-
Issue 2 Pages 103-
Issue 1 Pages 1-
Volume 11 (2008)
Issue 7 Pages 484-
Issue 6 Pages 395-
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Issue 3 Pages 173-
Issue 2 Pages 115-
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Volume 10 (2007)
Issue 7 Pages 509-
Issue 6 Pages 441-
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Volume 9 (2006)
Issue 7 Pages 523-
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Issue 3 Pages 133-
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Volume 8 (2005)
Issue 7 Pages 535-
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Volume 7 (2004)
Issue 7 Pages 563-
Issue 6 Pages 477-
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Issue 4 Pages 288-
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Issue 2 Pages 105-
Issue 1 Pages 1-
Volume 6 (2003)
Issue 7 Pages 537-
Issue 6 Pages 449-
Issue 5 Pages 367-
Issue 4 Pages 280-
Issue 3 Pages 193-
Issue 2 Pages 117-
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Volume 5 (2002)
Issue 7 Pages 621-
Issue 6 Pages 517-
Issue 5 Pages 433-
Issue 4 Pages 317-
Issue 3 Pages 201-
Issue 2 Pages 115-
Issue 1 Pages 1-
Volume 4 (2001)
Issue 7 Pages 545-
Issue 6 Pages 447-
Issue 5 Pages 349-
Issue 4 Pages 255-
Issue 3 Pages 165-
Issue 2 Pages 97-
Issue 1 Pages 1-
Volume 3 (2000)
Issue 7 Pages 543-
Issue 6 Pages 459-
Issue 5 Pages 375-
Issue 4 Pages 283-
Issue 3 Pages 187-
Issue 2 Pages 93-
Issue 1 Pages 1-
Volume 2 (1999)
Issue 7 Pages 507-
Issue 6 Pages 425-
Issue 5 Pages 343-
Issue 4 Pages 258-
Issue 3 Pages 167-
Issue 2 Pages 80-
Issue 1 Pages 1-
Volume 1 (1998)
Issue 6 Pages 445-
Issue 5 Pages 345-
Issue 4 Pages 257-
Issue 3 Pages 175-
Issue 2 Pages 85-
Issue 1 Pages 16-
Predecessor
HYBRIDS
Circuit Technology
Journal of SHM
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Volume 10, Issue 5
Displaying 1-20 of 20 articles from this issue
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Recent Activities in Semiconductor Packaging Technology
Introduction to This Special Article
Kunihiko NISHI
2007 Volume 10 Issue 5 Pages 341-343
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.341
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(404K)
Looking at the Turning Point of Packaging Technology for Communication Systems
Kanji OTSUKA
2007 Volume 10 Issue 5 Pages 344-348
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.344
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(2833K)
The Trend of Mobile Electric Equipment
Hiroshi MANITA
2007 Volume 10 Issue 5 Pages 349-352
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.349
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(469K)
Roadmap on Packaging Technology
Ryo HARUTA
2007 Volume 10 Issue 5 Pages 353-357
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.353
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(741K)
Packaging Technology of Small Key Device for Mobile AV Equipment
Akihiko HAPPOYA, Makoto AOKI, Daigo SUZUKI
2007 Volume 10 Issue 5 Pages 358-362
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.358
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(6547K)
The Latest Technical Trend of SiP
Takashi AKAZAWA
2007 Volume 10 Issue 5 Pages 363-367
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.363
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(11647K)
Si Interposer SiP Technology
Shinji OHUCHI
2007 Volume 10 Issue 5 Pages 368-371
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.368
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(5925K)
High Reliability COF Package Technology for LCD TV
Kenji TOYOSAWA
2007 Volume 10 Issue 5 Pages 372-374
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.372
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(6073K)
High Density Flash Memory Packaging Technology
Shuzo AKEJIMA
2007 Volume 10 Issue 5 Pages 375-379
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.375
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(6007K)
Embedded Wafer Level Packaging Technology
Takeshi WAKABAYASHI
2007 Volume 10 Issue 5 Pages 380-385
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.380
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(7922K)
LSI Stacking Technologies Using with Trough Silicon Via
Masakazu ISHINO
2007 Volume 10 Issue 5 Pages 386-390
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.386
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(4368K)
COC (Chip on Chip) Technology
Hiroshi OZAKI, Takayuki EZAKI
2007 Volume 10 Issue 5 Pages 391-394
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.391
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(3331K)
Advanced High-Density Package “SMAFTI”
Masaya KAWANO
2007 Volume 10 Issue 5 Pages 395-398
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.395
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(6466K)
Development of Embedded Passive Substrate with Silicon Through Interconnection
Satoru KURAMOCHI, Yoshitaka FUKUOKA
2007 Volume 10 Issue 5 Pages 399-402
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.399
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(6552K)
Review a New Dual Face Packages and Its Inkjet Copper Wiring Technology
Masamichi ISHIHARA, Akira IZUMI
2007 Volume 10 Issue 5 Pages 403-407
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.403
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(9006K)
3D Integration and Cu Direct Bonding
Tadatomo SUGA
2007 Volume 10 Issue 5 Pages 408-414
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.408
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(3019K)
Newest Flip Chip Bonding Technology
Masataka MIZUKOSHI
2007 Volume 10 Issue 5 Pages 415-422
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.415
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(13092K)
Chip Thinning Technologies Realizing High Chip Strength
Shinya TAKYU, Tetsuya KUROSAWA, Noriko SHIMIZU, Susumu HARADA
2007 Volume 10 Issue 5 Pages 423-426
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.423
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(4696K)
Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis
Hideo MIURA
2007 Volume 10 Issue 5 Pages 427-432
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.427
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(5510K)
Electrical Design for SiP
Toshio SUDO
2007 Volume 10 Issue 5 Pages 433-438
Published: August 01, 2007
Released on J-STAGE: November 26, 2010
DOI
https://doi.org/10.5104/jiep.10.433
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(776K)
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