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Nobuo HARUKI
2006 Volume 9 Issue 5 Pages
326
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Toru YAMADA, Tetsuyoshi OGURA
2006 Volume 9 Issue 5 Pages
327-330
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Tomoyoshi SATO, Kosuke SHIBA, Noriyasu MATSUNO
2006 Volume 9 Issue 5 Pages
331-337
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Renshi SAWADA
2006 Volume 9 Issue 5 Pages
338-341
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Kazuya MASU, Kenichi OKADA, Hiroyuki ITO
2006 Volume 9 Issue 5 Pages
342-346
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Masaki TOSAKA, Toshiro SATO, Atsuki INOUE
2006 Volume 9 Issue 5 Pages
347-351
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Keitaro YAMAGISHI, Yasuhiro YAMANAKA, Seiichi SAITO
2006 Volume 9 Issue 5 Pages
352-357
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Shinichi SASAKI
2006 Volume 9 Issue 5 Pages
358-362
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Sadahiro TANI
2006 Volume 9 Issue 5 Pages
363-367
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Kenji ARAKI, Takayuki WATANABE, Hideki ASAI
2006 Volume 9 Issue 5 Pages
368-376
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Hideo KIKUCHI
2006 Volume 9 Issue 5 Pages
377-384
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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In this paper, we present studies of coupling noise between microstrip lines (MSL) on a printed circuit board (PCB) covered with a shield casing using electromagnetic simulation. The coupling ratio, S21s, from one MSL to the other had a peak at a resonance frequency of the electromagnetic field in the shield casing. An equivalent circuit was created and values of components in the equivalent circuit were extracted by matching the S21s derived from the simulation to those from the equivalent circuit. The peak of S21s due to the resonance became greater when the MSLs became wider and the PCB became thicker. The peak of S21s did not vary when the height of the shield casing changed, but the Q-factor of the resonance varied. In a perfect electrically conducting (PEC) shield casing, the peak of S21s became greater than that in a copper shield casing. When the tan δ of the PCB was 0 in the PEC shield casing, the peak of S21s became greater.
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Kumi AOKI, Takashi KOBAYASHI, Shinichi NUMATA, Hirotsugu KOBAYASHI, No ...
2006 Volume 9 Issue 5 Pages
385-390
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Nobuyoshi YAMAOKA
2006 Volume 9 Issue 5 Pages
391-394
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Ichiro HIRATA
2006 Volume 9 Issue 5 Pages
395-398
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Etsuji OHMURA
2006 Volume 9 Issue 5 Pages
399-404
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Kenji HIROHATA, Katsumi HISANO, Hiroyuki TAKAHASHI, Minoru MUKAI, Taka ...
2006 Volume 9 Issue 5 Pages
405-412
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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In order to evaluate the reliability of solder joints for thermal fatigue failure under field conditions, it is necessary to predict the thermal distribution, deformation, and stress distribution of the electronics packaging structure. In the packaging structure, which is composed of electronics packaging, solder joints, heat spreader, and cooling structure, an increase in contact thermal resistance may occur at the interface between plate fin and heat spreader, based on the thermal deformation of the electronics package. Contact thermal resistance problems involve the interaction of thermal distribution and deformation of the packaging structure. Therefore, an accurate analysis requires coupled thermal-stress analysis. In this work, a reliability design method based on coupled thermalstress analysis and statistical and probabilistic methods was investigated. It was found that the proposed method can assess packaging design solutions with respect to the failure probabilities from their application for the FC-BGA packaging structure design.
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Takeshi HOSOYA
2006 Volume 9 Issue 5 Pages
413-418
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Akinobu SHIBUYA, Shintaro YAMAMICHI
2006 Volume 9 Issue 5 Pages
419-422
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Yuji OTSUBO, Motoo MURATA, Kazunari KOGA
2006 Volume 9 Issue 5 Pages
423-427
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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Takao YAMAGUCHI
2006 Volume 9 Issue 5 Pages
428-430
Published: August 01, 2006
Released on J-STAGE: March 18, 2010
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