Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Search
Advanced search
OR
Browse
Search
Current issue
Displaying 1-17 of 17 articles from this issue
Show all abstracts
    • |<
    • <
    • 1
    • >
    • >|
Preface
Special Articles / Latest Trend of AI in Intelligent Electronics Packaging
Technical Paper
  • Predictive Maintenance for Plasma Cleaner by Using Plasma Monitor
    Hiroshi Shirouzu, Atsufumi Tanjo, Zhenxiong Weng, Koji Tamura, Kotaro ...
    Article type: Technical Paper
    2024 Volume 27 Issue 3 Pages 249-258
    Published: May 01, 2024
    Released on J-STAGE: May 01, 2024
    Advance online publication: January 30, 2024
    DOIhttps://doi.org/10.5104/jiep.JIEP-D-23-00019
    JOURNAL RESTRICTED ACCESS
    Show abstractHide abstract

    Plasma cleaners are used in the assembly process of semiconductors for the purpose of improving wire bondability and improving the adhesiveness of mold sealing resin.

    Plasma cleaners produce a less volatile reaction than semiconductor front-end processes in which wafers are plasma-processed, so polymer deposition in the chamber progresses faster. Dirt in this chamber will damage the workpiece being machined.

    On the other hand, from the viewpoint of preventive maintenance, it is necessary to perform maintenance according to the progress of polymer deposition in chamber, and since the degree of polymer deposition in the chamber was unknown, the timing of maintenance could not be estimated.

    Therefore, we report on a method for estimating the degree of polymer deposition in the chamber using a plasma monitor that measures changes in plasma impedance with an existing sensor required for machine operation.

    View full abstract
    Download PDF (1584K)
Report
Report
Announcement, Contents, etc.
    • |<
    • <
    • 1
    • >
    • >|
feedback
 Top