Journal of The Japan Institute of Electronics Packaging

Electronics Packaging Technology Trend for the 1999

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1999 Volume 2 Issue 1 Pages 1-23
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.1

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Investigation of Ionic Migration Processes by Quartz Crystal Microbalance—Influence of Salt and Inhibitor—

Shigetsugu NONAKA, Hideo TEZUKA, Makoto NAKAMURA, Kaichi TSURUTA, Sach ...

1999 Volume 2 Issue 1 Pages 24-28
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.24

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Ionic Migration reduces electronics reliability. There are many reports suggesting that the dissolving rate at the anode and deposition rate at the cathode influence the ionic migration time, when the short-circuiting occurs. Therefore, to analyze this ionic migration processes, in situ measurement of the electrode reaction of anode surface and cathode surface is indispensable. We have already reported that in situ measurement of the process of silver or copper migration in ion exchanged distilled water could be accomplished by applying a quartz crystal microbalance (here in after refered to as QCM) . In this report we observed these migration processes in various electrolytes involving inorganic ion and inhibitor via this QCM method.

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Ni-Solder (Pb/Sn) Selective Wet-Etching Method in Acidic Solutions

Yukio KIZAKI, Kazuhito HIGUCHI, Soichi HONMA, Hiroshi YAMADA

1999 Volume 2 Issue 1 Pages 29-34
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.29

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This paper describes a selective wet-etching method of Ni thin film under solder (Pb/Sn) bumps for electroplating cathode metals. The etching rate (V_M) of Pb and that of Sn were measured by the weight change of the metal sheet. The etching rate of Ni was measured by the change of the film thickness. The optimum ratio of HCl/HNO.sub.3/CH.sub.3 COOH was determined from the triangular coordinate of V_M and the selective etching ratio (γ), calculated from V_M. That ratio was CH.sub.3 COOH>HNO.sub.3>HCl and it realizes a selective etching ratio (γ) higher than 1 with minimum solder dissolution.

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CSP Technology and High Aspect Ratio Bumps

Keisuke FUKUI, Masayuki AYAMA, Katsuhiko HAYASHI, Taisuke YONEDA, Zenn ...

1999 Volume 2 Issue 1 Pages 35-39
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.35

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Metal posts and fine solder bumps are the indispensable micro-connectors for CSP packaging and are formed by electrodeposition into high aspect cavities. Lower edge of electrodeposited bumps become thicker as the increase of cathode placement angle for the cavity of aspect ratio of one. A 2.5 aspect ratio of 90° placement angle markedly thickens the lower edge of bump. The electrolyte consumes ion at the cathode and therefore introduces convection due to the difference in density. This convection flows outside of the cavity and forms a large eddy outside of the cavity. This large eddy flows into the cavity and collide with the lower edge of the bump. This collision causes closeness of neighbor isoconcentration contours and thickens the lower edge of bumps. It is difficult to stir inside of the high aspect ratio cavity. Convection due to the natural convection is a crucial factor to stir their insides.

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Fatigue Life Evaluation of Al-Base BGA Solder Ball Joints

Kouji ISHIKAWA, Qiang YU, Masaki SHIRATORI

1999 Volume 2 Issue 1 Pages 40-44
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.40

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Al-Base BGA shows large bending behavior under thermal cycling. Therefore, it is important to evaluate the fatigue life of Al-Base BGA solder ball joints. The thermal cycle tests were carried out to confirm the fatigue life of solder ball joints. In addition, the mechanical fatigue tests using three-point bending method were carried out and compared with the thermal fatigue tests. On the other hand, equivalent inelastic strain range was estimated by stress-strain analysis of finite element method. The equation of fatigue life evaluation of Al-Base BGA solder ball joints was determined using Coffin-Manson's law.

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Lithium Ion Batteries

Yuichi SATO

1999 Volume 2 Issue 1 Pages 45-50
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.45

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Direction of Lead-Free Soldering and Its Problems to Be Solved

Katsuaki SUGANUMA

1999 Volume 2 Issue 1 Pages 51-57
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.51

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Optical Surface Mount Technology Based on Opto-Electronic Printed Wiring Board

Osamu MIKAMI

1999 Volume 2 Issue 1 Pages 58-61
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.58

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[title in Japanese]

[in Japanese]

1999 Volume 2 Issue 1 Pages 63-64
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.63

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Report of JIEP Kansai Workshop '98

[in Japanese]

1999 Volume 2 Issue 1 Pages 65
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.65

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Report on IMAPS '98-31^st International Symposium on Microelectronics

[in Japanese]

1999 Volume 2 Issue 1 Pages 66-67
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.66

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IMAPS '98 Inspecting Party Reports

[in Japanese]

1999 Volume 2 Issue 1 Pages 68-69
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.68

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[title in Japanese]

[in Japanese]

1999 Volume 2 Issue 1 Pages Preface
Published: January 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.Preface

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