Journal of The Japan Institute of Electronics Packaging

Volume 26, Issue 2

Displaying 1-15 of 15 articles from this issue

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Preface

COVID-19 Accelerates DX & GX in JIEP Activities

Osamu Nakao

Article type: Preface
2023 Volume 26 Issue 2 Pages P2
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.P2

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Special Articles / Test for Mounting Board without Unreasonableness, Unevenness and Waste

Introduction to the Special Edition

Koji Uchiyama

Article type: Special Articles
2023 Volume 26 Issue 2 Pages 183
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.183

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Test Strategy for Mounting Board without Unreasonableness, Unevenness and Waste

Masazumi Taniguchi

Article type: Special Articles
2023 Volume 26 Issue 2 Pages 184-190
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.184

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AOI and AXI in the Inspection of Printed Circuit Board

Kenji Noguchi

Article type: Special Articles
2023 Volume 26 Issue 2 Pages 191-197
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.191

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Design for Testability Methods for Detecting Resistive Opens at Chip Interconnects

Hiroyuki Yotsuyanagi

Article type: Special Articles
2023 Volume 26 Issue 2 Pages 198-202
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.198

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Changing Board Assemblies, Unchanged Test Methods - Why is In-Circuit Test Still Important?

Hiroshi Yamazaki

Article type: Special Articles
2023 Volume 26 Issue 2 Pages 203-210
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.203

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Tutorial Series-3D Integration & Packaging Course / (3)-1

Organic Materials for 3DIC Package —Focusing on Organic Insulating Materials for RDL—

Toshihisa Nonaka

Article type: Tutorial Series
2023 Volume 26 Issue 2 Pages 211-219
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.211

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Tutorial Series-3D Integration & Packaging Course / (3)-2

Encapsulation Technology for Advanced Packaging: Underfills/Molding Compounds

Osamu Suzuki

Article type: Tutorial Series
2023 Volume 26 Issue 2 Pages 220-228
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.220

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Report

Department of Electronics, Faculty of Information Science and Electronics Engineering, Kyushu University

Ryo Takigawa

Article type: Report
2023 Volume 26 Issue 2 Pages 229
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.229

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Announcement, Contents, etc.

JIEP Mission Fellow

Article type: Announcement
2023 Volume 26 Issue 2 Pages 230
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.230

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News

Article type: Announcement
2023 Volume 26 Issue 2 Pages 232-234
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.232

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Announcement

Article type: Announcement
2023 Volume 26 Issue 2 Pages A21-
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.A21

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Contents

Article type: Announcement
2023 Volume 26 Issue 2 Pages C21
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C21

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Contents (in English)

Article type: Announcement
2023 Volume 26 Issue 2 Pages C22
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C22

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Instruction for Authors

Article type: Announcement
2023 Volume 26 Issue 2 Pages I21-
Published: March 01, 2023
Released on J-STAGE: March 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.I21

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