Journal of The Japan Institute of Electronics Packaging

Volume 25, Issue 5

Displaying 1-28 of 28 articles from this issue

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Preface

We Have a Chance to Recover after Long Stagnancy for 30 Years

Toru Ikeda

Article type: Preface
2022 Volume 25 Issue 5 Pages P5
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.P5

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Special Articles / Case Studies and Basic Technologies of System Design

(Title page)

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 369
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.369

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Introduction to the Special Edition

Yoshitaka Toyota

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 370
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.370

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System Design for Realizing IoT

IoT System Design (Basic)

Sakae Kajita

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 371-378
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.371

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Compact and Low-Power Open-Innovation Platform Leafony Accelerates Developments of IoT/CPS Applications

Takayasu Sakurai

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 379-388
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.379

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Artificial Magnetic Conductor Integrated Antenna for Fire Fighting Support System

Takahiko Yamamoto

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 389-393
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.389

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Antennas for IoT and AI Systems and Electromagnetic Biosafety

Fukuro Koshiji

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 394-398
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.394

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System Design for AI Implementation

An Application of AI Technologies to Surrogate Modeling for Simulators

Yoichi Shiraishi

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 399-403
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.399

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Hardware Implementation of a Brain Model on Wafer Scale Integration Technologies and Its Fault Tolerance

Moritoshi Yasunaga

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 404-410
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.404

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Proposal of the New Edge AI System

Yoichi Sato, Yutaka Akiyama, Kanji Otsuka

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 411-417
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.411

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Evolving System Design

Recent Trends in Electronics-Photonics Convergence Systems and Their Packaging Issues

Koichi Takemura

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 418-423
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.418

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Compact Thermal Model of The Microprocessor Package and Heat Transfer Path Identification for Computer Systems

Koji Nishi

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 424-430
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.424

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Challenges of Digital Twin Concept — Electrical Design Tool “6SigmaET”

Toshihiro Ikeda, Kei Miyano

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 431-438
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.431

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Common-Mode Emission Simulation of Communication System with Adjacent Metal Chassis Based on Imbalance Difference Model

Kengo Iokibe, Yoshitaka Toyota

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 439-445
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.439

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Design of Wireless Power Transfer System Using Magnetic Field Resonance Coupling

Hideo Kikuchi

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 446-451
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.446

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System Scaling on High Speed Signal Transmission

Kanji Otsuka, Kaoru Hashimoto, Yutaka Akiyama

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 452-458
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.452

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Tutorial Seminar Session

Introduction to Tutorial Seminar Session

Yoshitaka Toyota, Moritoshi Yasunaga

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 459-460
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.459

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Waveform and Spectrum Analysis for Board Design —Basics and Applications—

Yoshitaka Toyota, Shin Suminaga

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 461-471
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.461

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Design of Transmission Line in Printed Wiring Board —Way of Thinking about Characteristic Impedance, Reflection and Delay—

Kiyohisa Hasegawa, Toshihiko Makino

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 472-480
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.472

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Fundamental Points of Power Distribution Network Design on Printed Wiring Board —Target Impedance and PI Validation—

Tadashi Arai, Mutsumi Shimazaki, Jun-ichi Saito

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 481-487
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.481

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Board Design Environments and Simulation Technologies

Kiyohisa Hasegawa, Yasuki Torigoshi, Daisuke Oshima

Article type: Special Articles
2022 Volume 25 Issue 5 Pages 488-498
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.488

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Tutorial Series-Next Generation Packaging Technology of Power Electronic Devices Course / (8)

The Practice of Reliability Evaluation for Power Devices

Shinichi Yasaka, Kuniaki Takahashi

Article type: Tutorial Series
2022 Volume 25 Issue 5 Pages 499-505
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.499

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Tutorial Series-Next Generation Packaging Technology of Power Electronic Devices Course / (9)

Benchmark Evaluation of Thermal Performance of Next-Generation Power Modules Using Simulation Technology

Qiang Yu, Ryotaro Yoshikawa

Article type: Tutorial Series
2022 Volume 25 Issue 5 Pages 506-510
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.506

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Announcement, Contents, etc.

News

Article type: Announcement
2022 Volume 25 Issue 5 Pages 512
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.512

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Announcement

Article type: Announcement
2022 Volume 25 Issue 5 Pages A51-
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.A51

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Contents

Article type: Announcement
2022 Volume 25 Issue 5 Pages C51
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.C51

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Contents (in English)

Article type: Announcement
2022 Volume 25 Issue 5 Pages C52
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.C52

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Instruction for Authors

Article type: Announcement
2022 Volume 25 Issue 5 Pages I51-
Published: August 01, 2022
Released on J-STAGE: August 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.I51

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