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Yuzo SHIMADA
1999 Volume 2 Issue 2 Pages
80
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Toyotaro SHINKO
1999 Volume 2 Issue 2 Pages
81-83
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Yoshinobu TANAKA, Minoru ONODERA
1999 Volume 2 Issue 2 Pages
84-89
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Shin-ichiro ITOH
1999 Volume 2 Issue 2 Pages
90-94
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Motohide TAKEICHI
1999 Volume 2 Issue 2 Pages
95-98
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Kenzo TAKEMURA, Akira NAGAI, Itsuo WATANABE
1999 Volume 2 Issue 2 Pages
99-103
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Takashi SATOH, Akira ICHIMURA, Osamu MIKAMI, Teiji UCHIDA, Makoto HIKI ...
1999 Volume 2 Issue 2 Pages
105-111
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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As one of optical packaging schemes using optical wiring, a 45-degree total reflection mirror is used to couple between optical waveguides fabricated in the substrate and transmitter/receiver optical devices mounted on the substrate surface. In this paper, we studied reflection characteristics of polymeric waveguides with micro mirror having various mirror angles, and coupling characteristics between these waveguides and spot-size converted laser diodes (SS-LD), both theoretically and experimentally. The material of the fabricated waveguide core was deuterated poly-methylmethacrylate (d-PMMA) and the cladding was UV curable epoxy resin. The core dimension was 40μm×40μm, and the refractive index difference was 1.2%. Micro mirrors with angles of 39, 45, and 51 degrees were fabricated using new Vshaped diamond blades with different blade angles. It was shown theoretically and experimentally that a 45-degree mirror was most promising for both transmitter and receiver applications. The insertion loss between the waveguide and SS-LD mounted on the substrate (emitting wavelength of 1.3μm) was measured to be 1.8 dB.
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Hiroyuki NOGUCHI, Takeo NAKAGAWA
1999 Volume 2 Issue 2 Pages
112-115
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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In the aim to form a conductive power circuit which allows flow of current to a considerable extent by injection molding, attempts were made in this experiment to form the circuit of conductive plastic made by kneading metal fibers. It was however difficult to obtain conductive materials with both high conductivity and formability. Making use of the lower viscosity of molten metals, we investigated the required for forming thin wires of eutectic solder by 2-shot molding. The results showed that the factors which affect the fluidization length are the temperature of mold and that of the primary molded products groove, and indicated that the fluidity improves when the temperature is near the melting point of solder.
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Katsuaki SUGANUMA
1999 Volume 2 Issue 2 Pages
116-120
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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The mechanism of lift-off and the influence of various factors have been examined by using basic Sn- (2-5wt%) Bi alloys. The Sn-2wt%Bi alloy exhibits lift-off and the probability of occurrence increases with increasing Bi content. Lift-off occurs by the segregation of Bi, which diffuses a short distance, into the interfacial area between Sn-Bi alloys and a Cu land during formation of dendritic solidification. The occurrence of lift-off is also influenced by thickness of Cu leads in through-holes. Thicker wire makes severer lift-off. Lift-off is influenced by the height of solder fillet. Higher fillet makes severer lift-off and the up-side of printed boards, which has low fillets, seldom shows lift-off. Rapid cooling after soldering can stop lift-off effectively.
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Ikuo SHOHJI, Shinichi FUJIWARA, Shinya KIYONO, Toshio FUJII, Kojiro F. ...
1999 Volume 2 Issue 2 Pages
121-126
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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The growth kinetics of intermetallic compounds formed on the boundary between Au and In-Sn alloy solders were investigated with Au/Sn-27In and Au/Sn-20In diffusion couples. On annealing under the melting point of each solder, the Au-In intermetallic compound layers, such as AuIn
2, Au
7In
3 and AuIn, were firstly formed on the boundary. More continuous annealing caused the formation of Au-Sn intermetallic compound layers on the boundary and the Au
7In
3 and AuIn layers were disappeared at the same time. On the other hand, it was found the Au-Sn compound layers were already formed on the boundary by annealing for 60s at 523K, which temperature is over the melting point of both solders.
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Masahiko HIGASHI, Noriaki HAMADA, Hideto YONEKURA, Kouichi YAMAGUCHI, ...
1999 Volume 2 Issue 2 Pages
127-131
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Shinya TANAHASHI, Toshiro KUTSUWA, Ken-ichi KOBORI
1999 Volume 2 Issue 2 Pages
132-134
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Adder is the most basic functional module, and is widely used to multiplier, divider and others. Therefore high speed adder must be developed for the fast operation. Though various types of adders were proposed, quantitative evaluation has not been performed yet. In this paper, we give the quantitative evaluation for each adders by 4 terms of power consumption, area, gates, and delay time by using hardware description language. From the results, it is clear that the sign digit (SD) adder is better than the others.
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Tsumoru FUJII
1999 Volume 2 Issue 2 Pages
135-138
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Tsuguo YAMAOKA, Shigeru TAKAHARA
1999 Volume 2 Issue 2 Pages
139-146
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Osamu TAKEDA
1999 Volume 2 Issue 2 Pages
147-153
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Kosuke KATSURA, Takeo SHIMIZU, Shinji TSUJI, Yoshiaki NAKANO, Osamu MI ...
1999 Volume 2 Issue 2 Pages
154-156
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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Report of the 8th Microelectronics Symposium
[in Japanese]
1999 Volume 2 Issue 2 Pages
158-162
Published: March 01, 1999
Released on J-STAGE: March 18, 2010
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