Journal of The Japan Institute of Electronics Packaging

Volume 23, Issue 7

Displaying 1-18 of 18 articles from this issue

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Preface

Thinking about Branch/JIEP Activities during the COVID-19 Pandemic

Takeyasu Saito

Article type: Preface
2020 Volume 23 Issue 7 Pages P7
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.P7

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Special Articles / Progress and Prospect of Device Embedded Technology

Introduction to the Special Edition

Koji Ikawa

Article type: Special Articles
2020 Volume 23 Issue 7 Pages 561
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.561

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Packaging Technologies for HPC/AI Applications in New Intelligence Era

Hideyuki Nishida

Article type: Special Articles
2020 Volume 23 Issue 7 Pages 562-572
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.562

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Electrical Characteristic of Embedded Larger Capacity Decoupling Capacitors Interposer

Mitsuaki Toda, Ryouhei Tashiro

Article type: Special Articles
2020 Volume 23 Issue 7 Pages 573-577
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.573

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Device Embedding Technology for Flexible Printed Circuit

Osamu Nakao

Article type: Special Articles
2020 Volume 23 Issue 7 Pages 578-582
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.578

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Activities of IS (International Standards) for Device Embedded Substrate

Yoshihisa Katoh

Article type: Special Articles
2020 Volume 23 Issue 7 Pages 583-587
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.583

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Tutorial Series-Boundary-Scan Technology Course / (8)

Utilization to HALT of Boundary-Scan

Boundary-Scan Study Group

Article type: Tutorial Series
2020 Volume 23 Issue 7 Pages 588-592
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.588

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Report

Sensor, Electronics & Packaging engineering LAB., Department of Mechanical and Electrical Engineering, Faculty of Engineering, Suwa University of Science

Nobuaki Hashimoto

Article type: Report
2020 Volume 23 Issue 7 Pages 593
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.593

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Report

Session Summary of MES 2020

Article type: Report
2020 Volume 23 Issue 7 Pages 598-602
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.598

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Report of JIEP Mission Fellow Session at MES2020

Article type: Report
2020 Volume 23 Issue 7 Pages 603-604
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.603

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Announcement, Contents, etc.

[title in Japanese]

Article type: Announcement, Contents, etc.
2020 Volume 23 Issue 7 Pages 594
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.594

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[title in Japanese]

Article type: Special Articles
2020 Volume 23 Issue 7 Pages 595-597
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.595

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JIEP Mission Fellow

Article type: Announcement, Contents, etc.
2020 Volume 23 Issue 7 Pages 605
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.605

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News

Article type: Announcement
2020 Volume 23 Issue 7 Pages 606-608
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.606

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Announcement

Article type: Announcement
2020 Volume 23 Issue 7 Pages A71-
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.A71

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Contents

Article type: Announcement
2020 Volume 23 Issue 7 Pages C71
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.C71

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Contents (in English)

Article type: Announcement
2020 Volume 23 Issue 7 Pages C72
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.C73

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Instruction for Authors

Article type: Announcement
2020 Volume 23 Issue 7 Pages I71-
Published: November 01, 2020
Released on J-STAGE: November 01, 2020

DOIhttps://doi.org/10.5104/jiep.23.I71

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