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Noboru SCHIBUYA
1999 Volume 2 Issue 7 Pages
507
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Toshio SUDO, Atsushi NAKAMURA
1999 Volume 2 Issue 7 Pages
508-514
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Hiroaki KOGURE, Kohji KOSHIJI
1999 Volume 2 Issue 7 Pages
515-520
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Hiroyuki TOMINAGA, Mamoru SEKIGUCHI
1999 Volume 2 Issue 7 Pages
521-525
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Yuji TARUI, Takashi SAKUSABE, Takehiro TAKAHASHI, Noboru SCHIBUYA
1999 Volume 2 Issue 7 Pages
526-530
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Osamu UENO, Akihisa SAKURAI, Shigeo NARA
1999 Volume 2 Issue 7 Pages
531-534
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Tadashi TAKEMOTO, Tatsuya FUNAKI, Takaaki ANADA, Ryuji NINOMIYA, Akira ...
1999 Volume 2 Issue 7 Pages
535-540
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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The effect of lead addition on the improvement of wettability of Sn-3.5Ag lead-free solder has been investigated by the electrochemical reaction of soldering flux. Among the elements used in solder and copper base metal, tin in solder forms the most stable oxide film, therefore, the preferential dissolution of tin by electrochemical contact with copper base metal is beneficial both for removal of the oxide film and the enhancement of wettability. However, Sn-3.5Ag solder has similar electrode potential to copper base metal in soldering flux, therefore, the accelerated anodic dissolution of tin by contacting copper base metal is only a little. To enhance the wettability, the reduction of electrode potential of Sn-3.5Ag might be effective for the enhancement of preferential dissolution of solder by the contact with copper. Therefore the effect of lead addition of 2-10% has been investigated by electrochemical measurement in soldering flux. The addition of lead lowered the electrode potential of Sn-3.5Ag-0-10Pb solder which increased the potential difference between solder and copper base metal resulted in the increased contact current between them. The improved wettability is confirmed by adding lead to Sn-3.5Ag, all lead added solders showed larger spread area, i.e., smaller contact angle than Sn-3.5Ag after spreading test. The work proposed the electrochemical mechanism affecting on the wettability; the degree of contact corrosion current based on the potential difference between solder and base metal infuluences on wettability.
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Yukiharu OHNO, Keiichiro ITOH, Yoshio SHIMODA, Tsuyoshi HAYASHI, Sator ...
1999 Volume 2 Issue 7 Pages
541-545
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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This paper describes optical fiber boards, small laser-diode (LD) and photo-diode (PD) modules for high-speed optical-bus backboards. The optical fiber board consists of embedded optical fibers in a printed circuit board. We evaluated the effect of curvature on optical loss for the embedded fiber to obtain the optimum design condition. The increase of optical loss is negligible in the condition of over 20 mm radius. The LD/PD modules are composed of a fiber holder and a receptacle with a can-type LD/PD. These modules have suitable structure for attaching to the fiber board with a minimal spare length of fiber in a small space. We measured the bit error rate between the LD and PD modules at 1 Gb/s, and confirmed that bit error rate of 10
12 can be achieved with 16 channel bus boards.
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Shinichi SASAKI, Katsuhiko OKAZAKI
1999 Volume 2 Issue 7 Pages
546-551
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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We developed a programmable backplane unit that can reconnect lines between each pin of backplane connector. This backplane can connect 32 signal lines per circuit board to each board. As a result of transmission characteristic analysis, this backplane can be applied to high-speed interconnection (up to 200 MHz) between every circuit boards in this unit.
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Ryusuke KAWANO, Seishou YASUKAWA, Naoaki YAMANAKA
1999 Volume 2 Issue 7 Pages
552-555
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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We have developed very compact serial 10-Gb/s optical modules for 640-Gb/s WDM inter-unit interconnection for a Tb/s ATM switching system. The transceiver module contains a very compact laser unit with an EA modulator and a 16: 1 MUX which multiplexes sixteen 622-Mb/s parallel signals into one serial 10-Gb/s signal. The receiver module contains a 10-GHz PLL synchronizer, a 1: 16 DEMUX which demultiplexes a serial 10-Gb/s signal into sixteen 622-Mb/s signals and a word-synchronizer LSI for ATM-cell regeneration. These optical modules have a novel cooling structure. As a result, we have developed very compact optical transceiver and receiver modules, of equal size: 80×120×20mm.
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Katsuhiko OKAZAKI, Nobuaki SUGIURA, Akio HARADA, Tohru KISHIMOTO, Eiji ...
1999 Volume 2 Issue 7 Pages
556-560
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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One promising solution to the recent demands of today's communications-oriented society for a high-speed and large-capacity telecommunications network is an asynchronous transfer mode (ATM) switching system. Since multichip modules (MCMs) support high-density mounting and high-speed interconnection among LSIs, we have developed an 80-Gbit/s ATM switch MCM using an alumina substrate.
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Seiki SAKUYAMA
1999 Volume 2 Issue 7 Pages
561-565
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Fumio MIYAGAWA, Shoji KOIZUMI, Takayoshi HANABUSA
1999 Volume 2 Issue 7 Pages
566-570
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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Tadatomo SUGA
1999 Volume 2 Issue 7 Pages
571-575
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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[in Japanese]
1999 Volume 2 Issue 7 Pages
577-578
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
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[in Japanese]
1999 Volume 2 Issue 7 Pages
579
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
JOURNAL
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[in Japanese]
1999 Volume 2 Issue 7 Pages
580
Published: November 01, 1999
Released on J-STAGE: March 18, 2010
JOURNAL
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