In a previous study, the authors have shown that the debonding strength can be expressed as a constant value of the intensity of the singular stress field (ISSF). Previously, two models were considered in discussing the ISSF; one is a two-dimensional butt joint under plane strain and the other is a three-dimensional prismatic butt joint having sharp interface corners. In this study, by considering the real 3D geometry, the effect of fillet radius ρ at the specimen corner on the maximum ISSF is addressed. For fillet radius ρ/W ≥ 0.0005 (W = specimen width), the maximum ISSF is almost constant within the relative difference of 2%.

This paper proposes a new compact thermal model (CTM) for microprocessor packages based on a one-dimensional thermal network with average temperature nodes. Junction temperature prediction of a microprocessor system is conducted by utilizing the one-dimensional thermal network with the proposed new CTM. The results obtained by this method agree well with the results obtained by a three-dimensional heat conduction simulation.

To acquire knowledge about the accuracy and effectiveness of a simulation for high-speed signal communication, we prepared several boards, each with an FPGA which corresponds to 16 Gbit/s serial signal transmitting and receiving. We then measured their eye patterns and BERs, and compared the actual measurement results to the simulated ones. Regarding the eye patterns observed in a 50 Ω terminated environment with an oscilloscope, the simulations agree very well with the experiments. This shows that simulation is effective for selecting the material of the printed wiring board before the pattern design and the emphasis condition of the transmitting signal. On the other hand, for the FPGA reception BER, the simulation results tend to be better than the actual measurements, so it is necessary to consider this in simulation operation.