Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
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Volume 19, Issue 7
Displaying 1-15 of 15 articles from this issue
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Preface
Special Articles / State-of-the-Art Technology Relating to Automatization and Systematization of Sensory Evaluation and Prospects to IoT Era
Technical Paper
  • High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water
    Yasushi Umeda, Taro Nomura, Haruyo Nakagawa, Yuki Nakabayashi, Katsuhi ...
    2016Volume 19Issue 7 Pages 492-500
    Published: 2016
    Released on J-STAGE: February 28, 2017
    DOIhttps://doi.org/10.5104/jiep.19.492
    JOURNAL FREE ACCESS
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    A high-adhesion plating process for ABS resin was studied using a low concentration of ozone instead of using harmful hexavalent chromium. ABS resin can be modified by ultrafine, ozone-containing bubbles dispersed in water (<2 ppm). A high adhesion strength of approximately 1 kN/m was obtained when treated for 30 min. In contrast to the conventional etching processes containing hexavalent chromium, it is not necessary to apply a problematical wastewater treatment.
    Accordingly, this treatment could be used as a new sustainable technology in the near future.
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