Journal of The Japan Institute of Electronics Packaging

Volume 25, Issue 2

Displaying 1-15 of 15 articles from this issue

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Preface

Creation of New Value for JIEP Member

Hiroshi Nishikawa

Article type: Preface
2022 Volume 25 Issue 2 Pages P2
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.P2

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Special Articles / New Trends of Polymer Optical Waveguide Technologies for Co-Packaged Optics

Introduction to the Special Edition

Hideyuki Nasu

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 151
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.151

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Latest Trends of Polymer Waveguide Material for Co-Packaged Optics

Hideyuki Nawata

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 152-156
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.152

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Fabrication for Polymer Optical Waveguide and Its Application for Co-Packaged Optics

Takaaki Ishigure

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 157-161
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.157

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Co-Packaged Optics Using Polymer Waveguide

Takeru Amano, Satoshi Suda, Akihiro Noriki, Takayuki Kurosu, Yasuhiro ...

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 162-165
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.162

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Coupling Device by Self-Written Waveguide Technology for Optical Interconnection between Silicon Photonics Chip and Fiber

Chiemi Fujikawa, Osamu Mikami

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 166-171
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.166

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Self-Written Waveguide for Optical Connection between Silicon Photonics Chips and Standard Single-Mode Fibers

Yohei Saito, Kota Shikama, Norio Sato

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 172-176
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.172

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Tutorial Series-Next Generation Packaging Technology of Power Electronic Devices Course / (6)

Thermal Management of Power Modules

Tomoyuki Hatakeyama

Article type: Special Articles
2022 Volume 25 Issue 2 Pages 177-180
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.177

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Report

Hatakeyama Laboratory, Department of Mechanical Systems Engineering, Faculty of Engineering, Toyama Prefectural University

Tomoyuki Hatakeyama

Article type: Report
2022 Volume 25 Issue 2 Pages 181
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.181

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Announcement, Contents, etc.

JIEP Mission Fellow

Article type: Announcement
2022 Volume 25 Issue 2 Pages 182
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.182

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News

Article type: Announcement
2022 Volume 25 Issue 2 Pages 183-184
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.183

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Announcement

Article type: Announcement
2022 Volume 25 Issue 2 Pages A21-
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.A21

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Contents

Article type: Announcement
2022 Volume 25 Issue 2 Pages C21
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.C21

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Contents (in English)

Article type: Announcement
2022 Volume 25 Issue 2 Pages C22
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.C22

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Instruction for Authors

Article type: Announcement
2022 Volume 25 Issue 2 Pages I21-
Published: March 01, 2022
Released on J-STAGE: March 01, 2022

DOIhttps://doi.org/10.5104/jiep.25.I21

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