Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
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Volume 20, Issue 1
Displaying 1-28 of 28 articles from this issue
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Preface
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
Technical Report
  • Packaging Technology for All-SiC Module
    Hayato Nakano, Norihiro Nashida, Motohito Hori, Yoshinari Ikeda
    2017 Volume 20 Issue 1 Pages 86-89
    Published: 2017
    Released on J-STAGE: April 03, 2017
    DOIhttps://doi.org/10.5104/jiep.20.86
    JOURNAL FREE ACCESS
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    We used FEM to investigate an All-SiC module packaging technology which emphasizes low inductance, low thermal impedance and small size. Low inductance, low warpage and the molding process are demonstrated by parametric simulation so that high performance and highly reliable packaging are realized. As a result, we were able to apply the All-SiC module to a mega-solar PCS which achieved 98.8% efficiency.
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