Journal of The Japan Institute of Electronics Packaging

Volume 24, Issue 2

Displaying 1-14 of 14 articles from this issue

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Preface

Forecoming Shift in Electronics Packaging along with New Lifestyle against Current Worldwide Pandemics

Akitsu Shigetou

Article type: Preface
2021 Volume 24 Issue 2 Pages P2
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.P2

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Special Articles / Thermal Management of Electronics—Research Trends and Standard Development Activities—

Introduction to the Special Edition

Koji Nishi

Article type: Special Articles
2021 Volume 24 Issue 2 Pages 167
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.167

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Development for High Spatial Resolution Thermal Effusivity Measurement Method and High Functional Thermal Diffusivity Measurement Method

Kimihito Hatori

Article type: Special Articles
2021 Volume 24 Issue 2 Pages 168-173
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.168

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Prediction of Thermal Contact Resistance for Thermal Design of Electronics

Tomoyuki Hatakeyama, Risako Kibushi, Yoshiki Hyodo, Masaru Ishizuka

Article type: Special Articles
2021 Volume 24 Issue 2 Pages 174-177
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.174

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Vision of Cooling Design of Forced Convection for Near-Future Electronic Equipment

Takashi Fukue

Article type: Special Articles
2021 Volume 24 Issue 2 Pages 178-187
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.178

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Semiconductor Package Modeling at JEITA and Extension to IEC Standard

Koji Nishi, Yutaka Kumano, Takuya Shinoda, Ken Miyazaki

Article type: Special Articles
2021 Volume 24 Issue 2 Pages 188-192
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.188

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Trend of Standardization of Thermal Management Corresponding to Changes in Mounting and Heat Dissipation Path—2^nd Report—

Koichi Hirasawa, Takashi Fukue, Masahiro Uchida, Yoshinori Aruga, Yasu ...

Article type: Special Articles
2021 Volume 24 Issue 2 Pages 193-202
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.193

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Report

Functional Processing Laboratory, Department of Mechanical Engineering, Faculty of Engineering, Hokkaido University of Science

Katsumi Miyama

Article type: Report
2021 Volume 24 Issue 2 Pages 203
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.203

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Report

JIEP Workshop 30th anniversary project

[in Japanese]

Article type: Report
2021 Volume 24 Issue 2 Pages 205-206
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.205

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Announcement, Contents, etc.

JIEP Mission Fellow

Article type: Announcement
2021 Volume 24 Issue 2 Pages 204
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.204

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News

Article type: Announcement
2021 Volume 24 Issue 2 Pages 208
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.208

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Contents

Article type: Announcement
2021 Volume 24 Issue 2 Pages C21
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.C21

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Contents (in English)

Article type: Announcement
2021 Volume 24 Issue 2 Pages C22
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.C22

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Instruction for Authors

Article type: Announcement
2021 Volume 24 Issue 2 Pages I21-
Published: March 01, 2021
Released on J-STAGE: March 01, 2021

DOIhttps://doi.org/10.5104/jiep.24.I21

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