Journal of The Japan Institute of Electronics Packaging

Volume 27, Issue 4

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Preface

Solving Social Issues by Electronics Packaging

Akira Fujisaki

Article type: Preface
2024Volume 27Issue 4 Pages P4
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.P4

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2024 JIEP Award

2024 JIEP Award

Article type: 2024 JIEP Award
2024Volume 27Issue 4 Pages 273-281
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.273

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Special Articles / Expanding the Application of Boundary-Scan Technology

Introduction to the Special Edition

Shuichi Kameyama

Article type: Special Articles
2024Volume 27Issue 4 Pages 282
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.282

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Basic Technology of JTAG Boundary Scan Testing

Masazumi Taniguchi

Article type: Special Articles
2024Volume 27Issue 4 Pages 283-287
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.283

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Testing of Weak Open Defects in Interconnects Using Boundary Scan

Hiroyuki Yotsuyanagi, Masaki Hashizume

Article type: Special Articles
2024Volume 27Issue 4 Pages 288-293
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.288

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Digital-Twin System of Reliability Estimation Based on CAE and Boundary-Scan

Yu Maezawa

Article type: Special Articles
2024Volume 27Issue 4 Pages 294-299
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.294

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JTAG and Software Debugging

Yoshio Tanabe

Article type: Special Articles
2024Volume 27Issue 4 Pages 300-305
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.300

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Application of JTAG Boundary Scan to Embedded System Development

Ryuji Naitou

Article type: Special Articles
2024Volume 27Issue 4 Pages 306-314
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.306

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Examples of Boundary Scan Test Applications Implementation in Murata Machinery Ltd.’s Logistics Control Equipment

Masazumi Taniguchi

Article type: Special Articles
2024Volume 27Issue 4 Pages 315-318
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.315

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Boundary-Scan Technology for Chiplet Test

Shuichi Kameyama

Article type: Special Articles
2024Volume 27Issue 4 Pages 319-324
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.319

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Technical Survey

Fluid Actuators Using Surface Acoustic Waves and Their Applications

Tsunemasa Saiki, Yuichi Utsumi

Article type: Technical Survey
2024Volume 27Issue 4 Pages 325-333
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.325

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Report

Multi-Scale Solid Mechanics Laboratory, College of Engineering, Shibaura Institute of Technology

Yoshiharu Kariya

Article type: Report
2024Volume 27Issue 4 Pages 334
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.334

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Report

2024 International Conference on Electronics Packaging (ICEP)

Article type: Report
2024Volume 27Issue 4 Pages 362-369
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.362

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Announcement, Contents, etc.

JIEP Mission Fellow

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages 335
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.335

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The 13th Regular Meeting

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages 336-361
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.336

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News

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages 370-372
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.370

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Announcement

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages A41-
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.A41

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Contents

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages C41
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.C41

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Contents (in English)

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages C42
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.C42

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Instruction for Authors

Article type: Announcement, Contents, etc.
2024Volume 27Issue 4 Pages I41-
Published: July 01, 2024
Released on J-STAGE: July 01, 2024

DOIhttps://doi.org/10.5104/jiep.27.I41

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