In recent years, the technical advancement of semiconductor packages has driven a shift to larger die sizes and narrower bump pitches for high performance. The challenge is to develop both encapsulation materials and encapsulation processes suitable for such complicated semiconductor packages for higher performance.

In this study, we developed a Liquid Compression Mold Underfill (LCMUF) which can simultaneously fill and encapsulate the gap between an interposer and chips, as well as the peripheral parts of the chips, in a single step using compression molding equipment. Our LCMUF is well balanced between warpage reduction and high flowability thanks to the design optimization of resin and filler. As a result, we have been able to commercialize our LCMUF for mass production.

Materials procured locally help to minimize CO₂ emissions and improve efficiency by reducing the need for transportation. However, such materials may not meet the required performance and quality standards. In a globalized marketplace, companies need to balance these competing demands. One way to do this is through the use of technology to improve the reliability of automotive components. In order to improve the reliability of automotive components whose metal casings are sealed with silicone adhesives, high adhesion technology with water resistance is required to create high adhesion at the interface using silicone adhesives, regardless of the surface condition. Therefore, we evaluated the effect on shear strength of functional groups in a plasma Si-treated film applied to the metal surface of the silicone bonding surface. Our results show that a larger C-H/Si-O ratio in the Si amorphous film produces a higher adhesion technology that improves water resistance.